Film Capacitors For High Temperature Switches And Power Electronics Applications Above 125 C

Originally presented at 2015 Applied Power Electronics Conference 1 Film Capacitors For High Temperature Switches And Power Electronics Applications Above 125 C by Joe Bond, Operations And Engineering Manager, Electronic Concepts, Eatontown, NJ

Overview of Presentation 2 This presentation is an overview of ECI dielectric research and industry available dielectrics. In this discussion, the bi-axially oriented polypropylene (BOPP) material is used as the benchmark for high-temperature operation.

Overview of Presentation 3 This presentation covers the following topics: The industry need for high temperature caps Wide Band Gap (WBG) semiconductors Department of Energy (DOE) objectives Other applications Standard available dielectric options Overview of characteristics The bi-axially oriented polypropylene (BOPP) benchmark Barriers to high temperature dielectric development Previous dielectric development Electronic Concepts Inc. (ECI) dielectric development and product series ECI continuing development goals for 2015-2017

Industry needs for high temperature capacitors 4 January 15, 2015, President Obama announced that North Carolina State University will lead the Energy Department s new manufacturing innovation institute for the next generation of power electronics. The institute will work to drive down the costs of and build America s manufacturing leadership in wide bandgap (WBG) semiconductor-based power electronics--leading to more affordable products for businesses and consumers, billions of dollars in energy savings and high-quality U.S. manufacturing jobs. (Source: http://energy.gov/articles/wide-bandgap-semiconductors-essential-our-technology-future)

Industry needs for high-temperature capacitors 5 Wide Band Gap (WBG) Semiconductors North Carolina State University is leading Wide Band Gap (WBG) development for the Energy Department. New SiC and GaN semiconductor switches operate at higher temperatures and voltages. Capacitors complementing these switches are needed. Existing plastic dielectric options are limited to 125 C.

Industry needs for high-temperature capacitors 6 Why use Wide Band Gap (WBG) semiconductors? Wide Band Gap Materials: Operate at higher temperatures Operate at higher voltages Operate at higher frequencies Eliminate up to 90% of present technology loses Improve power quality

Industry needs for high-temperature capacitors 7 Why use Wide Band Gap (WBG) semiconductors? Wide Band Gap Materials: Operate at higher temperatures WBG electronic devices operate at temperatures over 300 C (twice the maximum temperature of Si-based devices). This tolerance for higher operating temperature results in better overall system reliability, enables smaller and lighter systems with reduced lifecycle energy use, and creates opportunities for new applications.* *Source: Department of Energy article, Wide Bandgap Semiconductors: Pursuing the Promise (http://energy.gov/articles/wide-bandgap-semiconductors-essential-our-technology-future)

Industry needs for high-temperature capacitors 8 Why use Wide Band Gap (WBG) semiconductors? Wide Band Gap Materials: Operate at higher voltages WBG electronic devices handles voltages more than 10 times higher than Si-based devices, greatly enhancing performance in high-power applications.* *Source: Department of Energy article, Wide Bandgap Semiconductors: Pursuing the Promise (http://energy.gov/articles/wide-bandgap-semiconductors-essential-our-technology-future)

Industry needs for high-temperature capacitors 9 Why use Wide Band Gap (WBG) semiconductors? Wide Band Gap Materials: Operate at higher frequencies WBG electronic devices operate at frequencies at least 10 times higher than Si-based devices, making possible more compact, less costly product designs and opening up a range of new applications, such as radio frequency (RF) amplifiers.* *Source: Department of Energy article, Wide Bandgap Semiconductors: Pursuing the Promise (http://energy.gov/articles/wide-bandgap-semiconductors-essential-our-technology-future)

Industry needs for high-temperature capacitors 10 Why use Wide Band Gap (WBG) semiconductors? Wide Band Gap Materials: Eliminate up to 90% of present technology loses WBG electronic devices eliminate up to 90% of the power losses that currently occur during ac-dc and dc-ac electricity conversion.* *Source: Department of Energy article, Wide Bandgap Semiconductors: Pursuing the Promise (http://energy.gov/articles/wide-bandgap-semiconductors-essential-our-technology-future)

