500mA Standalone Linear Li-Ion Battery Charger. Features

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500mA Standalone Linear LiIon Battery Charger General Description The is a complete constantcurrent/constant voltage linear charger for single cell lithium ion batteries. Its SOT235 package and low external component count make the ideally suited for portable applications. Furthermore, the is specifically designed to work within USB power specifications. No external sense resistor is needed, and no blocking diode is required due to the internal MOSFET architecture. Thermal feedback regulates the charge current to limit the die temperature during high power operation or high ambient temperature. The charge voltage is fixed at 4.2V, and the charge current can be programmed externally with a single resistor. The automatically terminates the charge cycle when the charge current drops to 1/10th the programmed value after the final float voltage is reached. When the input supply (wall adapter or USB supply) is removed, the automatically enters a low current state, dropping the battery drain current to less than 1µA. Other features include charge current monitor, automatic recharge and a status pin to indicate charge termination and the presence of an input voltage. Features Programmable Charge Current Up to 500mA No MOSFET, Sense Resistor or Blocking Diode Required ConstantCurrent/ConstantVoltage Operation with Thermal Regulation to Maximize Charge Rate Without Risk of Overheating 4.2V Charge Voltage with ± 1% Accuracy Charge Current Monitor Output for Gas Gauging Automatic Recharge 2.9V Trickle Charge Threshold C/10 Charge Termination Output OCP Charging OTP Package in SOT235 Typical Application Circuit Vin Order Information F:PbFree 10uF LED R 4 1 2 VIN BAT CHRG GND ISET B5F 3 5 5K 1uF BATT Applications Package Type B5:SOT235 Portable Media Players/MP3 players Cellular and Smart mobile phone PDA/DSC Bluetooth Applications Marking Information Part Marking Package Shipping B5F LPS BFYWX SOT235 3K/REEL Marking indication: Y:Production year W:Production week X:Production batch. Aug.2017 Email: marketing@lowpowersemi.com www.lowpowersemi.com Page 1 of 7

Functional Pin Description Package Type Pin Configurations Top View STAT 1 5 ISET SOT235 GND 2 BAT 3 4 VIN Pin Name Description 1 CHRG OpenDrain Charge Status Output. When the battery is charging, the CHRG pin is pulled low by an internal Nchannel MOSFET. When the detects an under voltage lockout condition or charge complete, CHRG is forced high impedance. 2 GND Ground. 3 BAT Charge Current Output. Provides charge current to the battery and regulates the final float voltage to 4.2V. An internal precision resistor divider from this pin sets the float voltage. 4 VIN Positive Input Supply Voltage. 5 ISET Charge Current Program and Charge Current Monitor Pin. The charge current is programmed by connecting a 1% resistor, RISET, to ground. When charging in constantcurrent mode, this pin servos to 1V. In all modes, the voltage on this pin can be used to measure the charge current using the following formula: IBAT=1000/RISET Aug.2017 Email: marketing@lowpowersemi.com www.lowpowersemi.com Page 2 of 7

Function Block Diagram 4 125 TDIE TA 1X VIN 1000X MA 5μA BAT 3 R1 CA VA R2 SHDN C1 R3 REF 1.22V 1V R4 1 CHRG C2 0.1V R5 C3 TO BAT VCC 2.9V 3μA ISET GND 5 2 Absolute Maximum Ratings Note1 Input to GND(VIN) 0.3V to 8V Other Pin to GND 0.3V to 6V BAT Shortcircuit Duration Continuous Maximum Junction Temperature 125 Operating Junction Temperature Range (TJ) 20 to 85 Maximum Soldering Temperature (at leads, 10 sec) 260 Note1. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Thermal Information Maximum Power Dissipation (SOT235, PD, TA=25 C) 0.45W Thermal Resistance (SOT235, JA) 250 /W Aug.2017 Email: marketing@lowpowersemi.com www.lowpowersemi.com Page 3 of 7

