Solution-processed carbon nanotube thin-film complementary static random access memory

Similar documents
A 5T SRAM with Improved Read Stability and Variation Tolerance over 6T

Advanced Technique for Si 1-x Ge x Characterization: Infrared Spectroscopic Ellipsometry

Siemens HYB39S64800AT-8 64M SDRAM Cell Analysis Report

Present Status and Prospects for Fuji Electric s IC Products and Technologies Yoshio Tsuruta Eiji Kuroda

Introduction: Supplied to 360 Test Labs... Battery packs as follows:

CMPEN 411 VLSI Digital Circuits Spring Lecture 22: Memery, ROM

VPPC Terry Hosking, V.P. of Engineering SBE Inc.

CMPEN 411 VLSI Digital Circuits Spring Lecture 06: Static CMOS Logic

Composite Layout CS/ECE 5710/6710. N-type from the top. N-type Transistor. Polysilicon Mask. Diffusion Mask

THINERGY MEC220. Solid-State, Flexible, Rechargeable Thin-Film Micro-Energy Cell

All-SiC Module for Mega-Solar Power Conditioner

Hybrid Nanopositioning Systems with Piezo Actuators

INDIAN INSTITUTE OF TECHNOLOGY KANPUR Kanpur , Uttar Pradesh, India Centre for Lasers and Photonics

4.28±0.05V 2.4±0.1V. W :29.0mm T :11.1mm

Core Power Delivery Network Analysis of Core and Coreless Substrates in a Multilayer Organic Buildup Package

Index. bulk micromachining 2 3, 56, 94 96, 109, 193, 248

RV-1805-C3 Application Note

KH SWCNT. High Quality in Mass Quantity for Industrial Use

Type EDL Electric Double Layer Supercapacitors

AMX8X5 Using Low-Cost Ceramic Capacitors for RTC Backup Power

ASIC Design (7v81) Spring 2000

Chapter 11. Reliability of power module

Electro-Proportional Terms and Definitions

DYNACOMP. The top-class reactive power compensator

DATASHEET ISL88001, ISL88002, ISL Features. Applications. Pinouts. Ultra Low Power 3 Ld Voltage Supervisors in SC-70 and SOT-23 Packages

Lecture 10: Circuit Families

Dynamis LI Cells and Batteries

North America Asia-Pacific Europe, Middle East

Wind Turbine Emulation Experiment

NESSCAP ULTRACAPACITOR TECHNICAL GUIDE. NESSCAP Co., Ltd.

Ceramic disc capacitors (kinked leads) Class 2, low loss (0.2% max.) 500 V; 1 kv; 2 kv; 3 kv

Bridgelux Vero. Product Data Sheet DS120. SE 10 Array

Layout Design and Implementation of Adiabatic based Low Power CPAL Ripple Carry Adder

SPT- I / U PRESSURE TRANSMITTER for general applications

HIGH TEMPERATURE ULTRA HIGH VOLTAGE SIC THYRISTORS

HM8202. The HM8202 is available in the SOP-8L package. Charging Docks Handheld Instruments Portable Computers

CHAPTER 3 : TYPE I TEST ON SI ENGINES (VERIFYING THE AVERAGE EMISSIONS OF GASEOUS POLLUTANTS)

Lecture 2. Power semiconductor devices (Power switches)

Maximizing the Power Efficiency of Integrated High-Voltage Generators

VIA Platform Environmental Qualification Testing Standards

NXE1 Series Isolated 1W Single Output SM DC-DC Converters

Super Capacitors To Improve Power Performance.

