Multi-Layer Power Inductors (IP Series)

Multi-Layer Power Inductors (IP Series) For DC/DC Converter Application ORDERING CODE IP R M P S 9 PRODUCT CODE IP : Multilayer Power Inductor (Lead Free) DIMENSION (L X W) Code Dimension EIA. x. mm. X. mm. X. mm. X. mm INDUCTANCE CODE Code R R R R R R Inductance...... (uh) TOLERANCE CODE M: ±% PACKAGING CODE T: Paper tape reel P: Embossed reel SPECIFICATION CODE S: Standard for DC/DC converter L: Light loading current for choke C: High Current Type THICKNESS CODE Code 9 B C Thickness....9.. (mm) REV.Q

ML Power Inductor Standard External Dimensions Unit: mm Series L W T A (Min/Max) IP () IP () IP () IP () IP ().±..±..9 max./..±..±.. max./..±..±.. max./..±..±.. max./..±..±.. max./. Recommended Pad Dimensions Soldering resist Land Pattern SMD Inductor c b a Size mm (EIA) L x W (mm) a (mm) b (mm) c (mm) (). x.. to.. to.. to. (). x.. to.. to..9 to. (). x.. to.. to..9 to. (). x.. to.. to.. to. Unit: mm/(inch)

Power Inductor for DC/DC converter Feature. Small and light weight. Low DC resistance. RoHS complaint Application DC/DC converter for the Mobile equipment; Mobile Phone, DSC, WLAN Part Numbers & Characteristic IP (EIA ) Type Ordering Code Inductance Measuring frequency DCR (ohm) Rated Saturation SRF (MHz.) [uh] Tol [MHz] Max. Typ. Max. Typ. Max. Typ. Min. Thickness (mm) Packing IPRMTS..... Standard IPRMTS. ±%...9. IPRMTS...... ±. Paper kpcs IPRMTS..... Low Profile High Current IPRMTC....9.... ±% ±. IPRMTC....... IPRMPC. ±%..... Operating temperature range from - to.. ±. Paper kpcs Embossed kpcs IP (EIA ) Type Ordering Code Inductance Measuring frequency DCR (ohm) Rated Saturation SRF (MHz.) [uh] Tol. [MHz] Max. Typ. Max Typ. Max. Typ. Min. Thickness (mm) Packing IPRMPS9...9.. IPRMPS9..... Standard # IPRMPS9....9.9 9 ±% IPRMPS9....9..9 ±. Embossed kpcs IPRMPS9...9.. IPRMPS9..... High Current # IPRMPC9...... IPRMPC9. ±%..... IPRMPC9.......9 ±. Embossed kpcs # Operating temperature range from - to. # Operating temperature range from - to. REV.Q

Power Inductor for DC/DC converter & Choke ML Power Inductor IP (EIA ) Type Ordering Code Inductance Measuring Frequency DCR (ohm) Rated Saturation SRF (MHz.) [uh] Tol. [MHz] Max. Typ. Min. Typ. Max. Typ. Min. Thickness (mm) Packing IPRMPS9..... IPRMPS9..... Standard # IPRMPS9..... ±% IPRMPS9......9 ±. Embossed kpcs IPRMPS9..... IPRMPS9....9. Low Profile # IPRMPC. ±%..... ±. Embossed kpcs High Current # IPRMPC9...... IPRMPC9. ±%......9 ±. Embossed kpcs IPRMPC9...... # Operating temperature range from - to. # Operating temperature range from - to. IP (EIA ) Type Ordering Code Inductance Measuring frequency [MHz] DCR (ohm) Rated Saturation SRF (MHz.) Thickness [uh] Tol Max. Typ. Max. Typ. Max. Typ. Min. (mm) Packing IPRMPS9...... IPRMPS9.....9. 9 Standard IPRMPS9...... ±% IPRMPS9...9....9 ±. Embossed kpcs IPRMPS9...9... IPRMPS9...... Low Profile IPRMPC. ±%.9...... ±. Embossed kpcs Operating temperature range from - to. Rated current specifies that temperature rise caused by self-generated heat shall be limited to max Saturated current specifies that inductance drop is below % during DC loaded (at )

