Index ablation 82, 84 accelerometer manufacturers 197, 220 accelerometers 2 4, 7, 9, 126 27, 168 69, 179, 197, 200 1, 204, 210, 212 14, 216 20, 239 41, 249 51, 279 80 digital 200 single-axis 197 98 single-die 160, 202 three-axis 10, 206, 210, 280 aluminium 19, 58, 70, 103, 136 ammonia 43, 45 application-specific integrated circuit (ASIC) 1, 115, 119 20, 135 36, 141 42, 160, 168, 172 74, 200, 210 11, 219 20, 229, 236, 241 42, 248 49 ASIC see application-specific integrated circuit signal-processing 141, 160, 218, 220, 248, 280 ASIC signal processor 141, 174, 179, 210, 220, 222, 233, 241 beam delivery systems 82, 84 bipolar-junction transistor 1 bonding 97 98, 125 26, 193 eutectic 97, 134 soft solder 134 bonding machine 137, 139 bonding types 136 37 bulk micromachining 2 3, 56, 94 96, 109, 193, 248 carbon dioxide 104 5 cathode 102 cathode efficiency 103 central processing unit (CPU) 1, 115 chemical mechanical polishing (CMP) 38, 61 63, 70, 171, 253, 259 60 chemical vapour deposition low-pressure 22, 41, 43, 171, 205, 231 plasma-enhanced 41, 44 45, 205, 231 clean rooms 29 30, 147 52, 154, 156, 158, 160, 162, 168 69, 188, 265 67, 272 74, 278, 281 CMOS see complementary-metaloxide semiconductor CMPsee chemical mechanical polishing complementary-metal-oxide semiconductor (CMOS) 1, 6, 10, 15, 31 32, 40, 90, 115, 141, 169, 179, 188, 200, 225, 248 copper 44, 63, 103, 136 37, 144 copper wires 136 38 cost analysis 7, 9 10, 166, 188, 205, 217, 220, 233, 281
284 Index cost comparison 218 19, 221, 241 cost estimates 144, 150 51, 168, 179, 183, 204 cost reduction 125, 137 38, 207, 239, 249 50 costing 119, 128, 167, 277 78 costs accelerometer 221 administration 266 67 clean-room 168, 187 commercial 253 depreciation 188, 272 electricity 155 energy 162 equipment 191, 206 fabrication 123, 166, 168, 252 fixed 129, 190 foundry fabrication 259 management 186 manufacturing throughput 131 marketing 268 mask 260 material 188, 206 microphone 243 operator 15 overhead 190 packaging 10, 137, 144, 179, 215, 279 80 plastic package 131 production 9 variable 10, 190, 279 wafer 206 wafer manufacturing 150 wire-bonding 201 CPUsee central processing unit critical-point dryer 105 7 critical-point-drying 104 5 crystallographic planes 58, 94 95 DCFsee discounted cash flow deep reactive-ion etching (DRIE) 2 3, 8, 77 79, 81, 90, 109, 142, 171, 174 75, 193, 205, 280 demagnification, reticle-to-wafer 37 depreciation 15, 120, 123, 129, 167 68, 190, 222, 243 44, 251, 266 69, 271 72, 278 depth of focus (DoF) 37 38, 61 dichlorosilane 43, 45 46 dicing simulator 133 34 die attach simulator 135 die fabrication 205, 207, 231, 233 dielectrics 53 54 digital mirror 2 3 direct current 51, 54, 102, 221, 226 directional ion bombardment 78 discounted cash flow (DCF) 269 70 DoFsee depth of focus DRIEsee deep reactive-ion etching DRIE machine 81 DRIE simulator 80, 82 earnings per share (EPS) 275 EBLsee electron-beam lithography EBL machine 63, 69 EDPsee ethylene diamine pyrocatechol electrodeposition 100 4, 171, 193 electrodes 74 75, 78, 100 2, 205, 225 moveable 198 99, 205 electroless plating 100 1 electron-beam lithography (EBL) 63, 69, 171, 175 electron-beam pattern generation 63, 65, 67 electroplating 100 1, 175, 193 energy consumption 150, 152, 155, 162 63 epoxy 134 35 epoxy lid 144
