Development of high reliability fuse for space use

Similar documents
MeiLong Electronic Co.,Ltd. Lead Free Thin Film Chip Fuse. 1. Scope. 2. Construction. 3. Type Designation. Over Coat Conductor.

SPECIFICATION SHEET P700L CURRENT LIMITING FUSE SURFACE MOUNT MODEL

Multi-Layer Power Inductors (IP Series)

SM1206 Series. Overload Interrupt Time (Second) Nominal Rating - Note 2. Cold Resistance (Ohm) Note 1. Maximum I 2 T (Ampere 2 Second) Nominal Rating

Cold Resistance (Ohm) Note 1

S J

Thick Film Chip Fuse

Power Inductors (IP Series)

Temperature Coefficient of Resistance Temperature Coefficient of Resistance, Tracking Maximum Operating Voltage Insulation Resistance

SFI Electronics Technology

Content (RF Inductors) Multi-Layer High Frequency Inductors (IQ & HI Series) Cautions... 18

WW25W, WW20W, WW10W, WW12W, WW08W, WW06W

No. P-KAB-001 DATE PRODUCTS DATA SHEET MICRO FUSE. Type KAB. UL/cUL approved File No.E17021 RoHS COMPLIANT LEAD FREE

Automotive, Sulfur Resistant Lead (Pb)-Free Thick Film, Rectangular Chip Resistors

MCF3 DC86V11CT Inrush-withstand

Thin Film Chip Resistor (ARG Series)

SPECIFICATION SHEET P600L CURRENT LIMITING FUSE

WK25S WK20S WK10S WK12S WK08S WK06S. Thick Film Power Surge Chip Resistors. Size 2512, 2010, 1210, 1206, 0805, 0603

MCF3 25CT Inrush-withstand

Technical Information Solid State Relays. Glossary. Solid State Relays

High Power Low Ohm Chip Resistors. Size W, W, /2W

Lead-free glass Nickel plated brass Ceramic 100 ma 15 A. Tube: End-cap: Core: Solder: 200 A. Marking: 100 ma 8 A Over 8 A 20 A. Rated breaking current

Refer to CATALOG NUMBERS AND RATING. Fusing within 1 min if the current is 200% of rated current. K A B N A

Tube: End-cap: Core: Solder: Lead-free glass Nickel plated brass Ceramic Sn-1.5Cu. Pb87.5-Sn10-Ag2.5* ma less than 1 A.

ISTEK-C A 750V DC Contactor

WK25S WK20S WK10S WK12S WK08S WK06S. Thick Film Power Surge Chip Resistors AEC Q-200 Qualified Size 2512, 2010, 1210, 1206, 0805, 0603

Lead-free glass Nickel plated brass 62 ma 1.25 A Over 1.25 A 3 A Epoxy resin 62 ma less than 1 A. Tube: End-cap: Solder: Adhesive: Marking: 1 A 3 A

POWER CAPACITORS. Cylindrical capacitor standard duty

WW12W ±1%, ±5% Size W. Thick Film High Power Low Ohm Chip Resistors. Approval sheet

Refer to CATALOG NUMBERS AND RATING. Fusing within 1 min if the current is 200% of rated current. K A B N A

WK25S WK20S WK10S WK12S WK08S. Thick Film Power Surge Chip Resistors. Size 2512, 2010, 1210, 1206, 0805

High Power Chip Resistors Size W, W, /2W

Fuses Introductory Information

Technical Data Sheet Chip LED with Bi-Color(Multi-Color)

MMP - Metal Film MELF

Lead-free glass Nickel plated brass Ceramic Tin plated copper Sn-1.5Cu Pb87.5-Sn10.0-Ag2.5* SOC NSD9 D32V [rated current]

Multi-Layer Power Inductors (IP_L Series)

Thermal-cutoff, Fuse and Fuseholder Incorporated into a Simple Compact Device

CHIP FUSE; RECTANGULAR TYPE. RoHS COMPLIANCE ITEM Halogen and Antimony Free

Titre / Title HIGH RELIABILITY RF COAXIAL LOADS AND ATTENUATORS GENERIC SPECIFICATION

Specification YGHR411-H CUSTOMER SUPPLIER. Rev.01 December Document No. : SSC-QP (Rev.00)

CHIP FUSE; RECTANGULAR TYPE. RoHS COMPLIANCE ITEM Halogen and Antimony Free

Serial Attached SCSI (SAS) Connector

Copyright 2006 Penton Media, Inc., All rights reserved. Printing of this document is for personal use only. Reprints

1 7 ASC_WF06A_V01 NOV

SinglFuse SF-0603FPxxxF Series Features. SF-0603FPxxxF Series - Fast Acting Precision Surface Mount Fuses. Electrical Characteristics