ESD Susceptibility HBM(Human Body Mode) 2KV MM(Machine Mode) 200V Electrical Characteristics (TA = 25. VIN = 5V, unless otherwise noted.) SYMBOL PARAMETER CONDITIONS MIN TYP. MAX UNITS V IN Adapter/USB Voltage Range 3.9 5 6 V IIN Input Supply Current Charge Mode, RISET= 10K 300 1000 Standby Mode (Charge Terminated) 50 200 ua VFLOAT Regulated Output (Float) Voltage 0 TA 85, IBAT = 40mA 4.158 4.2 4.242 V I BAT BAT Pin Current RISET = 10K,Current Mode 80 100 120 ma R ISET = 2K,Current Mode 400 500 600 Standby Mode, V BAT = 4.2V 0 ±1 ua Sleep Mode, VIN = 0V VTRIKL Trickle Charge Threshold Voltage RISET = 10k, VBAT Rising 2.9 V VTRHYS Trickle Charge Hysteresis Voltage RISET = 10K 100 mv ITRIKL Trickle charge current VBAT < VTRIKL, RISET =10K 40 VBAT < VTRIKL, RISET=2K 200 ma VUV VIN Undervoltage Lockout Threshold From VIN Low to High 3.7 3.8 3.9 V VUVHYS VIN Undervoltage Lockout Hysteresis 150 200 300 mv VASD VIN VBAT Lockout Threshold Voltage 150 mv VISET ISET Pin Voltage RISET = 10K,Charge Mode 1 V V CHRG CHRG Pin Output Low Voltage I CHRG = 5mA 0.5 V ΔVRECHRG Recharge Battery Threshold Voltage VFLOAT VR ECHRG 100 150 200 mv Aug.2017 Email: marketing@lowpowersemi.com www.lowpowersemi.com Page 4 of 7

Applications Information The is a single cell lithiumion battery charger using a constantcurrent/constantvoltage algorithm. It can deliver up to 500mA of charge current (using a good thermal PCB layout) with a final float voltage accuracy of ± 1%. The includes an internal Pchannel power MOSFET and thermal regulation circuitry. No blocking diode or external current sense resistor is required; thus, the basic charger circuit requires only three external components. Furthermore, the is capable of operating from a USB power source. Normal Charge Cycle A charge cycle begins when the voltage at the VIN pin rises above the UVLO threshold level and a 1% program resistor is connected from the ISET pin to ground or when a battery is connected to the charger output. If the BAT pin is less than 2.9V, the charger enters trickle charge mode. When the BAT pin voltage rises above 2.9V, the charger enters constantcurrent mode, where the programmed charge current is supplied to the battery. When the BAT pin approaches the final float voltage (4.2V), the enters constantvoltage mode and the charge current begins to decrease. When the charge current drops to 1/10 of the programmed value the charge cycle ends. Programming Charge Current The charge current is programmed using a single resistor from the ISET pin to ground. The battery charge current is 1000 times the current out of the ISET pin. The program resistor and the charge current are calculated using the following equations: R ISET=1000 I BAT, IBAT=1000 RISET The charge current out of the BAT pin can be determined at any time by monitoring the ISET pin voltage using the following equation: IBAT=VISET RISET 1000 Charge Status Indicator (CHRG) The charge status output has two different states: strong pulldown (~10mA) and high impedance. The strong pulldown state indicates that the is in a charge cycle. High impedance indicates that the charge cycle complete or the is in under voltage lockout mode: either VIN is less than 100mV above the BAT pin voltage or insufficient voltage is applied to the VIN pin. A microprocessor can be used to distinguish between these two states. Charge Stage CHRG Pin Status Charging Low Charge Complete High Charge Termination A charge cycle is terminated when the charge current falls to 1/10th the programmed value after the final float voltage is reached. This condition is detected by using an internal, filtered comparator to monitor the ISET pin. When the ISET pin voltage falls below 100mV for longer than TTERM (typically 1ms), charging is terminated. The charge current is latched off and the enters standby mode, where the input supply current drops to 200µA. When charging, transient loads on the BAT pin can cause the ISET pin to fall below 100mV for short periods of time before the DC charge current has dropped to 1/10th the programmed value. The 1ms filter time (TTERM) on the termination comparator ensures that transient loads of this nature do not result in premature charge cycle termination. Once the average charge current drops below 1/10th the programmed value, the terminates the charge cycle and ceases to provide any current through the BAT pin. In this state, all loads on the BAT pin must be supplied by the battery. The constantly monitors the BAT pin voltage in standby mode. If this voltage drops below the 4.05V recharge threshold (VRECHRG), another charge cycle begins and current is once again supplied to the battery. To manually restart a charge cycle when in standby mode, the input voltage must be removed and reapplied. Aug.2017 Email: marketing@lowpowersemi.com www.lowpowersemi.com Page 5 of 7