Index 285 EPSsee earnings per share etch, wet 3, 55, 70, 171, 175 etch rates 57 58, 80, 82, 94, 174 etch step 78 etch time 78, 82, 95 etchants 20, 22, 54, 57, 94, 96, 174 etching 8, 14 15, 17, 19 20, 22, 54, 59, 80, 253 anisotropic 54, 56 wet 54 55, 174 wet-chemical 54, 56 57, 78, 94 ethylene diamine pyrocatechol (EDP) 94, 174 excimer laser 8, 37, 82 83, 85, 175 excimer laser ablation 82 83, 280 expenses, start-up 266 fabrication machine simulators 173 fabrication machines 273 fabrication processes 19 20, 23, 193, 215 imems 200 industrial 179 feedback capacitor 227 28 financial statements 263 64, 272, 280 foundries 1, 10, 29, 156, 166, 202, 204, 212, 218, 241 42, 247 48, 250 52, 260, 280 external 219 20, 241 large-scale 248 50 full wafer masks 37 gap, mask-wafer 33 34 Gaussian beam profile 64 65 glass 4, 97 glass frit 97, 100 1, 142 gold 22, 51, 54, 137 38, 144 cost of 137 gold wire 137 38 high-aspect-ratio equipment 109 high-aspect-ratio MEMS equipment 192 high-aspect-ratio microfabrication technologies 109 high-aspect-ratio micromachining 73 74, 76, 78, 80, 82, 84, 86, 88, 90, 92, 94, 96, 98, 100, 102 high-aspect-ratio processes 109, 171, 192 93 human resources 268 i-line stepper 38 39 ICPsee inductively controlled plasma ICssee integrated circuits IDMsee independent device manufacturers independent device manufacturers (IDM) 28, 219 20, 242, 248, 279 inductively controlled plasma (ICP) 59, 70 injection moulding machine 107 injection moulding simulator 109 integrated circuits (ICs) 1, 7, 9 10, 18, 20, 29, 115 16, 147, 150 51, 153, 155, 160, 168, 176, 247 48 laboratory wafer-dicing 137 labour 266 67, 274 direct 267 68 Laplace pressure 75 77 laser ablation machine simulator 85 86 lithography 4, 8, 13 15, 17, 74, 85, 87 low-pressure chemical vapour deposition (LPCVD) 22, 41, 43 45, 47, 171, 205, 231
286 Index LPCVDsee low-pressure chemical vapour deposition LPCVD furnace 42 43 LPCVD polysilicon layer 231 32 mask aligners 37, 91 92, 96 mechanical polishing, chemical 38, 61 62, 171 MEMS see microelectromechanical systems MEMS accelerometers 2, 31, 125, 143, 200, 210, 214, 279 three-axis 4 MEMS applications 90 91, 279 MEMS-based devices 280 MEMS-based display technologies 5 MEMS capacitive microphone 225 MEMS chips 201 MEMS comb sensor 170 73 MEMS devices 7 10, 19 20, 32 33, 69, 73 74, 97, 123, 126 27, 140 41, 143, 162, 166, 189 90, 193, 280 commercial 10 complex 220 high-volume 279 MEMS fabrication 14, 18, 21, 32, 37, 44 45, 47, 51, 57 59, 69, 73, 165, 194, 248, 253 MEMS foundries 2, 7, 10 11, 130, 149, 156 57, 159 61, 204, 247 48, 250, 252, 254, 256, 258, 260 commercial 253 lightly loaded 250 51 multi-product 249 smaller-scale 248 MEMS foundry revenue 249 MEMS lithography 33 MEMS microcomponents 2 MEMS microphones 4, 10, 225 27, 235 36, 239 40, 279 dual backplate 226, 229, 232 single backplate 226 MEMS microstructure 141, 233 MEMS oscillators 3 MEMS packaging 8, 125 26, 128, 130, 132, 134, 136, 138, 140, 142, 144 MEMS pressure sensors 5 MEMS products 2, 125 MEMS scanner 5 MEMS sensor 142, 197, 200 1, 219, 280 mechanical 201 MEMS shutters 5 MEMS tester 120 21 basic 121 MEMSCAP 253, 259 60 MEMSCOST 24 25, 57 59, 142 44, 151 52, 154 55, 160, 165 68, 174 75, 179, 183 84, 186 88, 212, 249 51, 263, 277 80 MEMSCOST bulk micromachining simulator 94 MEMSCOST cost analysis 209 MEMSCOST cost calculations 125 MEMSCOST cost line 214 MEMSCOST die-per-wafer calculator 24 MEMSCOST electrodeposition simulator 104 MEMSCOST machine simulator 50, 166 MEMSCOST package cost simulator 128 29 MEMSCOST wire-bonding simulator 137 mercury lamp 32 33, 93 metals 8, 19, 44, 51, 54, 78, 97, 103, 129, 134, 139 40