Indantance (uh) Electric Properties DC Bias characteristics (Inductance vs. DC Bias) Standard Low Profile High Current IP_C (Typ./T=. mm) IP_C (Typ./T=. mm) R R R...... IP_S9 (Typ./T=.9 mm) IP_C (Typ./T=. mm) R R R R...... IP_S9 (Typ./T=.9 mm) R R R R... DC Bias (A) REV.Q

Power Inductor for DC/DC converter & Choke Temperature rising ( ) ML Power Inductor Temperature rising ( ) Temperature rising ( ) Temperature rising ( ) DC Bias characteristics (Temperature Rising vs. DC Bias) Low Profile High Current IP_C (Typ./T=. mm) IP_C (Typ./T=. mm) R R R..........9.............9... IP_C9 (Typ./T=.9 mm) R R........... IP_C (Typ./T=. mm) R.....

Indantance (uh) Inductance vs Frequency Standard Low Profile High Current IP_C (Typ./T=. mm) IP_C (Typ./T=. mm) R R R IP_S9 (Typ./T=.9 mm) IP_S (Typ./T=. mm) IP_C9 (Typ./T=.9 mm) R R R R R R R R R IP_S9 (Typ./T=.9 mm) IP_C (Typ./T=. mm) IP_C9 (Typ./T=.9 mm) R R R R R R R IP_S9 (Typ./T=.9 mm) R R R R Frequence (MHz) REV.Q

Power Inductor for DC/DC converter & Choke ML Power Inductor Testing Condition & Requirements (IP Series) No. Item Test Condition Requirements Appearance Inductors shall be visually inspected for visible evidence of defect. No harmful defect for piratical use. Inductance a. Temperature: +/- b. Relative Humidity: to %RH c. Measuring equipment: HPA HPA Measuring Jig: HP- Within specified tolerance. DC Resistance Measuring instrument: HPB HIOKI IM- Dimension Dimension shall be measured with caliper or micrometer In accordance with electrical specification. In accordance with dimension specification. Solder-ability Immerse a test sample into a methanol solution containing rosin and immerse into SAC(Sn9.Ag.Cu.) solder of ± for ± seconds. 9% of the termination is to be soldered evenly and continuously. Resistance to Soldering Heat Immerse a test sample into a methanol solution containing resin, preheat it at to for ~ minutes and immerse into molten solder of +/- for +/- second so that both terminal electrodes are completely submerged. After this test samples shall be taken out and measured after kept at room temperature for to hours. No visible damage Remained terminal electrode : % min. Inductance variation within % Solder the chip to test jig then apply a force in the direction shown in below. The soldering shall be done with the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock. Bending Strength R Pressurizing speed :.mm/sec. Pressurize No mechanical damage shall be observed. Capacitance Meter Flexure : mm Thermal Shock Solder a test sample to printed circuit board, and conduct cycles of test under the conditions shown as below. Condition for cycle Step:-+ / - ± min. Step: Room temperature within to min. Step:+ + / - ± min. Measured at room temperature after placing for to hrs. No visible damage Inductance variation within %