Industry needs for high-temperature capacitors 11 Why use Wide Band Gap (WBG) semiconductors? Wide Band Gap Materials: Improve power quality Ensures more reliable and consistent power electronic device operation.* *Source: Department of Energy article, Wide Bandgap Semiconductors: Pursuing the Promise (http://energy.gov/articles/wide-bandgap-semiconductors-essential-our-technology-future)

12 Industry need for high-temperature capacitors DOE traction inverters The Department of Energy (DOE) objectives for traction inverters are reducing cost and increasing efficiency by doing the following: Remove electronics cooling Run off engine coolant at 90 C to 105 C Withstand 140 C when circuits are non-energized Operate at higher switching frequencies and temperatures (WBG semiconductor incentives) Achieve a high energy density of 4 joule/cc (65.5 joule/in 3 )

13 Industry need for high-temperature capacitors DOE traction inverters The Department of Energy (DOE) objectives for traction inverters are reducing cost and increasing efficiency. For the capacitors, low cost means similar or lower-than-standard BOPP dielectric components.

14 Industry need for high-temperature capacitors DOE traction inverters The Department of Energy (DOE) objectives for traction inverters. Remove electronics cooling. High-temperature electronics eliminate the separate cooling system and devices operate off engine coolant.

15 Industry need for high-temperature capacitors DOE traction inverters The Department of Energy (DOE) objectives for traction inverters Remove electronics cooling. High-temperature electronics eliminate the separate cooling system and devices operate off engine coolant. Run off engine coolant at 90 C to 105 C

16 Industry need for high-temperature capacitors DOE traction inverters The Department of Energy (DOE) objectives for traction inverters Remove electronics cooling. Latent heat specifications project that on shutdown the temperature could rise to 140 C.

17 Industry need for high-temperature capacitors DOE traction inverters The Department of Energy (DOE) objectives for traction inverters Remove electronics cooling. Latent heat specifications project that on shutdown the temperature could rise to 140C. Components must withstand 140 C when circuits are non-energized.

18 Industry need for high-temperature capacitors DOE traction inverters The Department of Energy (DOE) objectives for traction inverters Operate at higher switching frequencies and temperatures. DOE incentives to use wide bandgap semiconductors (WBG) intend to increase switching frequency and decrease capacitor and inductor size and weight.

19 Industry need for high-temperature capacitors DOE traction inverters The Department of Energy (DOE) objectives for traction inverters Achieve a high energy density of 4 joule/cc (65.5 joule/in 3 ) Energy density goals for high-temperature capacitors far exceed the state-of-the-art for 85 C BOPP dc links.

20 DOE Goals for Traction Drive Systems, Power Electronics, and Electric Motors

21 DOE Goals for Traction Drive Systems, Power Electronics, and Electric Motors These goals relate closely to energy density goals. (Source: Susan Rogers, APEEM R&D Vehicle Technologies Program, Electric Drive Status and Challenges, Slides 2-3)

22 DOE Goals for Traction Drive Systems, Power Electronics, and Electric Motors Energy density of existing BOPPcapacitor-based dc links are ~5 j/cu.in. (~0.31 j/cc). (Source: Susan Rogers, APEEM R&D Vehicle Technologies Program, Electric Drive Status and Challenges, Slides 2-3)

23 DOE Goals for Traction Drive Systems, Power Electronics, and Electric Motors Energy density of existing BOPPcapacitor-based dc links are ~5 j/cu.in. (~0.31 j/cc). This does not meet the DOE goal of 65.6 j/cu.in (4 j/cc). (Source: Susan Rogers, APEEM R&D Vehicle Technologies Program, Electric Drive Status and Challenges, Slides 2-3)

24 DOE Goals for Traction Drive Systems, Power Electronics, and Electric Motors Existing BOPP-capacitorbased dc links for traction inverters typically range from: 500 to 1000 µf and 450 to 1200 V dc with 2 to 5 khz typ. switch frequencies producing 200 to 500 A rms ripple currents. (Source: Susan Rogers, APEEM R&D Vehicle Technologies Program, Electric Drive Status and Challenges, Slides 2-3)

25 DOE Goals for Traction Drive Systems, Power Electronics, and Electric Motors Because of the higher cost of high-temperature dielectrics, the best opportunity for film caps is high-frequency WBG switches to drive down the required capacitance.(10x ripple frequency = 1/10 capacitance for same Z). (Source: Susan Rogers, APEEM R&D Vehicle Technologies Program, Electric Drive Status and Challenges, Slides 2-3)

Standard available dielectric options 26 Market available dielectrics BOPP Bi-axially oriented polypropylene PET Polyester PC Polycarbonate PPS Polyphenylene sulfide These are the industrystandard dielectrics available to capacitor manufacturers.

