Specification YGHR411-H CUSTOMER Checked by Approved by SUPPLIER Drawn by Approved by
CONTENTS 1. Description 2. Absolute maximum ratings 3. Electro-optical characteristics 4. Electro-Optical Characteristic Diagram 5. Rank 6. Material 7. Outline Dimension 8. Packing 9. Soldering 10. Precaution for use
1. Description - Small size suitable for compact appliances - Surface-mounted and leadless chip LED device - High brightness, wide variety of colors are available YGHR411-H YGHR411-H Features 1.6 X 1.5 X 0.5 mm Untited, Diffused flat mold Wavelength : -. YG : 572 nm -. HR : 620 nm - Tape and Reel packing - Increases the life time of battery Applications Cellular phone s keypad lightning Other decoration lighting
2. Absolute maximum ratings Parameter Symbol Value Unit Power Dissipation P d 72 mw Forward Current I F 30 ma Peak Forward Current I *1 FM 100 ma Reverse Voltage V R 5 V (Ta=25 ) Operation Temperature T opr. -30 ~ 85 Storage Temperature T stg. -40 ~ 100 *1 I FM conditions: Pulse width Tw 0.1ms and Duty ratio 1/10 3. Electro-Optical Characteristics (Ta=25 ) Parameter Symbol Condition color Min Typ Max Unit Forward Voltage V F I F =20 ma Reverse Current I R V R =5V Luminous Intensity *2 I V I F =20 ma Wavelength λd I F =20 ma Spectral Bandwidth Δλ I F =20 ma Viewing Angle *3 2θ 1/2 I F =20 ma YG 1.8 2.0 2.4 FR 1.8 2.0 2.4 YG - - 10 FR - - 10 YG 35 55 65 FR 60 100 140 YG 568 572 576 FR 610 620 625 YG - 30 FR - 30 - YG - 120 - FR - 120 - V μa mcd nm nm *2 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. *3 θ 1/2 is the off-axis where the luminous intensity is 1/2 the peak intensity. [Note] All products confirm to the listed minimum and maximum specifications for electric and optical characteristics, when operated at 20mA within the maximum ratings shown above. All measurements were made under the standardized environment of SSC. (Tolerance : I v ±10 %, λ D ±2 nm, V F ±0.1 V)
Forward Current I F (ma) 4. Electro-Optical characteristic Diagram Forward Current vs. Forward Voltage 10 1 Relative Intensity I V (%) Relative Luminous Intensity vs Forward Current 140 120 100 80 60 40 20 0.1 1.7 1.8 1.9 2.0 2.1 Forward Voltage V F (V) 0 5 10 15 20 25 30 35 Forward Current I F (ma) Ambient Temperature vs. Allowable Forward Current Radiation Diagram 50 40 90 Forward current I F (ma) 30 20 10 180 150 120 60 30 0 0-25 0 25 50 75 100 Ambient temperature Ta( o )
Intensity[a.u.] 1.0 0.8 0.6 0.4 Spectrum 0.2 0.0 300 400 500 600 700 800 Wavelength [nm]
5. Rank I V [mcd] V F [V] l d [nm] (I F =20mA) (I F =20mA) (I F =20mA) RANK Red Yellow Red Yellow Red Yellow 60~95 C 35~65 1.8~2.4 1.8~2.4 610~625 568~576 95~140 B 6.Metarial Item Color Package chip wire Encapsulate Electrode Material YG/FR BT-Resin AlInGaP Gold Epoxy Au
7.Outline Dimension 1.5 Marking 2 4 (0.18) Resin ( Tolerance: ±0.1, Unit: mm ) 0.4 0.2 1.6 1 3 0.8 0.2 1.2 1.1 PCB 0.5 0.4 0.6 0.6 Cathode 2 4 YG FR 0.8 2.4 1 3 Anode 1.8 0.2 [Recommended Solder Pattern]
8. Packing 1.5 +0.1-0 4.0 ±0.1 2.0 1.75 ±0.1 1.75 3.5 ±0.2 8.0 0.2 (2.75) 4.0 ±0.1 0.5 1.73 0.7 180 +0-3 9 11.4 ±0.3 2 ±0.2 22 +0.2 60-0 13 ±0.2 Label Tolerance: ±0.2, Unit: mm (1) Quantity:4,000pcs./Reel (2) Cumulative Tolerance: Cumulative Tolerance/10pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape: Adhesion strength to be 0.1-0.7N when the over tape is turned off from the carrier tape at10 angle to be the carrier tape. (4) Package: P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package.
NKANSCPAYGHR41Document No. : SSC-QP-7-07-24 (Rev.00) 1-RANKUANTIT:SYGHR411-HSCPARTNU40MB0ER:YGHR41NUMBER: ##########Q1-HLOT Reel Packing Structure A0Reel LOT NUMBER: ##########RQUITY:40RTNUMBE:YGHR411-H R:## HAluminum Vinyl Bag :## YOuter Box *Material: Paper(SW3B(B)) SIZE(mm) TYPE a b c 7inch 245 220 142 TUV MADE IN KOREA Acriche Semiconductor EcoLight RoHS a b c CHIP LED PART : YGHR411-H CODE : Q'YT : 40,000EA LOT NO : DATE : SEOUL SEMICONDUCTOR CO.,LTD
9. Soldering (1) Lead Solder Lead Solder Pre-heat 120~150 Pre-heat time Peak-Temperature 120 sec. Max. 240 Max. 2.5~5 C / sec. 2.5~5 o C / sec. Pre-heating 120~150 o C Lead Solder 60sec. Max. Above 200 o C o 240 C Max. 10 sec. Max. Soldering time Condition 10 sec. Max. 120sec. Max. (2) Lead-Free Solder Lead-frame Solder Lead Free Solder Pre-heat 150~200 Pre-heat time Peak-Temperature Soldering time Condition 120 sec. Max. 260 Max. 10 sec. Max. o 1~5 C / sec. Pre-heating 60sec. Max. 1~5 o 150~200 o C / sec. C Above 220 o C 120sec. Max. 260 oc Max. 10 sec. Max. (3) Hand Soldering conditions Do not exceed 3 seconds at maximum 280ºC under soldering iron. Note : In case that the soldered products are reused in soldering process, we don t guarantee the products.
10. Precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : Max30ºC Humidity : Max 65%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; a. After opened and mounted the soldering shall be quickly. b. Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 30% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (11) The LEDs must be soldered within seven days after opening the moisture-proof packing. (12) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (13) The appearance and specifications of the product may be modified for improvement without notice.
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