Fast response to fault current. General electronics. Maximum Time To Trip Current (A) Pd typ (W) Imax (A)
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- Ethelbert Berry
- 6 years ago
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2 Description The 1812 series provides surface mount resettable overcurrent protection with holding current from 0.1A to 3.0A. This series offers complete portfolio in terms of holding current and working voltage, and is suitable for wide range of applications. Features RoHS compliant and leadfree Low profile Halogenfree Fast response to fault current Compact design saves board space Compatible with high temperature solders Applications USB hubs, ports and peripherals Motherboard USB & IEEE 1394 protection Settopbox and HDMI Optical disk drives Game console port protection General electronics Agency Approval and Environmental Compliance Agency File Number Regulation Standard E /65/EU R IEC :2003 Electrical Characteristics Part Number Ihold Itrip Vmax (Vdc) Imax Pd typ (W) Maximum Time To Trip Current Resistance Agency Approval SMD1812P010TF SMD1812P010TF/ SMD1812P014TF SMD1812P020TF SMD1812P020TFJ SMD1812P035TF/ SMD1812P035TF/ SMD1812P050TF SMD1812P050TF/ SMD1812P050TF/ SMD1812P075TF SMD1812P075TF/ SMD1812P075TF/ SMD1812P110TF SMD1812P110TF/ SMD1812P110TF/ SMD1812P110TF/ SMD1812P125TF/ SMD1812P150TF/ Time (Sec.) Rmin () R1max () 241 No. 241 Industry E. Rd. IV, Hsinchu Science Park, Hsinchu 300, Taiwan. TEL: FAX: Page: 2 of 15
3 Electrical Characteristics Cont d Part Number Ihold Itrip Vmax (Vdc) Imax Pd typ (W) Maximum Time To Trip Current Resistance Agency Approval SMD1812P150TF/ SMD1812P150TF/ SMD1812P150TF/ SMD1812P160TF/8(4L) SMD1812P200TFT SMD1812P200TF/ SMD1812P200TF/ SMD1812P260TFT SMD1812P260TF/ SMD1812P260TF/ SMD1812P300TFT Time (Sec.) Rmin () R1max () 241 No. 241 Industry E. Rd. IV, Hsinchu Science Park, Hsinchu 300, Taiwan. TEL: FAX: Page: 3 of 15
4 Note on Electrical Characteristics Vocabulary Ihold Itrip Vmax Imax = Hold current: maximum current device will pass without tripping in 23ºC still air. = Trip current: minimum current at which the device will trip in 23 ºC still air. = Maximum voltage device can withstand without damage at rated current (I max) = Maximum fault current device can withstand without damage at rated voltage (Vmax) Pd typ = Typical power dissipated from device when in the tripped state at 23 ºC still air. Rmin = Minimum resistance of device in initial (unsoldered) state. R1max = Maximum resistance of device at 23 ºC measured one hour after tripping or reflow soldering of 260 ºC for 20 sec. Value specified is determined by using the PWB with *1.5oz copper traces. Caution: Operation beyond the specified rating may result in damage and possible arcing and flame. Specifications are subject to change without notice. Polymeric PTC Selecting Guide Determine the following operating parameters for the circuits: Normal operating current (Ihold) Maximum circuit voltage (Vmax) Maximum interrupt current (Imax) Normal operating temperature surrounding device (minºc/maxºc) Select the device form factor and dimension suitable for the application: Surface Mount Device (SMD) Axial Leaded Device (ALD) Other Customized Form Factors Radial Leaded Device (RLD) DISC Device Compare the maximum rating for Vmax and Imax of the PPTC device with the circuit in application and make sure the circuit s requirement does not exceed the