Standard available dielectric options 27 Market available dielectrics BOPP Bi-axially oriented polypropylene PET Polyester PC Polycarbonate PPS Polyphenylene sulfide BOPP dominates the power capacitor market, and is the benchmark new polymers are compared against.

Standard available dielectric options 28 Market available dielectrics BOPP Bi-axially oriented polypropylene PET Polyester PC Polycarbonate PPS Polyphenylene sulfide Polycarbonate is presently not available for new designs.

Standard available dielectric options 29 Market available dielectrics BOPP Bi-axially oriented polypropylene PET Polyester PC Polycarbonate PPS Polyphenylene sulfide ECI is the last global producer of high molecular weight solvent cast polycarbonate for capacitor dielectric. There is a finite resin supply. We continue to look for new sources of the proper resin grade needed to continue production viable for new design.

The polypropylene benchmark 30 As noted previously, standard metallized biaxially oriented polypropylene (BOPP) is the dominant dielectric for power capacitors.

The polypropylene benchmark 31 BOPP s energy density, low losses, self-healing, and low cost set a high standard for comparison to high-temperature dielectrics.

The polypropylene benchmark 32 BOPP s offers: Light weight specific gravity 0.91 Low DF 0.02% through 100 khz Highest dc link energy density (3 to 5 j/in. 3 ) of standard dielectrics Stable capacitance vs. temperature Lowest cost dielectric option Excellent self-healing ability

Overview with high-temperature film 33 Market available dielectrics BOPP Bi-axially oriented polypropylene PET Polyester PC Polycarbonate PPS Polyphenylene sulfide UH3, HT150, and HT175 are ECI s proprietary hightemperature dielectrics.

Overview with high-temperature film 34 UH3, HT150, and HT175 are ECI s proprietary hightemperature dielectrics. In these graphs, HT150 and HT175 referenced to standard industry dielectrics.

Overview with high-temperature film 35 UH3, HT150, and HT175 are ECI s proprietary hightemperature dielectrics. Capacitance stability versus temperature for HT150 and HT175 is better than BOPP.

Overview with high-temperature film 36 UH3, HT150, and HT175 are ECI s proprietary hightemperature dielectrics. High-temperature insulation resistance for HT150 and HT175 is better than BOPP over 100 C.

Overview with high-temperature film 37 UH3, HT150, and HT175 are ECI s proprietary hightemperature dielectrics. High-temperature dissipation factor for HT150 and HT175 provides low ESR in dc link banks.

Dielectric comparisons 38 Notes on following comparison slides Basic winding volume and weight in graphics are based on unpackaged capacitor windings. Data is based on present state-of-the-art for dc links using a design comparison of 1000 µf/1000 V dc design varied by dielectric and present (2014) design stresses for each dielectric.

Present DC Link Energy Densities 39 These graphs show an energy comparison of dielectrics including ECI proprietary HT150 and HT175 at 2014 design levels.

40 Present DC Link Energy Densities Graphic on right represents dc link energy densities. It s important to note that energy density of BOPP in snubbers (~0.7 to 1 j/in. 3 ) is already available for HT150 and HT175.

Present DC Link Energy Densities 41 HT150 and HT175 are already qualified to stress levels equivalent to many market available BOPP snubbers enabling direct size replacements for many snubber and resonant capacitors at higher temperature ratings.

Present DC Link Energy Densities. 42 HT150 and HT175 qualifications at maximum temperature translate to high reliability at lower temperatures.