SR20X, SR25X ±1%, ±5% Power chip resistors Size 2010, 2512

Data sheet FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE & ANTI-SULFURATION. AEC-Q200 qualified. RoHS COMPLIANCE ITEM Halogen and Antimony Free

Temperature Coefficient of Resistance, Tracking Maximum Operating Voltage

DATA SHEET CURRENT SENSOR - LOW TCR PT series 5%, 2%, 1% sizes 0402/0603/0805/1206/2010/2512

MODEL UC 14YFA. Hitachi. Power Tools TECHNICAL DATA AND SERVICE MANUAL CHARGER UC 14YFA SPECIFICATIONS AND PARTS ARE SUBJECT TO CHANGE FOR IMPROVEMENT

1 Alumina Substrate 5 External Electrode (Sn) 2 Bottom Electrode (Ag) 6 Resistor Layer (RuO 2 ) 3 Top Electrode (Ag/Pd) 7 Primary Overcoat (Glass)

WR18X(W), WR20X(W), WR25X(W) ±1%, ±5% Power chip resistors Size 1218,2010,2512

MICRO FUSE PRODUCTS DATA SHEET TYPE JHC. SIZE 7.3x5.8mm. MATSUO ELECTRIC Co., LTD. No. P-JHC-E006 DATE

Metal Film Fuse Resistors

Ceramic PTC Thermistor:

CHIP FUSE; RECTANGULAR TYPE. RoHS COMPLIANCE ITEM Halogen and Antimony Free

Platinum Temperature Sensors 1/16


Platinum-chip Temperature Sensors in SMD Design Type According to DIN EN 60751

Design number. RC filtering circuit for USB interface

Bridgelux V6 Array. Product Data Sheet DS40. BXRE-27x x x x0400

(RMG50) TO-220 Low-Profile Power Resistors. Token Electronics Industry Co., Ltd. Version: January 12, Web:

020: 2013 CEB SPECIFICATION MINIATURE CIRCUIT BREAKER (MCB)

WW25X, WW18X, WW12X, WW08X, WW06X ±1%, ±5% Thick Film Current Sensing Chip Resistors Size 2512, 1218, 1206, 0805, 0603 (Automotive)

SinglFuse SF-1206HIxxxM Series Features

UL Recognised Wirewound Resistors

FS5 Thermal Mass Flow Sensor For various gas flow applications

PVC1000 Series. Microsystems, Inc. Pirani Vacuum Sensors. PVC1000 Series. Description. Features. Applications. Absolute Maximum Ratings

New Circuit Protection Platforms. March 2011 APEC

WF25S WF20S WF12S ±5% 20% Power Surge Chip Resistors Size 2512, 2010, Customer : Approval No : Issue Date : Customer Approval :

Enhanced Breakdown Voltage for All-SiC Modules

HIGH SPEED MEZZANINE PRODUCT SPECIFICATION

Thick Film Low Ohm Chip Resistors

Automotive/Transportation Heavy-Duty Transportation

0.003 SF-0603S075M DC 63 V DC 63 V SF-0603S100M A SF-0603S150M SF-0603S200M

WF08P, WF06P. High Power Chip Resistors Size /4W ; /8W. Customer : Approval No : Issue Date : Customer Approval :

Automotive Technology

NTC Thermistor for Automotive: TSM-C Series

HIGH VOLTAGE SURGE ARRESTER SPECIFICATION

CITILED CL-L270 lighting LED Datasheet

PFE700SA Series Instruction Manual

SCHURTER Fuses for Space Circuit Protection Solutions for future space applications

WF12SR360JTL. Size Surge 5% chip resistors. Customer : Approval No : Issue Date : Customer Approval :

Accu-P. Thin-Film Technology THE IDEAL CAPACITOR THIN-FILM TECHNOLOGY

Module 4: Climate Control

Wire Wound Chip Inductor-WB Series

Michigan State University Construction Standards SECONDARY UNIT SUBSTATIONS PAGE

Fast Acting Fuse SMD Thin Film

THIN FILM FUSE LINK. R D Harrison*, I Harrisont, A F Howet.

WW25N ±1%, ±5%, 2W Ultra low ohm power chip resistors Size 2512 (6432)

Fusing Equipment. Kearney Fuse Links. general. Internal Construction. tin element

Cooling concepts for CanPAK TM * package

Evolving Bump Chip Carrier

SMD B 15-22/R6G6C-A32/2T

Anti-Surge Thick Film Chip Resistors

Realization of a New Concept for Power Chip Embedding

17-223/R6G6C-D30/3C SMD B

UNIT 8 OTHER SENSORS

SF-0603SP150M SF-0603SP200M SF-0603SP250M

Transcription:

The26th Microelectronics Workshop 1 Development of high reliability fuse for space use TATEYAMA KAGAKU DEVICE TECHNOLOGY CO.,LTD http://www.tateyama.jp/