Index 287 microelectromechanical systems (MEMS) 1 5, 7 10, 14, 19 20, 31, 73, 77 78, 116, 119 23, 125, 127, 141 44, 172 74, 208 10, 277 81 microfabrication 14 microfluidic devices 4 microfluidics 2, 4 5, 125, 279 80 micromachining 83, 109 microphones 2, 7, 121, 140, 142, 168, 179, 225, 227 29, 233, 236 38, 240 43, 279 double backplate 229, 231 single backplate 225 26, 229 MPW see multi-project wafer multi-chip design 202 3 multi-die assemblies 218 19, 241 multi-die packaging 141 multi-project wafer (MPW) 252 55, 257, 259 multi-wafer architectures 193 multi-wafer cassette 40, 67 net present value (NPV) 270 71 nickel 102 4 metallic 102 nitrous oxide 43, 46 NPV see net present value optical mask aligner 32 33, 35 36 optical wafer projector 83 optical wafer stepper 33, 36 40, 78 optical wafer stepper simulator 41 oxidation 134, 137 packaging, wafer-level 126, 132 packaging cost estimates 279 packaging machine simulator 174 75, 177 PBT see profit before taxation PECVD see plasma-enhanced chemical vapour deposition PECVD silicon oxide 232 physical vapour deposition (PVD) 51 plasma-enhanced chemical vapour deposition (PECVD) 22, 41, 44 45, 47, 205, 231 polysilicon 13 14, 19 20, 22, 31, 41, 43 45, 54, 58, 63, 205, 231, 253, 259 pressure, acoustic 225, 228 29 pressure sensors 2, 5, 97, 140, 280 probe card 115 18 probe tips 116 processes accelerometer-manufacturing 205 drying 104 5 in-house imems 202 semiconductor 175, 252 thin-film 14, 194 wafer-bonding 100 profit, taxable 268 69 profit before taxation (PBT) 267 69 profit margin 130, 184, 188 89, 214 15, 220, 239, 250 52, 260, 267, 273, 277 PVDsee physical vapour deposition QFN see quad flat no. quad flat no. (QFN) 125, 169 radio frequency 2, 44, 54 reactive-ion etching (RIE) 2, 57 59, 70, 77, 79, 81, 142, 171, 205, 280 resist negative-acting 15 16 patterned 19 20 positive-acting 15 16
288 Index resist exposure 17, 37, 92 resist sensitivity 65 67 resist thickness 32, 34, 89 90, 93 94, 110 reticles 15, 17 19, 37, 39, 254 55, 259 RIEsee reactive-ion etching RIE machine 58 59 RIE simulator 58 Rock s law 152, 154 55, 247 sacrificial layer 2, 14, 19 22, 205, 231, 253 semiconductor devices 1, 73 semiconductor factory 152, 154, 157 semiconductor industry 2, 6, 8 9, 13 14, 19, 23, 29, 38, 125, 127, 150, 152, 166, 247 semiconductors 51, 54, 73, 116 17, 119, 194 sensor, comb-capacitive 205 6 signal-processing electronics 15, 200 silane 43, 45 silicon 2 6, 8, 10, 13 14, 19, 22, 47 48, 54 55, 61, 63, 76, 78, 80, 94 97, 228 silicon-based fabrication technology 14 silicon-based MEMS microphones 4 silicon-based MEMS processes 19 silicon dioxide 13, 41, 43, 45, 48, 50, 53 silicon MEMS 11, 15, 21 silicon micromachining 94 silicon nitride 14, 19 20, 22, 41, 43 45, 53, 253 silicon oxide 13, 19 20, 205, 231, 253 silicon substrate 20, 51, 54, 192, 205, 231 silicon wafer 22, 94, 142 diced 132 silicon wafer bonding 3 single-die design 201, 218, 220 single-die devices 172, 216 solders 97 98 sputtering 51, 58 surface microengineering 8, 14, 31, 70, 96, 247 surface micromachining 31 32, 34, 36, 38, 40, 42, 44, 46, 48, 50, 52, 54, 56, 58, 60 synchrotron 86 89 technology semiconductor 33, 162 silicon-based 14, 225 test post-packaging 168, 172, 178, 215 16 pre-packaging 177, 216 semiconductor device 8 wafer-level 177 tester device-level 121 wafer-level 121 tetraethyloxysilane 43, 45 thermal oxide deposition 47, 50 thermal oxide growth 46 47, 49 thermal oxide reactor 47 48 time-multiplexed optical shutter (TMOS) 5 TMOSsee time-multiplexed optical shutter transistors 185 tungsten 44, 51, 58, 63, 103 UV LIGA 90 93 UV LIGA simulator 93 94 UV LIGA wafers 93
Index 289 vectorscan machines 64 65, 68 wafer aligner 18, 32 34, 91, 193 94, 258 59, 274 optical 35 wafer aligner machine simulator 35 wafer aligner mask 17 18, 40 wafer aligner resolution 34 wafer bonding 2, 8, 97 101, 193 wafer-bonding simulator 100 1 wafer dicing 131, 139 wafer fabrication 172, 174, 218, 254 wafer handling 26, 34 wafer stepper 18, 37, 194, 254 wafer thinning 142 wafers bonded 143 circular 23 diced 126, 134 exposed 32 fabricated 143 processed 183 84 unexposed 32 untested 116 wet-etch simulator 55, 57 X-ray LIGA 85, 87, 89 91, 192 X-rays 86 87, 192