ECI Available high-temperature dielectrics 43 Polycarbonate (125 C) QPL 83421, 55514, several industrial series under MC and 5MC PPS (125 C) QPL MIL-PRF-83421/06 (hermetic seal), MU series (wrap & fill) UH (125 C) UH3 series (plastic case - ripple filter) Teflon (200 C) MT1 series (wrap & fill down hole) HT-150 (150 C) HT1 series (plastic case - snubber) HT-175 (175 C) 5HT46 series (plastic cased - resonant supplies) Application specific designs using any of the above dielectrics (metallized or film-foil)

ECI Available high-temperature dielectrics 44 Polycarbonate (125 C) QPL 83421, 55514, several industrial series under MC and 5MC PPS (125 C) QPL MIL-PRF-83421/06 (hermetic seal), MU series (wrap & fill) UH (125 C) UH3 series (plastic case - ripple filter) Teflon (200 C) MT1 series (wrap & fill down hole) HT-150 (150 C) HT1 series (plastic case - snubber) HT-175 (175 C) 5HT46 series (plastic cased - resonant supplies) Application specific designs using any of the above dielectrics (metallized or film-foil) PC is produced by ECI film division, but is not recommended for new designs due to finite resin availability.

ECI Available high-temperature dielectrics 45 Polycarbonate (125 C) QPL 83421, 55514, several industrial series under MC and 5MC PPS (125 C) QPL MIL-PRF-83421/06 (hermetic seal), MU series (wrap & fill) UH (125 C) UH3 series (plastic case - ripple filter) Teflon (200 C) MT1 series (wrap & fill down hole) HT-150 (150 C) HT1 series (plastic case - snubber) HT-175 (175 C) 5HT46 series (plastic cased - resonant supplies) Application specific designs using any of the above dielectrics (metallized or film-foil) PPS has limited availability by Toray s production schedule.

ECI Available high-temperature dielectrics 46 Polycarbonate (125 C) QPL 83421, 55514, several industrial series under MC and 5MC PPS (125 C) QPL MIL-PRF-83421/06 (hermetic seal), MU series (wrap & fill) UH (125 C) UH3 series (plastic case - ripple filter) Teflon (200 C) MT1 series (wrap & fill down hole) HT-150 (150 C) HT1 series (plastic case - snubber) HT-175 (175 C) 5HT46 series (plastic cased - resonant supplies) Application specific designs using any of the above dielectrics (metallized or film-foil) Teflon (PTFE) has low energy density, is heavy and expensive.

ECI Available high-temperature dielectrics 47 Polycarbonate (125 C) QPL 83421, 55514, several industrial series under MC and 5MC PPS (125 C) QPL MIL-PRF-83421/06 (hermetic seal), MU series (wrap & fill) UH (125 C) UH3 series (plastic case - ripple filter) Teflon (200 C) MT1 series (wrap & fill down hole) HT-150 (150 C) HT1 series (plastic case - snubber) HT-175 (175 C) 5HT46 series (plastic cased - resonant supplies) Application specific designs using any of the above dielectrics (metallized or film-foil) UH is lower cost 125 C alternative to PPS or PC.

ECI Available high-temperature dielectrics 48 Polycarbonate (125 C) QPL 83421, 55514, several industrial series under MC and 5MC PPS (125 C) QPL MIL-PRF-83421/06 (hermetic seal), MU series (wrap & fill) UH (125 C) UH3 series (plastic case - ripple filter) Teflon (200 C) MT1 series (wrap & fill down hole) HT-150 (150 C) HT1 series (plastic case - snubber) HT-175 (175 C) 5HT46 series (plastic cased - resonant supplies) Application specific designs using any of the above dielectrics (metallized or film-foil) HT-150 and HT-175 are produced by ECI s film division.

High-temperature dielectric barriers 49 Many lab scale polymers are actively being studied but most do not realize commercialization. Although market demand is growing for high temperature capacitor dielectric, it is still a fraction of what resin manufacturers want to react new polymers. Most resin reactors look for 100-ton markets

High-temperature dielectric barriers 50 A common problem facing many new hightemperature dielectrics is the extreme price compared to the BOPP benchmark. Combined with lower energy densities and higher losses, the products require larger volume and higher dielectric content exaggerating the cost in comparison to BOPP.

ECI UH3 Capacitors 51 UH3 series Proprietary metallized dielectric Lower cost than PPS or PC. Lighter than PET or PPS. Lower loses than PET. Life Tested 2000 hours at 130% Vr at 125 C

ECI UH3 Capacitors 52 UH3 series Proprietary metallized dielectric As with all ECI technologies, these caps are available for application-specific designs.