device rating. Check that PPTC device s trip time (timetotrip) will protect the circuit. Verify that the circuit operating temperature is within the PPTC device s normal operating temperature range. Verify the performance and suitability of the chosen PPTC device in the application. Mechanical Stress PPTC devices will undergo a thermal expansion during fault condition. If PPTC devices are installed or placed in an application where the space between PPTC devices and the surrounding materials (e.g., covering materials, packaging materials, encapsulate materials and the like) is insufficient, it will cause an inhibiting effect upon the thermal expansion. Pressing, twisting, bending and other kinds of mechanical stress will also adversely affect the performance of the PPTC devices, and shall not be used or applied. Chemical Pollutants Siliconebased oils, oils, solvents, gels, electrolytes, fuels, acids, and the like will adversely affect the properties of PPTC devices, and shall not be used or applied. Electronic and Thermal Effect PPTC devices are secondary protection devices and are used solely for sporadic, accidental overcurrent or overtemperature error condition, and shall NOT be used if or when constant or repeated fault conditions (such fault conditions may be caused by, among others, incorrect pinconnection of a connector) or overextensive trip events may occur. PTTC devices are different from fuses and, when a fault condition occurs, will go into highresistance state and do not open circuit, in which case the voltage at such PPTC devices may reach a hazardous level. Operation over the maximum rating or other forms of improper use may cause failure, arcing, flame and/or other damage to the PPTC devices. Conductive material contamination, such as metal particle, may induce shortage, flame or arcing. Due to the inductance, the operation circuits may generate a circuit voltage (Ldi/dt) above the rated voltage of PPTC devices, which shall not be used under such circumstances. General Customers shall evaluate and test the properties of PPTC devices independently to verify and ensure that their individual applications will be met. The performance of PPTC devices will be adversely affected if they are improperly used under electronic, thermal and/or mechanical procedures and/or conditions nonconformant to those recommended by manufacturer. Customers shall be responsible for determining whether it is necessary to have backup, failsafe and/or foolproof protection to avoid or minimize damage that may result from extraordinary, irregular function or failure of PPTC devices. Any and all responsibilities and liabilities are disclaimed if any item under this notice of warning is not complied with. 241 No. 241 Industry E. Rd. IV, Hsinchu Science Park, Hsinchu 300, Taiwan. TEL: FAX: Page: 4 of 15
5 Thermal Derating Curve Percentage of Rated Current Device's Ambient Temperature ( ) Thermal Derating Chart Recommended Hold Current at Ambient Temperature (ºC) Ambient Operation Temperature Part Number 40 ºC 20 ºC 0 ºC 23 ºC 40 ºC 50 ºC 60 ºC 70 ºC 85 ºC SMD1812P010TF SMD1812P010TF/ SMD1812P014TF SMD1812P020TF SMD1812P020TFJ SMD1812P035TF/ SMD1812P035TF/ SMD1812P050TF SMD1812P050TF/ SMD1812P050TF/ SMD1812P075TF SMD1812P075TF/ SMD1812P075TF/ SMD1812P110TF SMD1812P110TF/ SMD1812P110TF/ SMD1812P110TF/ SMD1812P125TF/ SMD1812P150TF/ SMD1812P150TF/ No. 241 Industry E. Rd. IV, Hsinchu Science Park, Hsinchu 300, Taiwan. TEL: FAX: Page: 5 of 15