No. Item Test Condition Requirements 9 High Humidity State Life Test Keep a test sample in an atmosphere with a temperature of ±, 9~9%RH for +/- hours. After the removal from test chamber, to hours of recovery under standard condition, and measurement shall be made after ± hrs of recovery under standard condition. No visible damage. Inductance variation within %. High Humidity Load Life Test High Temperature State Life Test High Temperature Load Solder a test sample to printed circuit board then keep the test sample in an atmosphere with a temperature of ±, 9~9%RH for +/- hours while supplying the rated current. After the removal from test chamber, to hours of recovery under standard condition, and measurement shall be made after ± hrs of recovery under standard condition. Keep a test sample in an atmosphere with a temperature of ± for +/- hours. After the removal from test chamber, to hours of recovery under standard condition, and measurement shall be made after ± hrs of recovery under standard condition. Solder a test sample to printed circuit board then keep the test sample in an atmosphere with a temperature of ± for +/- hours while supplying the rated current. After the removal from test chamber, to hours of recovery under standard condition, and measurement shall be made after ± hrs of recovery under standard condition. No visible damage. Inductance variation within %. No visible damage. Inductance variation within %. No visible damage. Inductance variation within %. 9 REV.Q

Temperature ( ) Power Inductor for DC/DC converter & Choke ML Power Inductor Temperature ( ) Reflow Profile Chart (Reference) Wave Soldering T Soldering to Gradual Natural Cooling Preheating sec. ~ sec. sec. max. Time (sec.) Chip Size and smaller and above Preheating T - Soldering Iron.Soldering iron wattage W maximum..iron-tip diameter.mm maximum. Soldering to T Gradual Natural Cooling Preheating sec. ~ sec. sec. max. Time (sec.) Chip Size and smaller and above Preheating T 9 T

Temperature ( ) Temperature ( o C) Soldering Profile for SMT Process with Lead Free Solder Paste. The rate of preheat should not exceed /sec and a target of /sec is preferred. Ceramic chip components should be preheated to within to of the soldering. Soldering o C to o C Within sec. Gradual Natural Cooling Preheating sec. min. sec. max. Over o C Within 9 sec. Time (sec.) Soldering Profile for SMT Process with SnPb Solder Paste. The rate of preheat should not exceed /sec and a target of /sec is preferred. Ceramic chip components should be preheated to within to of the soldering. Soldering to ~ sec. Gradual Natural Cooling Preheating sec. min. Within sec. Time (sec.) sec. max. REV.Q

Power Inductor for DC/DC converter & Choke ML Power Inductor Packaging Specification Paper Tape Chip cavity Symbol Product Size Code () () () () (mm) (mm) (mm) (mm) A.±..±.. ±.. ±. B.±..±.. ±.. ±. Insertion Pitch F ±. ±.. ±.. ±. Tape Thickness T. max. max. max. max Embossed Tape mm pitch tape P P D P E K T A F W B D Direction of feed Top tape T Symbol () () () () P ±. ±. ±. ±. P O ±. ±. ±. ±. P ±. ±. ±. ±. A.±..±..±..±. B.±..±..±..±. K. Max.±..±..±. W ±. ±. ±. ±. E.±..±..±..±. F.±..±..±..±. D.... (+./-.) (+./-.) (+./-.) (+./-.) T. ±.. max. max. max

Unit: mm/(inch) Reel Specifications Tape Width (mm) G (mm) T max.(mm) D (mm).±.. ±. Packing Rule EIA SIZE Tape Reel Size Reels/Box Boxes/ Carton Paper " Paper/Emboss " Paper/Emboss " Paper/Emboss " Paper/Emboss " Peel Strength of Top Cover Tape The peel speed shall be about mm/min. The peel strength of top cover tape shall be between. to.n. REV.Q

Power Inductor for DC/DC converter & Choke ML Power Inductor Label Information Date Code Part No. Specification Lot No. Cautions Storage. The inductor shall be packaged in carrier tapes. Quantity. To keep storage place temperature from + to, humidity from to % RH.. The storage atmosphere must be free of gas containing sulfur and chlorine. Also, avoid exposing the product to saline moisture. If the product is exposed to such atmospheres, the terminals will oxidize and solderability will be affected.. The solder ability is assured for months from our final inspection date if the above storage condition is followed. Handling Inductor should be handled with care to avoid contamination or damage. The use of vacuum pick-up or plastic tweezers is recommended for manual placement. Tape and reeled packages are suitable for automatic pick and placement machine.