ECI UH3 Capacitors 53 Capacitance Range 15.0 μf to 120.0 μf Operating Temperature Range -65 C to +125 C Voltage Rating 450 Vdc to 1200 Vdc FEATURES Continuous operation at 125 C Lower cost than PC or PPS Long term available resin UH3 offered with stud or threaded bushings Integrated mechanical mounting Ultra low ESL < 10nH available Metallized UH3 proprietary dielectric capacitors are lower cost than polycarbonate or PPS but still offer 125 C operation.

ECI UH3 Capacitors 54 Capacitance Range 15.0 μf to 120.0 μf Operating Temperature Range -65 C to +125 C Voltage Rating 450 Vdc to 1200 Vdc FEATURES Continuous operation at 125 C Lower cost than PC or PPS Long term available resin UH3 offered with stud or threaded bushings Integrated mechanical mounting Ultra low ESL < 10nH available These capacitors are convenient building block units with integrated mountings.

ECI HT-150 dielectric (150 C capacitors) 55 HT-150 Proprietary metallized dielectric Stable capacitance change vs. temperature and frequency; -5.5% to +3.5% Low dissipation factor vs. temperature and frequency; <2% Very high peak current (>10 x BOPP) Life tested 2000 hours at 130% Vr at 150 C Metallized versions available for snubbers and resonant caps at BOPP energy density at >10x I-pk of BOPP

ECI HT-150 dielectric (150 C capacitors) 56 HT-150 Proprietary metallized dielectric Stable capacitance change vs. temperature and frequency; -5.5% to +3.5% These caps feature tight capacitance stability.

ECI HT-150 dielectric (150 C capacitors) 57 HT-150 Proprietary metallized dielectric Low dissipation factor vs. temperature and frequency; <2% DF decreases with temperature.

ECI HT-150 dielectric (150 C capacitors) 58 HT-150 Proprietary metallized dielectric Life tested 2000 hours at 130% Vr at 150 C Life testing at 130% rated voltage at 150 C produces very high life projections at 100 C to 120 C and typical application voltage of 70% rated voltage.

ECI HT-150 dielectric (150 C capacitors) 59 HT-150 Proprietary metallized dielectric Life tested 2000 hours at 130% Vr at 150 C Further testing planned to define higher energy density gradient at 105 C to 125 C.

ECI HT1 Series snubber - 150 C capacitors 60 Capacitance Range 0.12 µf to 2.2 µf* Operating Temperature Range -55 C to 150 C Voltage Rating 600 V dc to 2400 V dc* *Other values and voltages on request. FEATURES Continuous operation at 150 C Highest peak current capabilities of any metallized film capacitor technology Low loss factors that decrease with temperature Tight capacitance stability versus temperature between -55 C and +150 C Volume efficiency comparable to 85 C polypropylene snubber capacitors like ECI series MP88

ECI HT1 Series snubber - 150 C capacitors 61 Capacitance Range 0.12 µf to 2.2 µf* Operating Temperature Range -55 C to 150 C Voltage Rating 600 V dc to 2400 V dc* *Other values and voltages on request. Snubber caps (HT1 series) have the same energy density as standard BOPP snubbers.

ECI HT1 Series snubber - 150 C capacitors 62 Capacitance Range 0.12 µf to 2.2 µf* Operating Temperature Range -55 C to 150 C Voltage Rating 600 V dc to 2400 V dc* *Other values and voltages on request. HT1 series caps are peak current tested to >1M pulses at >30x BOPP breakdown with no change at 25 C and >500K pulses at >30x BOPP breakdown with no change at 150 C.

ECI HT1 Series snubber - 150 C capacitors 63 Capacitance Range 0.12 µf to 2.2 µf* Operating Temperature Range -55 C to 150 C Voltage Rating 600 V dc to 2400 V dc* *Other values and voltages on request. Design retrofits are available for ECI s snubber lines 5MP2, MP80, MP88, and PT88 and for ECI s dc ripple filtering line UH3.

ECI HT1 Ripple current power test 64-55 C to 150 C 60 µf / 400 V dc 50 A rms & 100 A rms at 20 khz Rth = 3.8 C/W dissipated

ECI HT1 Ripple current power test 65 A 20-kHz ripple current is applied with thermocouples in capacitor center and data is logged relative to terminals and outer surfaces of capacitor.

ECI HT1 Ripple current power test 66 A typical 500 µf/400 V dc (~ 8 x 60 µf shown) dc link bank is capable of 400 A at 105 C and 240 A at 125 C.