CONTENTS 2 1. Background 2. Development of SMD Fuse 3. Function of fuse 3.1 Common function 3.2 Necessary function for space use 3.2.1 Resistance to vibration and shock 3.2.2 Performance in vacuum environment 4. Feature of TATEYAM s Fuse 5. Assurance of pre-arcing time characteristic 6. Roadmap

1. Background 3 About TATEYAMA History ( Space component business ) Chip Resistor 1994 : Started producing and supplying chip resistors for Space use 2007 : Chip Resistor acquired JAXA qualification 2010 : Chip Thermistor acquired JAXA qualification Chip Thermistor 2011 : Leaded Fuse acquired JAXA qualification Proceeding development for Space component business as a core technology, Thick Film Printing Technology Leaded Fuse

1. Background 4 In 2011, TATEYAMA acquired JAXA qualification and started selling Leaded Fuse for Space use. Space set makers are changing electric parts from leaded type to SMD type as a purpose of lighter weight and lower cost. According to a request of SMD type fuse by users, we started developing.

2. Development of SMD Fuse 5 Specification Rating Voltage ( V ) Rating Current ( A ) Resistance Max (m ohm) Pre-arcing time ( m sec ) 250% 400% 600% Operating Temperature Maximum breaking capacity [DC] Style 72 1.0 220 72 1.5 114 72 2.0 72.0 72 3.0 36.0 J1 72 5.0 22.0 72 7.5 11.0 72 10.0 9.50 5.00 ~ 500 0.50 ~ 15.0 0.075 ~ 3.00-55 ~ +125 1,000A 72 15.0 7.50 126 1.0 270 126 3.0 76.0 J2 126 5.0 28.0

2. Development of SMD Fuse Specification 6 Style and Dimension Style Dimension ( mm ) A B C D E F J1 8.4 5.0 3.0 2.4 2.0 4.6 J2 12.0 8.0 3.4 5.2 2.4 5.0

2. Development of SMD Fuse Specification 7 Construction 5. Protective coating 1. Molded resin 2. Substrate 3. Lead adhesive 4. Lead terminal 6. Upper-glass 7. Fuse-element 8. Lower-glass 2. Substrate 9. Electrode pad Special Feature Upper-glass layer on fuse-element and solid

2. Development of SMD Fuse 8 One of the design target : Light-weight Voltage ( V ) Rating Leaded Fuse SMD Fuse ( new ) Current ( A ) 72 1.0 1.5 2.0 3.0 5.0 7.5 10.0 15.0 126 1.0 3.0 5.0 Style Weight ( mg ) J 1 0.47 J 2 2.15 Style Weight ( mg ) J 1 0.30 J 2 0.83 1. 2. 3. 4. 1. Leaded Fuse style J1 2. Leaded Fuse style J2 3. SMD Fuse style J1 4. SMD Fuse style J2 72V-10A : Change style from J2 to J1 Style J1 : Weight cut-down / 36% Style J2 : Weight cut-down / 61%

2. Development of SMD Fuse 9 New design for SMD Fuse Used design of parallel-elements for Light-weight. Achieved downsizing(72v-10a) and low-height by reducing the arc-energy. Single-element Parallel-elements ( 5P ) Test condition ( short circuit ) Sample: 72V-7.5A Voltage: 72V (rating voltage) Current : 1,000A(3.25 10 6 A/s) Arcing I 2 t : 0.33 (A 2 s) Arcing I 2 t : 0.11 (A 2 s) 200A 170A 72V 72V 100μs 42μs

3. Function of fuse 10 3.1 Common function Application condition with fuses mounted In Normality In Abnormality Fuse operation Shall not be open circuit Shall be open circuit and not be reconnected 3.2 Necessary function for space use Resistance to vibration and shock Performance in vacuum environment

3.2 Necessary function for space use 11 3.2.1 Resistance to vibration and shock Necessary to have resistance to vibration and shock caused by launch of locket Construction of fuse and Resistance to vibration and shock Construction Cavity-style Solid-style Resistance to vibration and shock Weak Passable High

3.2 Necessary function for space use 12 3.2.2 Performance in vacuum environment Fuse shall show same performance in both vacuum and non-vacuum environment (Non-influence by atmospheric pressure) Effect of vacuum environment a) Change of pre-arcing time by reduction of heat radiation b) Open circuit by reduction of vapor pressure

3.2.2 Performance in vacuum environment 13 Effect of vacuum environment a) Change of pre-arcing time Balance between self-heating and heat radiation Joule heat by current Heat radiation Get to thermal balance Keep current-carrying Joule heat by current > Heat radiation Temperature rise Lead to fusion (open)

3.2.2 Performance in vacuum environment 14 Effect of vacuum environment a) Change of pre-arcing time Heat radiation From surface of fuse-element = + From fuse-element to electrode In case that fuse-element is exposed to the air, radiation from surface of fuse-element decrease or is lost in vacuum environment. Change of pre-arcing time ( become shorter )

