SensArray WAFER LEVEL METROLOGY. Product Line Overview

Transcription

1 SensArray Product Line Overview

2 Lithography ( C) PEB ARC Spin On Operation Range AT A GLANCE 5 Integrated Wafer ScannerTemp 35XP Accuracy Sensor-to-Sensor Sensor Type Sensor Quantity Power Source Special Notes ± C < C Number or.5.3 RTD 1-3 Polyimide coated copper leads RTD 1-3 High temp flat cable 53,65 Low Profile.5C.3 C 65 <6um local flatness 1.6 RTD 21 Time limited elevated temperature missions SPECIFATIONS 5 Integrated Wafer ScannerTemp 35XP Measurand Sampling f(max) Operating Range Substrate Material Wafer Sizes Upper Coating Cleanability Power System Hz mm Polyimide Dual replaceable batteries Si Dual fixed batteries Communications Thickness Recharge Time Recording Time Storage FOUP Warranty Use Life Calibration Life mm above Months/Cycles/Hours Months, IR or pins < <. 6 mo/ hrs hrs USB 5±9 15 Shipping/ Charging Case BaseStation cyc/hrs hrs

3 Plasma Etch ( C) Poly Diel/ DT Operation Range AT A GLANCE EtchTemp EtchTemp SE i3 Accuracy Sensor-to-Sensor Sensor Type Sensor Quantity Power Source Special notes ± C < C Number.2 65 Oxide Etch -7KW Totally sealed.2 65 Si Etch -7KW Totally sealed 53 - KW Totally sealed SPECIFATIONS EtchTemp EtchTemp SE i3 Measurand Sampling f(max) Operating Range Substrate Material Wafer Sizes Upper Coating Cleanability Power System Hz mm Dual fixed battery Coated Dual fixed battery Automated Dual fixed batteries Communications Thickness Recharge Time Recording Time Storage FOUP Warranty Use Life Calibration Life mm above Months/Hours Months 6 mo/ hrs hrs 6 mo/ hrs hrs Shipping/ Charging Case 6 mo/ hrs hrs

4 Thin Films and Thermal Processes ( C) RTP EPI Ox Diff HDP CVD PE CVD SA CVD PVD ECP Seed CVD ARC ALD Operation Range AT A GLANCE i3 35XP Accuracy Sensor-to-Sensor Sensor Type Sensor Quantity Power Source Special Notes ± C < C Number 1.1 or.%(ht).2 TC - Type K 1-3 Application specific lead insulation 1.5 or %(HT) TC - Type R or S 1-3 Application specific lead insulation 1.1 or.%(ht) TC - Type K 1,3,5,,9 Inconel Sheath 53 - hardened Totally sealed comm 1.6 RTD 21 Time limited elevated temperature missions SPECIFATIONS i3 35XP Measurand Sampling f(max) Operating Range Substrate Material Wafer Sizes Upper Coating Cleanability Power System Hz mm Dual fixed batteries Communications Thickness Recharge Time Recording Time Storage mm above Shipping/ Charging Case USB 5±9 15 Shipping/ Charging Case FOUP Warranty Use Life Calibration Life Months/Cycles/Hours Months 6 mo/hrs hrs mo BaseStation cyc/hrs hrs mo

5 Wet Process, Implant, Probe ( C) Wet Probe Plasma Implant Operation Range AT A GLANCE WetTemp-LP WetPro i3 Implant i3 173 Accuracy Sensor-to-Sensor Sensor Type Sensor Quantity Power Source Special Notes ± C < C Number 65 cover low profile sealed 53,65 cover sealed 53,65 Hardened cover sealed 1.1 or.% TC - Type K 1-3 Special sensor mounting for low temp SPECIFATIONS WetTemp-LP WetPro i3 Implant i3 173 Measurand Sampling f(max) Operating Range Substrate Material Wafer Sizes Upper Coating Cleanability Power System Communications Thickness Recharge Time Recording Time Storage Hz mm mm above Dual fixed batteries Shipping/Charging Case Dual fixed batteries / Dual fixed batteries / <2 Continuous FOUP / / Combo Station Warranty Use Life Calibration Life Months/Cycles Months 6 mo/ hrs hrs 6 mo 6 mo/ hrs hrs mo 6 mo/ hrs hrs mo

6 System Architecture w/thermal Map 3 For high temperatures or subzero temperatures, self-contained, battery-powered systems are not yet available. They cannot function or become damaged in those environments. architectures allow the electronics to be remote from the harsh process environment, but are not as easy to deploy, particularly in vacuum sealed environments. Modern systems include a small, near-wafer module (the ) which can read the signals from the wafer sensors and transmit them to the handheld (Thermal Track) or laptop (Thermal Map 3) systems for analysis and viewing. 163 w/ Thermal Track optional wire 173 5

7 System Architecture Wireless Integrated Wafer Visual Indicators Contact Carrier With the introduction of LithoSuite for lithography applications, and PlasmaSuite for plasma applications, and ThermalSuite for high-temp applications, our wireless software systems have evolved to create a common user interface between our module and non-module wafer products. i3 Carrier Base Station Litho System Litho View TrackTune AutoCal LithoSuite Scanner Temp Base Station Z EtchTemp Plasma View EtchTemp SE 35XP Base Station Z Plasma System Plasma Control Multi Mission Analysis ESC Zone Analysis PlasmaSuite Base Station Thermal System Multi Mission Analysis Advanced Analysis Modules ThermalSuite

8 KLA-TENCOR SERVE and SUPPORT Customer service is an integral part of KLA-Tencor s portfolio that enables our customers to accelerate yield. Our vast customer service organization collaborates with worldwide customers to achieve the required productivity and performance at the lowest overall cost. K-T Services includes comprehensive contracts, time and materials, spares, asset management, customer training, and yield consulting. KLA-Tencor Corporation One Technology Drive Milpitas, CA 9535 phone KLA-Tencor Corporation. All brands or product names may be trademarks of their respective companies. KLA-Tencor reserves the right to change the hardware and/or software specifications without notice. Printed in the USA PB-SAO 5/1