ECI HT-175 dielectric (175 C capacitors) 67 HT-175 Proprietary dielectric and foil high-current resonant caps These caps are characterized to 200 C.

ECI HT-175 dielectric (175 C capacitors) 68 HT-175 Proprietary dielectric and foil high-current resonant caps For dc biased ripple filtering, ESR is the heating factor. A 10x increase in DF results in a 2.5x ESR. Thus capacitance values > 100 µf see very little effect of the higher frequency DF due to the low reactance.

ECI HT-175 dielectric (175 C capacitors) 69 HT-175 Proprietary dielectric and foil high-current resonant caps Further testing planned to define higher energy density gradient at 105 C to 150 C.

ECI 5HT Series resonant 175 C capacitors 70 Capacitance Range 0.010 μf to 0.100 μf* Operating Temperature Range -55 C to 175 C Voltage Rating 400 V dc, 230 V ac* *Other values and voltages on request. FEATURES Continuous operation at 175 C Compact configuration Direct plug-in spade lugs Low ESL Low ESR High dv/dt High peak current

ECI 5HT Series resonant 175 C capacitors 71 Capacitance Range 0.010 μf to 0.100 μf* Operating Temperature Range -55 C to 175 C Voltage Rating 400 V dc, 230 V ac* *Other values and voltages on request. These caps use HT-175 proprietary dielectric and foil.

ECI 5HT Series resonant 175 C capacitors 72 Capacitance Range 0.010 μf to 0.100 μf* Operating Temperature Range -55 C to 175 C Voltage Rating 400 V dc, 230 V ac* *Other values and voltages on request. Metallized versions are also available for snubber caps with the same energy density as standard BOPP snubbers.

ECI 5HT Series resonant 175 C capacitors 73 Capacitance Range 0.010 μf to 0.100 μf* Operating Temperature Range -55 C to 175 C Voltage Rating 400 V dc, 230 V ac* *Other values and voltages on request. These caps are peak current tested to >1M pulses at >30x BOPP breakdown with no change at 25 C and to >500K pulses at >30x BOPP breakdown with no change at 175 C.

ECI 5HT Series resonant 175 C capacitors 74 Capacitance Range 0.010 μf to 0.100 μf* Operating Temperature Range -55 C to 175 C Voltage Rating 400 V dc, 230 V ac* *Other values and voltages on request. This series retrofits ECI s snubber lines 5MP2, MP80, MP88, and PT88. Design retrofits are also available for ECI s dc ripple filtering line UH3.

ECI continuing R&D 75 Increase energy density on HT-150 and HT-175 Define stress curve through life Goal to double voltage stress (4x energy density) HT150 and HT175 are both tested and characterized for life at max temperature (150 C and 175 C respectively) and 130% rated voltage. Further testing is planned to study higher voltage stresses at 105 C, 125 C, and 140 C.

ECI continuing R&D 76 Increase energy density on HT-150 and HT-175 Define stress curve through life Goal to double voltage stress (4x energy density) Further advancements in film production and electrode design are under study to increase energy density.

ECI continuing R&D 77 Continue working with resin manufacturers Studying new dielectrics in film labs Continue working with universities. NCSU, VT, PSU, Continue working with government labs. Support DOE projects. ECI is presently working with other polymers in partnerships with many institutions.

78 ECI continuing high-temperature R&D for 2015 to 2017 Continuing development of HT150 and HT175 2014 energy densities equivalent to BOPP snubber lines MP80, MP88, 5MP2 (direct replacements at higher temperature.)

79 ECI continuing high-temperature R&D for 2015 to 2017 ECI s R&D goals for 150 C and 175 C are to achieve increases in energy density, and reductions in volume and cost.

80 ECI continuing high-temperature R&D for 2015 to 2017 ECI looks to partner with WBG users for direct-toswitch mounted hightemperature snubbers. HT150 and HT175 are already qualified for replacing BOPP snubbers in equivalent energy densities. Peak current capabilities of HT150 and HT175 are rated 10x higher than equivalent-sized BOPP snubbers.