6 Thermal Derating Chart Cont d Recommended Hold Current at Ambient Temperature (ºC) Ambient Operation Temperature Part Number 40 ºC 20 ºC 0 ºC 23 ºC 40 ºC 50 ºC 60 ºC 70 ºC 85 ºC SMD1812P150TF/ SMD1812P150TF/ SMD1812P160TF/8(4L) SMD1812P200TFT SMD1812P200TF/ SMD1812P200TF/ SMD1812P260TFT SMD1812P260TF/ SMD1812P260TF/ SMD1812P300TFT No. 241 Industry E. Rd. IV, Hsinchu Science Park, Hsinchu 300, Taiwan. TEL: FAX: Page: 6 of 15
7 Average TimeCurrent Curve Time to Trip (Sec.) A B C D E F A SMD1812P110TF B SMD1812P150TF/8 C SMD1812P160TF/8(4L) D SMD1812P200TFT SMD1812P200TF/12 SMD1812P200TF/16 E SMD1812P260TFT SMD1812P260TF/12 SMD1812P260TF/16 F SMD1812P300TFT Fault Current (Amp.) Average TimeCurrent Curve Time to Trip (Sec.) A B CD E A SMD1812P050TF B SMD1812P075TF C SMD1812P110TF/16 D SMD1812P125TF/16 E SMD1812P150TF/12 SMD1812P150TF/ Fault Current (Amp.) 241 No. 241 Industry E. Rd. IV, Hsinchu Science Park, Hsinchu 300, Taiwan. TEL: FAX: Page: 7 of 15
8 Average TimeCurrent Curve Time to Trip (Sec.) A BC D E FGHI J Fault Current (Amp.) A SMD1812P010TF SMD1812P010TF/60 B SMD1812P014TF C SMD1812P020TF SMD1812P020TFJ D SMD1812P035TF/30 SMD1812P035TF/60 E SMD1812P050TF/30 SMD1812P050TF/60 F SMD1812P075TF/33 G SMD1812P075TF/24 H SMD1812P110TF/33 I SMD1812P110TF/24 J SMD1812P150TF/ No. 241 Industry E. Rd. IV, Hsinchu Science Park, Hsinchu 300, Taiwan. TEL: FAX: Page: 8 of 15
9 Soldering Parameters Profile Feature Average RampUp Rate (Tsmax to TP) Preheat Temperature Min (Tsmin) Temperature Max (Tsmax) Time (Tsmin to Tsmax) Time maintained above: Temperature (TL) Time (tl) PbFree Assembly 3ºC/second max. 150ºC 200ºC seconds 217ºC seconds Peak Temperature (TP) 260ºC Time within 5ºC of actual Peak Temperature (tp) 2040 seconds RampDown Rate 6 ºC /second max. Time 25ºC to Peak Temperature 8 minutes max. Storage Condition 0ºC ~35ºC, 70%RH Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for leadfree Recommended maximum paste thickness is 0.25mm (0.010 inch) Devices can be cleaned using standard industry methods and solvents. Note 1: All temperature refer to topside of the package, measured on the package body surface. Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. 241 No. 241 Industry E. Rd. IV, Hsinchu Science Park, Hsinchu 300, Taiwan. TEL: FAX: Page: 9 of 15
10 Physical Dimensions (mm.) P : Polytronics/ Part Part Number Figure 2 A B C D E Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. SMD1812P010TF SMD1812P010TF/ SMD1812P014TF SMD1812P020TF SMD1812P020TFJ SMD1812P035TF/ SMD1812P035TF/ SMD1812P050TF SMD1812P050TF/ SMD1812P050TF/ SMD1812P075TF SMD1812P075TF/ SMD1812P075TF/ SMD1812P110TF SMD1812P110TF/ SMD1812P110TF/ SMD1812P110TF/ SMD1812P125TF/ SMD1812P150TF/ SMD1812P150TF/ SMD1812P150TF/ SMD1812P150TF/ SMD1812P160TF/8(4L) SMD1812P200TFT SMD1812P200TF/ SMD1812P200TF/ SMD1812P260TFT SMD1812P260TF/ SMD1812P260TF/ SMD1812P300TFT No. 241 Industry E. Rd. IV, Hsinchu Science Park, Hsinchu 300, Taiwan. TEL: FAX: Page: 10 of 15
11 Environmental Specifications Operating Temperature 40ºC to +85 ºC Maximum Device Surface Temperature in Tripped State Passive Aging Humidity Aging Thermal Shock Solvent Resistance Vibration Moisture Sensitivity Level 125ºC +85ºC, 1000 hours ±5% typical resistance change +85ºC, 85%R.H hours ±5% typical resistance change MILSTD202 Method 107G +85ºC /40ºC 20 times 30% typical resistance change MILSTD202, Method 215 No change MILSTD883C, Method , Condition A No change Level 1, JSTD020C 241 No. 241 Industry E. Rd. IV, Hsinchu Science Park, Hsinchu 300, Taiwan. TEL: FAX: Page: 11 of 15