MGJ6 14mm Series 10.2kVDC Isolated 6W Gate Drive SM DC/DC Converters

Product Data Sheet DS123 BXRC-27x10K0 30x10K0 35x10K0 40x10K0 50x10K1 57x10K1 65x10K1

NCS12 Series Isolated 12W 4:1 Input Single & Dual Output DC/DC Converters

EXPERIMENTAL STUDY OF DYNAMIC THERMAL BEHAVIOUR OF AN 11 KV DISTRIBUTION TRANSFORMER

Experiment No. 1 Thyristor Characteristic

UTBB FD-SOI: The Technology for Extreme Power Efficient SOCs

Pure Lead-Tin Technology

NXJ2 Series Isolated 2W Single Output SM DC-DC Converters

The XA4203 is available in the SOP-8L package. Charging Docks Handheld Instruments Portable Computers

SELECTION GUIDE. Nominal Input Voltage. Output Voltage. Input Current. Input reflected ripple current

DS1230Y/AB 256k Nonvolatile SRAM

NCS6 Series Isolated 6W 4:1 Input Single & Dual Output DC/DC Converters

TRANSPORT OF DANGEROUS GOODS

NXE2 Series Isolated 2W Single Output SM DC-DC Converters

MTC2 Series Isolated 2W SM 2:1 Input Single Output DC-DC Converters

SELECTION GUIDE. Nominal Input Voltage. Output Voltage. Input Current. Input reflected ripple current

RF Energy Harvesting and Battery- Free Wireless Sensors

arxiv:submit/ [math.gm] 27 Mar 2018

IJESRT. Scientific Journal Impact Factor: (ISRA), Impact Factor: 2.114

HBC DC-DC Series Data Sheet 300-Watt Half-Brick Converters

GB60S 60W Single Output General Purpose Series

Tech Tip The Fundamentals of Supercapacitor Balancing

Visual comparison of Plain & Hazy PP Film

Solar Glider. ENG460 Engineering Thesis Final Report. Ben Marshall,

CMPEN 411 VLSI Digital Circuits Spring Lecture 24: Peripheral Memory Circuits

Implementation of FC-TCR for Reactive Power Control

Realization of a New Concept for Power Chip Embedding

Titelgrau belassen! Leere Vorlage

Fuses Introductory Information

YM12S05 DC-DC Converter Data Sheet Vdc Input; Vdc 5A

NDS6 Series Isolated 6W Wide Input Single & Dual Output DC/DC Converters

Get the most out of your rechargeable batteries with this microcontrollerbased. discharger.

MGJ1 Series 5.7kVDC Isolated 1W SM Gate Drive DC/DC Converters

Metal-Oxide Varistors (MOVs) Surface Mount Multilayer Varistors (MLVs) > MLA Automotive Series

A thin film thermoelectric cooler for Chip-on-Board assembly

Snubber, High Current DC, and Switching Capacitors

Supercapacitors as Power Buffers between Energy Harvesters and Wireless Sensors Pierre Mars Battery Power, September 18-19, 2012

LP2992 Micropower 250 ma Low-Noise Ultra Low-Dropout Regulator in SOT-23 and LLP Packages Designed for Use with Very Low ESR Output Capacitors

New Small Spectrometer Concepts Covering the Ultraviolet to the Mid-Infrared

NXE1 Series Isolated 1W Single Output SM DC/DC Converters

Floating Capacitor Active Charge Balancing for PHEV Applications

Title Goes Here and Can Run Solar Photovoltaic up to 3 lines as shown here Systems as you see

SELECTION GUIDE. Nominal Input Voltage. Output Voltage. Input reflected ripple current. Switching frequency NXE1S0305MC 85

Development of high reliability fuse for space use

APEC 2011 Special Session Polymer Film Capacitors March 2011

DS1245Y/AB 1024k Nonvolatile SRAM

Lithium Battery UN38.3 Test Report

Lithium Battery UN38.3 Test Report

CMR Series Isolated 0.75W Single and Dual Output Isolated DC/DC Converters

The PMAC Dynamic Scale Loop

Introduction fo FPV Series Multilayer Chip Varistor

4.Test Requirements: No mass loss,no leakage,no venting,no disassembly,no rupture and no fire,and the voltage retention is not less than 90%.

