Q (quad) Package type descriptive code LQFP100. LQFP (low profile quad flat package) Package body material type. P (plastic) IEC package outline code

Transcription

1 , plastic low profile quad flat package; 100 leads; 0.5 mm pitch, 14 mm x 14 mm x 1.4 mm body 1 February 2019 Package information 1 Package summary Terminal position code Q (quad) Package type descriptive code Package type industry code Package style descriptive code LQFP (low profile quad flat package) Package body material type P (plastic) IEC package outline code 136E20 JEDEC package outline code MS-026 Mounting method type S (surface mount) Issue date Manufacturer package code 98S01402D Table 1. Package summary Parameter Min Nom Max Unit package length mm package width mm seated height mm package height mm nominal pitch mm actual quantity of termination

2 , plastic low profile quad flat package; 100 leads; 0.5 mm pitch, 14 mm x 14 mm x 1.4 mm body 2 Package outline : plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm y c X Z E e E HE 2 1 ( ) 3 b p w M L p θ pin 1 index L detail X e b p w M Z D v M D B H D v M B mm scale DIMENSIONS (mm are the original dimensions) UNIT max. mm b p c D (1) E (1) e H H E L L p v w y (1) Z (1) D ZD E θ o 7 o 0 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEIT 136E20 MS-026 EUROPEN PROJECTION ISSUE DTE Figure 1. Package outline () ll information provided in this document is subject to legal disclaimers. NXP B.V ll rights reserved. 2 / 5

3 , plastic low profile quad flat package; 100 leads; 0.5 mm pitch, 14 mm x 14 mm x 1.4 mm body 3 Soldering Footprint information for reflow soldering of package Hx Gx P2 P1 (0.125) Hy Gy By y C D2 (8 ) D1 Bx x Generic footprint pattern Refer to the package outline drawing for actual layout solder land occupied area DIMENSIONS in mm P1 P2 x y Bx By C D1 D2 Gx Gy Hx Hy sot407-1 Figure 2. Reflow soldering footprint for () ll information provided in this document is subject to legal disclaimers. NXP B.V ll rights reserved. 3 / 5

4 , plastic low profile quad flat package; 100 leads; 0.5 mm pitch, 14 mm x 14 mm x 1.4 mm body 4 Legal information Disclaimers Limited warranty and liability Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. takes no responsibility for the content in this document if provided by an information source outside of. In no event shall be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of. Right to make changes reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. ll information provided in this document is subject to legal disclaimers. NXP B.V ll rights reserved. 4 / 5

5 , plastic low profile quad flat package; 100 leads; 0.5 mm pitch, 14 mm x 14 mm x 1.4 mm body Contents 1 Package summary Package outline Soldering Legal information...4 NXP B.V ll rights reserved. For more information, please visit: For sales office addresses, please send an to: salesaddresses@nxp.com Date of release: 1 February 2019