Thermal Limit An internal thermal feedback loop reduces the programmed charge current if the die temperature attempts to rise above a preset value of approximately 125. This feature protects the from excessive temperature and allows the user to push the limits of the power handling capability of a given circuit board without risk of damaging the. The charge current can be set according to typical (not worstcase) ambient temperature with the assurance that the charger will automatically reduce the current in worstcase conditions. Under voltage Lockout (UVLO) An internal under voltage lockout circuit monitors the input voltage and keeps the charger in shutdown mode until VIN rises above the under voltage lockout threshold.the UVLO circuit has a builtin hysteresis of 200mV. Furthermore, to protect against reverse current in the power MOSFET, the UVLO circuit keeps the charger in shutdown mode if V IN falls to within 150mV of the battery voltage. If the UVLO comparator is tripped, the charger will not come out of shutdown mode until VIN raises 150mV above the battery voltage. Automatic Recharge Once the charge cycle is terminated, the continuously monitors the voltage on the BAT pin using a comparator with a 2ms filter time (TRECHARGE). A charge cycle restarts when the battery voltage falls below 4.05V (which corresponds to approximately 80% to 90% battery capacity). This ensures that the battery is kept at or near a fully charged condition and eliminates the need for periodic charge cycle initiations. CHRG output enters a strong pulldown state during recharge cycles. Power Dissipation The conditions that cause the to reduce charge current through thermal feedback can be approximated by considering the power dissipated in the IC. Nearly all of this power dissipation is generated by the internal MOSFET this is calculated to be approximately: PD=(VINVBAT) IBAT Where PD is the power dissipated, VIN is the input supply voltage, VBAT is the battery voltage and IBAT is the charge current. The approximate ambient temperature at which the thermal feedback begins to protect the IC is: TA=125 PDθJA T A=125 (V INV BAT) I BAT θ JA Example: An operating from a 5V USB supply is programmed to supply 300mA fullscale current to a discharged LiIon battery with a voltage of 3.75V. Assuming θja is 250 /W (see Board Layout Considerations), the ambient temperature at which the will begin to reduce the charge current is approximately: TA=125 (5V3.75V) (300mA) 250 /W T A=125 0.375W 250 /W=31.25 Moreover, when thermal feedback reduces the charge current, the voltage at the ISET pin is also reduced proportionally as discussed in the Operation section. It is important to remember that applications do not need to be designed for worstcase thermal conditions since the IC will automatically reduce power dissipation when the junction temperature reaches approximately 125. VIN Bypass Capacitor Many types of capacitors can be used for input bypassing; however, caution must be exercised when using multilayer ceramic capacitors. Because of the selfresonant and high Q characteristics of some types of ceramic capacitors, high voltage transients can be generated under some startup conditions, such as connecting the charger input to a live power source. Adding a 1.5Ω resistor in series with an X5R ceramic capacitor will minimize startup voltage transients. Layout Considerations For the main current paths as indicated in bold lines, keep their traces short and wide. Put the input capacitor as close as possible to the device pins (VIN and GND). Connect all analog grounds to a command node and then connect the command node to the power ground behind the output capacitors. Aug.2017 Email: marketing@lowpowersemi.com www.lowpowersemi.com Page 6 of 7

Packaging Information SOT235 Aug.2017 Email: marketing@lowpowersemi.com www.lowpowersemi.com Page 7 of 7