3.2.2 Performance in vacuum environment 15 Effect of vacuum environment b) Open circuit by reduction of vapor pressure Vapor pressure curve

3.2.2 Performance in vacuum environment 16 Effect of vacuum environment b) Open circuit by reduction of vapor pressure In case that fuse-element is exposed in the air, fuse-element is sublimated to the gas and open in vacuum environment Photo: Fuse-element after 80% load current In vacuum, exposed fuse-element was opened at 5 minutes Necessary construction for space use: Non-exposing construction of the fuse-elements

4. Feature of TATEYAMA s Fuse 17 Upper-glass layer Function of upper-glass layer Heat radiation from surface of fuse-element by heat conduction Safely shutting current down Absorbing shock made by arc at clearing action Electric insulation after firing Getting electric insulation caused by compound made by clearing action Mechanism of clearing action Self-heating by overload current Fuse-element melts and changes to gas Gas diffuses into upper-glass Upper-glass melted by heat and make compound Made compound shows electric insulation Upper-glass Compound Fuse-element

5. Assurance of pre-arcing time characteristic 18 Quality conformance inspection Group A ( JAXA-QTS-2210 ) Group Examination or Test Number of units ( /Lot ) A1 X-ray inspection ALL A2 Thermal shock ( 5 cycle ) Burn-in ( 168h ) Resistance ALL A3 Externals, dimensions and marking AQL 1.0% A4 Current-carrying capacity Dielectric strength Overload interrupt Insulation resistance A5 Terminal strength 4 A6 Solderability 4 A7 DPA 3 21

Applied current 5. Assurance of pre-arcing time characteristic 19 Sorting pre-arcing time process ( in-process inspection ) Measurement 1 ; Resistance value which is free from the influence of self-heating Measurement 2 ; Resistance value at the time of temperature rise by self-heating Making a prediction of pre-arcing time by change of resistance value ( alternative parameter ) Measurement 2 Measurement 1 time

Pre-arcing time ( m sec ) Pre-arcing time ( m sec ) 5. Assurance of pre-arcing time characteristic 20 Pre-arcing time at 250% rated current 1000 1000 100 100 10 10 1 13.0 13.5 14.0 14.5 15.0 Resistance value ( m ohm ) 1 7.0% 7.5% 8.0% 8.5% 9.0% 9.5% Alternative-parameter

Pre-arcing time ( m sec ) 5. Assurance of pre-arcing time characteristic 21 Verification of parallel-elements by Alternativeparameter Clearing Time after Life Test ( at 250% rated current ) 1000 100 Element dimension (width) : standard (100%) 6P : 100% 5P+85% : 100% 5P+115% 〇 : 100% 4P+85%+115% : 100% 4P+75%+125% Green: No Life Test Red : After 1,000 hours Blue : After 2,000 hours 10 1 7.0% 7.2% 7.4% 7.6% 7.8% 8.0% 8.2% 8.4% 8.6% Alternative-parameter

6. Roadmap 22 EV More High-power More Small, Lightweight

23 JAXA qualified parts of TATEYAMA

Leaded Fuse On EPPL 24 Construction & Feature Rating 1. Molded resin 2. Substrate Rating Pre-arcing time [25 ] (ms) 3. Lead adhesive 4. Lead terminal Part Number Voltage (V) Current (A) 250% 400% 600% Style JAXA2210/101-A72V1AL 1.0 JAXA2210/101-A72V1.5AL 1.5 5. Protective coating 6. Upper-glass JAXA2210/101-A72V2AL 2.0 JAXA2210/101-A72V3AL 3.0 72 JAXA2210/101-A72V5AL 5.0 JAXA2210/101-A72V7.5AL 7.5 10.0 1.00 0.15 ~ 300 ~ 15.0 ~ 3.00 J1 7. Fuse-element 8. Lower-glass 2. Substrate 9. Electrode pad Superior resistance to vibration and shock Keep the same performance in both vacuum and non-vacuum environment JAXA2210/101-A72V10AL 10.0 JAXA2210/101-A72V15AL 15.0 JAXA2210/101-A126V1AL 1.0 JAXA2210/101-A126V3AL 126 3.0 JAXA2210/101-A126V5AL 5.0 10.0 0.75 0.10 ~300 ~15.0 ~3.00 J2 J2 Dimension Style Dimension [mm] A B C D E F J1 7.0 5.4 3.5 40 4.0 0.60 J2 9.0 9.3 5.0 57 5.0 1.20 A B D F C E

Thick Film Chip Resistor 25 Construction & Feature Rating Type Designation Dimension

NTC Chip Thermistor On EPPL 26 Construction & Feature Rating Type Designation Dimension

27 Thank you very much!