Deutsche Bank AutoTech Day

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Transcription:

Deutsche Bank AutoTech Day Peter Schiefer Division President Automotive London, 22 June 2018

Infineon is well positioned in its addressed automotive product segments Automotive semiconductors 2017 total market size: $34.5bn NXP Infineon Renesas TI STM 12.5% 10.8% +0.1%-pt 10.0% 8.0% 7.1% Market share trend Infineon benefits disproportionately from the two mega trends ADAS/AD clean cars Sensors Microcontrollers Power Bosch Infineon NXP Melexis ON Semi 17.4% 12.9% +0.4%-pt 7.7% 7.5% 7.2% Renesas NXP TI Infineon Microchip 31.2% 27.8% 9.4% 8.5% -0.2%-pt 5.8% Infineon STM Bosch TI NXP +0.4%-pt 26.0% 12.5% 9.1% 8.3% 6.5% long-term drivers: 24 / 77 GHz Radar Lidar long-term drivers: ADAS/AD Powertrain long-term drivers: xev penetration EPS Lighting Source: Strategy Analytics, "Automotive Semiconductor Vendor Market Shares", April 2018 2

Electro-mobility

CO 2 emission values [g/km], normalized to NEDC xev growth driven by emission regulation; but consumer preferences thwart CO 2 reduction CO 2 emission development and regulations for main regions Two consumer trends countervail CO 2 reduction 200 150 100 China 2020 : 5 l/100 km Japan 2020: 20.3 km/l* US 2021 : 44.7 mpg (1) SUV share of registered cars in Europe 1) 26 % 40 % 2016 2022 constantly increasing share of heavy ICE SUVs (~150 g CO 2 /km) prevents fleet average to come down (2) Diesel share of registered cars in Europe 2) 50 EU 2021: 95 g CO 2 /km actual enacted proposed 0 2000 2005 2010 2015 2020 2025 *Note: Japan has already met its 2020 statutory target as of 2013 Source: 1) IHS Markit, Automotive Group, Report, January 2018 2) IHS Markit, Automotive Group, Light Vehicle Alternative Propulsion Forecast, March 2018 47 % 36 % 2016 2022 Lower positive contribution of Diesel (~15% less CO 2 emissions than gasoline) due to reduced acceptance 4

ICE sensors µc power* others* total semi BoM ICE sensors µc power* others* total semi BoM sensors µc power* others* total semi BoM The incremental demand of power semiconductors is a significant opportunity 2018 average xev semiconductor content by degree of electrification 48 V / MHEV (in 2018) FHEV / PHEV (in 2018) BEV (in 2018) Sense Compute Actuate $300 $25 $740 $455 $95 $750 $375 $5 $20 $75 $0 $475 $375 $15 $20 $120 $80 2018 ~2m vehicles ~2.5m vehicles ~1m vehicles 2020 ~3.5m vehicles ~6m vehicles ~2.5m vehicles 2025 ~17m vehicles ~13m vehicles ~8m vehicles Source: Strategy Analytics, "Automotive Semiconductor Content", May 2018; Infineon estimates * "power" includes linear and ASIC; "others" include opto, small signal discrete, memory 5

SiC follows Infineon's standards wrt quality, application understanding, and portfolio size On-board charger First design-win to ramp in 2019! Main inverter First design-win to ramp in 2020! CoolSiC Automotive MOSFET HybridPACK Drive CoolSiC Increased scalability supports OEM platform strategy More than 20 leading OEMs and tier-1s are evaluating Infineon's SiC solutions for automotive Customer feedback clearly shows that Infineon has deepest understanding of technical quality threats Infineon's internal quality test procedures exceed common industry norm; test results proof that Infineon's SiC products reach that quality level Industry's broadest portfolio allows customer to "pick what they need" rather than to "take what we have" 6

Automated Driving

Automated car Driver For Automated Driving more compute power but also a higher security and safety is needed Sense Interpret & decide Act Camera inside Sensors Camera outside Radar Radar Controllers, algorithms, software specialized sensor processors driving domain controller Actuators Ultrasonic sensor fusion decision making central gateway 8

Increased sensor requirements drive the content in the next 5 years and beyond Application * Radar # of ** More sensors required for any next level of automation NCAP 5 Star, AD L2 AD L3 AD L4/L5 Automatic emergency brake/ forward collision warning Parking assist Valet parking Lane keep assist Highway assist Highway and urban chauffeur Corner MRR/LRR MRR/LRR Imaging 3 6 10 New: Corner starting 2020 Corner Surround Camera # of ** 1 4 8 Lidar # of ** 0 1 1 Others Ultrasonic Ultrasonic Interior camera Ultrasonic Interior camera V2X * Source: VDA (German Association of the Automotive Industry); Society of Automotive Engineers ** Market assumption 9

Infineon opens the door for mass-deployable lidar systems for Automated Driving Classification of long-range lidar systems mechanically moving mirror scanning optical phased array solid state optical system flash lidar scanning MEMS-based mirror + - - proven concept bulky expensive + - allows optical beam forming high demand of laser power, especially for long-range + - entire situation captured in realtime more complex laser system (more expensive, higher power demand) + + + - robust signal path more compact and cost-effective roadmap for higher level of integration more complex to scale field of view Lidar is Infineon s AD portfolio expansion adjacent to radar Infineon intends to repeat its radar success story In addition to MEMS, room to increase BoM by receiver, microcontroller, power management ICs detector diodes 1 st System reference design laser diode MEMS mirror.. receiver Infineon mirror driver FPGA AURIX power supply / power management MEMS mirror 10

Outstanding characteristics make AURIX first-choice µc in the AD platform market AURIX is the market reference as host controller in central computing platforms complementing CPU/GPU to make central computer robust and fail operational AURIX Drive PX2 Go Automated Driving Platform with AURIX Apollo 2.0 Self Driving Platform Safety host monitoring the operation of the data fusion ECU enables ISO 26262 ASIL-D Safe and secure gateway to the vehicle network Fallback operation in case of a GPU/CPU fail Safe communication to actuator control units Awareness for safety and security aspects of AD is increasing rapidly Infineon is cooperating with the leading AD platform providers 11

camera radar lidar sensor fusion total BoM camera radar lidar sensor fusion actuators total BoM camera radar lidar sensor fusion actuators total BoM ADAS/AD semi growth driven by radar and camera sensor over the next 5 years Average semi content per car by level of automation at the given years NCAP 5 Star/AD L2 (~2020) AD L3 (~2025) AD L4/L5 (~2030) Sense Compute Actuate $300 $55 $970 $160 $30 $630 $190 $190 $70 $230 $90 $0 $30 $160 $180 $195 $40 L2 vehicles in 2020: ~6m L3 vehicles in 2025: ~3m L4/L5 vehicles in 2030: ~4m Source: Strategy Analytics; Infineon Bill of material (BoM) contains all type of semiconductors (e.g. radar include µc); sensor fusion does not include memory BoM are projected figures for the respective time frame 12

Security is a system approach As humans, machines, 'things' are getting connected, the risks of security attacks increase strongly as attacks paths increase Example: Automotive Security Accordingly, there is a greater need for security in fields like smart home, connected cars, information and communication technologies, Industry 4.0 Many manufacturers of devices and systems do not have the necessary security know-how 13