Other ECI High-temperature research 81 FPE (>200 C) ECI solvent cast and successfully tested to 300 C, resin cost prohibitive (>> PPS) PEEK (175 C to 200 C) lacks self-healing similar to PPS, ECI stretched and characterized PTFE (>200 C) heavy, low voltage stress, research on-going by resin manufacturer PEN HV (150 C to 175 C) working with DuPont toward power capacitor development Other polymers actively under research with universities, government labs, polymer groups, and private companies

Other ECI High-temperature research 82 FPE (>200 C) ECI solvent cast and successfully tested to 300 C, resin cost prohibitive (>> PPS) PEEK (175 C to 200 C) lacks self-healing similar to PPS, ECI stretched and characterized PTFE (>200 C) heavy, low voltage stress, research on-going by resin manufacturer PEN HV (150 C to 175 C) working with DuPont toward power capacitor development Other polymers actively under research with universities, government labs, polymer groups, and private companies These are other materials being studied and characterized for capacitor dielectrics but not actively designed in dc links for the reasons shown.

Other ECI High-temperature research 83 FPE (>200 C) ECI solvent cast and successfully tested to 300 C, resin cost prohibitive (>> PPS) PEEK (175 C to 200 C) lacks self-healing similar to PPS, ECI stretched and characterized PTFE (>200 C) heavy, low voltage stress, research on-going by resin manufacturer PEN HV (150 C to 175 C) working with DuPont toward power capacitor development Other polymers actively under research with universities, government labs, polymer groups, and private companies Although many high-temperature dielectrics are discussed in conferences and technical bulletins, most are not commercially available for production.

Other ECI High-temperature research 84 FPE (>200 C) ECI solvent cast and successfully tested to 300 C, resin cost prohibitive (>> PPS) PEEK (175 C to 200 C) lacks self-healing similar to PPS, ECI stretched and characterized PTFE (>200 C) heavy, low voltage stress, research on-going by resin manufacturer PEN HV (150 C to 175 C) working with DuPont toward power capacitor development Other polymers actively under research with universities, government labs, polymer groups, and private companies ECI materials research pursues two avenues of studies: Market available materials serving other applications to provide sustained availability not driven by dielectric applications. New polymers at lab scales evaluated in partnership with external organizations for future development.

About The Presenter 85 Joseph A. Bond is currently the operations and engineering manager at Electronic Concepts (ECI) where he has worked since 1984. In his role as operations manager for ECI s corporate headquarters, he oversees the primary design and production facility in New Jersey, while as the engineering manager for ECI New Jersey, he manages product design, process design, and production engineering. Bond also serves as general manager of the ECI Film Division in Massachusetts, corporate officer (secretary) for Energy Storage Corporation; and materials research director for new polymer dielectric development. Previously, Bond worked as a machine designer and builder for melt extruded plastic sheet production equipment and other film product machines at Coburn Corp. and as a lab technician and compound formulator for injection molded products at Irving Miller Co. Bond has published a number of papers and presentations on film capacitors and holds one patent. He is also a member of multiple engineering-focused organizations including IEEE, CPES, WEMPEC, and DOE Freedom car development. In addition, Bond is an annual merit review and peer evaluation reviewer for the U.S. Department of Energy s Hydrogen and Fuel Cells Program, and Vehicle Technologies Program. Bond has completed coursework in electrical engineering at Monmouth University and in civil engineering at Virginia Tech. He also holds a degree in business management from the University of Phoenix. Bond can be reached by phone at 732-542-7880 or via email at jbond@ecicaps.com.

About Electronic Concepts 86 Electronic Concepts, Inc. is an industry leading plastic film capacitor manufacturer incorporated in 1969. Primary markets served include military, medical, aerospace, alternative energy, traction, and industrial power conversion. Global corporation with design and manufacturing in America and Europe. Vertically integrated with: Solvent casting plant producing polymers including polycarbonate and proprietary dielectrics. Full machining capabilities including CNC machining centers, CNC screw machines, punch presses, and other equipment to produce terminals, housings, buss bars, laminates, tooling and production machines. In-house film metallizing and converting capabilities. Full qualification capabilities including environmental and electrical testing and qualification. R&D for materials and capacitors for corporate objectives, universities, industries, and government labs.

About Electronic Concepts 87 Visit our website at ecicaps.com for further information on the available standard product series. Connect with us on Linked In www.linkedin.com/company/electronicconcepts-inc- for the latest product announcements and discussions.

About Electronic Concepts 88 ECI specializes in designing application specific products please contact us to discuss your particular requirement. Phone: 732-542-7880 Email: sales@ecicaps.com