Chapter 2 Dynamic Analysis of a Heavy Vehicle Using Lumped Parameter Model

Rich, unique history of engineering, manufacturing and distributing

SM1206 Series. Overload Interrupt Time (Second) Nominal Rating - Note 2. Cold Resistance (Ohm) Note 1. Maximum I 2 T (Ampere 2 Second) Nominal Rating

SELECTION GUIDE. Nominal Input Voltage. Output Voltage. Input Current. Input reflected ripple current

WW25X, WW18X, WW12X, WW08X, WW06X ±1%, ±5% Thick Film Current Sensing Chip Resistors Size 2512, 1218, 1206, 0805, 0603 (Automotive)

Lithium Battery UN38.3 Test Report

Transcription:

Solution-processed carbon nanotube thin-film complementary static random access memory Michael L. Geier, Julian J. McMorrow, Weichao Xu, Jian Zhu, Chris H. Kim, Tobin J. Marks, and Mark C. Hersam * *Corresponding Author: m-hersam@northwestern.edu NATURE NANOTECHNOLOGY www.nature.com/naturenanotechnology 1

1. Characterization of Semiconducting SWCNTs The SWCNT purity is determined by UV-vis-NIR spectra through an established method of comparing the area of the S22 peak to that of the M11 peak (Supplementary Fig. 1). Nominally 99% pure semiconducting SWCNTs are used in this study. Supplementary Fig. 1. SWCNT purity characterization. UV-vis-NIR optical absorbance spectra for both sorted and as-received raw SWCNTs in solution. 2 NATURE NANOTECHNOLOGY www.nature.com/naturenanotechnology

SUPPLEMENTARY INFORMATION 2. Characterization of SWCNT TFTs As-fabricated SWCNT TFTs are tested for dielectric leakage current, with a typical leakage profile given in Supplementary Fig. 2a. To measure the capacitance of the SWCNT channel and gate structure, source/drain contact probes are shorted externally and voltage was applied to the gate. The capacitance values of the resulting metal-insulator-semiconductor capacitors are measured at 10 khz with an AC amplitude of 50 mv, and show the appropriate accumulation and depletion regimes for both p-type and n-type SWCNT TFTs (Supplementary Fig. 2b). Typical SWCNT TFT output characteristics are shown in Supplementary Fig. 2c for both p-type (V GS varied from -1.75 V to 0 V in 0.25 V steps) and n-type (V GS varied from 1.75 V to 0 V in 0.25 V steps). a b c Supplementary Fig. 2. SWCNT TFT characterization. (a) SWCNT TFT gate leakage current as a function of V GS. (b) Capacitance-voltage measurement for p-type (blue) and n-type (green) SWCNT TFTs. (c) TFT output characteristics (I DS -V DS ) for a p-type SWCNT TFT (left axis) from V GS = -1.75 to 0 V in 0.25 V increments and for a n-type SWCNT TFT (right axis) from V GS = 1.75 V to 0 V in 0.25 V steps. NATURE NANOTECHNOLOGY www.nature.com/naturenanotechnology 3

3. Time-Dependent Testing For unencapsulated p-type device testing, no dopant or encapsulation fabrication steps are applied. The as-fabricated TFTs (after O 2 RIE) are transferred to a nitrogen atmosphere glove box and annealed in vacuum (30 mtorr) at 230 ºC for 1 h. The substrate is then removed from the nitrogen glove box and electrical testing begins within 1 min of exposure to ambient atmosphere. Devices are then tested by the semi-automatic probe station for an extended period of time to capture changes in the transfer characteristics. For encapsulated devices, both dopant and encapsulation steps are applied, and SWCNT TFTs are measured after the encapsulation step. Consistent time-dependent changes in electronic properties are observed for both individual devices measured repeatedly (Fig. 2) and for multiple devices measured once (Fig. 3 and Supplementary Fig. 3) over the same elapsed testing times as unencapsulated devices. All properties shown in Supplementary Fig. 3 are calculated averages and standard deviations of multiple devices (~50 TFTs) measured once over a similar time period after initial atmospheric exposure. 4 NATURE NANOTECHNOLOGY www.nature.com/naturenanotechnology