12 Packaging Quantity and Marking Recommended Pad Layout (mm.) Part Number Marking Quantity SMD1812P010TF SMD1812P010TF/ SMD1812P014TF SMD1812P020TF SMD1812P020TFJ 020J 1500 SMD1812P035TF/ SMD1812P035TF/ SMD1812P050TF SMD1812P050TF/ SMD1812P050TF/ SMD1812P075TF SMD1812P075TF/ SMD1812P075TF/ SMD1812P110TF SMD1812P110TF/ SMD1812P110TF/ SMD1812P110TF/ SMD1812P125TF/ SMD1812P150TF/ SMD1812P150TF/ SMD1812P150TF/ SMD1812P150TF/ SMD1812P160TF/8(4L) SMD1812P200TFT SMD1812P200TF/ SMD1812P200TF/ SMD1812P260TFT SMD1812P260TF/ SMD1812P260TF/ SMD1812P300TFT mm tape on 7 inch reel per EIA481 (equivalent to IEC286, part 3) 241 No. 241 Industry E. Rd. IV, Hsinchu Science Park, Hsinchu 300, Taiwan. TEL: FAX: Page: 12 of 15
13 Physical Specifications Terminal Material SolderPlated Copper (Solder Material: Matte Tin (Sn)) Lead Solderability Meets EIA Specification RS1869E, ANSI/JSTD002 Category No. 241 Industry E. Rd. IV, Hsinchu Science Park, Hsinchu 300, Taiwan. TEL: FAX: Page: 13 of 15
14 Tape Specifications: EIA481 (mm.) P020TF P050TF, P050TF/30, P075TF, P110TF P160TF/8(4L) P150TF/8 P200TFT P010TF, P010TF/60 P014TF, P020TFJ P035TF/30 P075TF/24, P075TF/33 P110TF/16, P110TF/24 P125TF/16, P150TF/12 P150TF/16 P200TF/12, P200TF/16 P260TFT, P300TFT P035TF/60 P050TF/60 P110TF/33 P150TF/24 P260TF/12 P260TF/16 W ± ± ± 0.10 F 5.50 ± ± ± 0.05 E ± ± ± 0.10 D ± ± ± 0.05 D (MIN) 1.50 ± (MIN) P ± ± ± 0.08 P ± ± ± 0.10 P ± ± ± 0.05 A ± ± ± 0.10 B ± ± ± 0.10 T 0.25 ± ± ± 0.10 K ± ± ± 0.10 Leader min Trailer min Reel Dimensions: EIA481 (mm.) C Ø178 ± 1.0 D Ø60.2 ± 0.5 H 16.0 ± 0.5 W 13.2 ± No. 241 Industry E. Rd. IV, Hsinchu Science Park, Hsinchu 300, Taiwan. TEL: FAX: Page: 14 of 15
15 Part Number System SMD 1812 P TF T / Cross Reference Polytronics / EVERFUSE SMD1812P010TF SMD1812P010TF/60 SMD1812P014TF SMD1812P020TF SMD1812P020TFJ SMD1812P035TF/30 SMD1812P035TF/60 SMD1812P050TF SMD1812P050TF/30 SMD1812P050TF/60 SMD1812P075TF SMD1812P075TF/24 SMD1812P075TF/33 SMD1812P110TF SMD1812P110TF/16 SMD1812P110TF/24 SMD1812P110TF/33 SMD1812P125TF/16 SMD1812P150TF/8 SMD1812P150TF/12 SMD1812P150TF/16 SMD1812P150TF/24 SMD1812P160TF/8(4L) SMD1812P200TFT SMD1812P200TF/12 SMD1812P200TF/16 SMD1812P260TFT SMD1812P260TF/12 SMD1812P260TF/16 SMD1812P300TFT EVERFUSE is a registered trademark of Polytronics Technology Corp. Multifuse is a registered trademark of Bourns, Inc. PolySwitch is a registered trademark of TE Connectivity Ltd. Special Voltage Rating (Optional) Thickness Version (Optional) Lead Free Holding Current Rating Polytronics Symbol Device Dimensions: Length/Width (Unit: 1/100 inch) Surface Mount Device Cross Reference TE Connectivity / PolySwitch Bourns / Multifuse minismdc010f minismdc010f minismdc014f minismdc020f minismdc050f minismdc075f minismdm075f/24 minismdc110f minismdc110f/16 minismdc110f/24 minismdc125f/16 minismdc150f minismdc150f/12 minismdc150f/16 minismdm150f/24 minismdm160f minismdc200f minismdc260f minismdc260f/12 minismdc260f/16 minismdc300f MFMSMF010 MFMSMF010 MFMSMF014 MFMSMF020 MFMSMF020/60 MFMSMF050 MFMSMF075 MFMSMF075/24 MFMSMF110 MFMSMF110/16 MFMSMF125 MFMSMF150 MFMSMF160 MFMSMF200 MFMSMF No. 241 Industry E. Rd. IV, Hsinchu Science Park, Hsinchu 300, Taiwan. TEL: FAX: Page: 15 of 15
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