a b SUPPLEMENTARY INFORMATION c d e f Supplementary Fig. 3. Large sample SWCNT TFT time-dependent electronic transport properties. (a)-(b) Log 10 (I ON /I OFF ) of encapsulated (purple) and unencapsulated (black) (a) p- type and (b) n-type SWCNT TFTs. (c) Subthreshold swing for encapsulated (purple) and unencapsulated (black) p-type SWCNT TFTs. (d) Log 10 (I DS ) values when V GS = 0 V for encapsulated (purple) and unencapsulated (black) n-type SWCNT TFTs. Threshold voltage distributions for encapsulated (purple) and unencapsulated (black) (e) p-type and (f) n-type SWCNT TFTs. NATURE NANOTECHNOLOGY www.nature.com/naturenanotechnology 5

4. SWCNT TFT Modelling For circuit simulations, device modelling is used to estimate an approximate drain current in terms of device parameters and terminal voltages. This approach allows a circuit with multiple device parameters to be simulated and its electronic behaviour to be predicted without fabrication. This process can be extended to the simulation of any circuit made using our complementary SWCNT TFTs. In this simulation method, the design parameters, such as channel widths and lengths, can be adjusted to ensure functionality and optimize performance, thus informing the fabrication of an appropriate photolithography mask. The SRAM cell schematic was drawn in Cadence Virtuoso schematic editor (Supplementary Fig. 4a), an integral part of modern integrated circuit design platforms. This design environment allows rapid empirical parameter alterations, design verification, and circuit netlist exporting for simulation. The p-type SWCNT TFTs and n-type SWCNT TFTs were parameter-fitted into a HSPICE level 49 MOSFET model. These models were then used to simulate SRAM circuit operations to verify optimal hold operation, read margin, and write margin performance. The SRAM cell simulated read margin (0.52 V) and write margin (0.73 V) results are shown in Supplementary Fig. 4b and Fig.4c, and are produced using HSPICE based on voltage biases that are applied in the actual SRAM cell measurements. 6 NATURE NANOTECHNOLOGY www.nature.com/naturenanotechnology

SUPPLEMENTARY INFORMATION a b c Supplementary Fig. 4. SRAM model and results. (a) Transistor-level SRAM circuit schematic used for simulations. (b) Read margin simulation result. (c) Write margin simulation result. NATURE NANOTECHNOLOGY www.nature.com/naturenanotechnology 7

5. Static Random Access Memory Circuit Characteristics SRAM circuits are characterized individually using a semi-automatic probe station, a custom Keithley 4200-SCS user test module, and three external Keithley 2400 units to apply different voltage conditions. The hold margin is tested when the wordline (WL) voltage is set to V DD (1.75 V). The hold operation during the read margin measurement is also known as the static noise margin, and is shown in Supplementary Fig. 5a (purple). The hold operation during the write margin measurement (Supplementary Fig. 5b) shows no write event (purple). The largest static noise margin and smallest write margin (0 V) is observed for the hold condition and is given in Supplementary Fig. 5c. The read and write margins are then measured for various WL voltages from 1.75 V to 0 V and characteristic voltage transfer curves for read and write operations are shown in Supplementary Fig. 5 for all different WL voltages. The measured read margins and write margins are plotted as a function of WL voltage in Supplementary Fig. 5c, showing that the optimal WL voltage is ~1.25 V. 8 NATURE NANOTECHNOLOGY www.nature.com/naturenanotechnology

SUPPLEMENTARY INFORMATION a b c Supplementary Fig. 5. SRAM characteristics. (a) Read margin measurement for varying wordline voltages: 0 V (red) to 1.75 V (purple). (b) Write margin for varying wordline voltages: 0 V (red) to 1.75 V (purple). (c) Read margin and write margin as a function of wordline voltage. NATURE NANOTECHNOLOGY www.nature.com/naturenanotechnology 9