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CofanUSA 46177 Warm Springs Blvd. Fremont CA 94539 1-877-228-3250 www.cofan-usa.com CofanCanada 2900 Langstaff Rd. #18 Vaughan, ON. L4K 4R9 Canada 1-877-228-3250 www.cofan-pcb.com

Contents 1. Super Pillar MCPCB 2. Super Pillar vs. Conventional 3. Thermal Simulation 4. Thermal Simulation Result 5. Thermal Performance Test 6. Conclusion 7. Innovative COB - Outline 8. Intellectual Property - Intellectual Property 1/3 9. Intellectual Property - Intellectual Property 2/3 10. Intellectual Property - Intellectual Property 3/3 11. Quality Assurance & Quality Control 12. Why partner with CofanUSA? 2

Super Pillar MCPCB Concepts Build a Al/Cu Pillar through the MCPCB Bypass the pre-preg to eliminate one layer of thermal resistance Advantages Increase efficiency of thermal dissipation Withstand high power components Drive higher current Allow usage of lower cost pre-preg Super Pillar MCPCB Thermal conductivity = 390 W/(K m) Conventional MCPCB Equivalent conductivity = 2.87W/(K m) Innovative Processes Mechanical shaping Flexible lamination scale Roll-to-roll manufacturing Stable production process Equivalent conductivity = 2 W/(K m) Layer 4 Cu Pillar Layer 3 Cu Foil/Circuit Layer 2 Pre-preg Layer 1 Al or Cu Base 3

Super Pillar MCPCB Super Pillar MCPCB Structure Variation Copper Base and Copper Pillar Aluminum Base and Aluminum Pillar Layer 4 Cu Pillar Layer 3 Cu Foil/Circuit Layer 2 Pre-preg Layer 1 Al or Cu Base Aluminum Base and Copper Pillar 4

Super Pillar MCPCB Applications High Power Flux LED Products General Lighting Outdoor Lighting Metal to Metal Intellectual Property Patent Pending Cost Competitive Conventional Solution Metal to PP Reference Application XML 160W LZP up to 960W 5

Super Pillar vs. Conventional 6

Thermal Simulation Condition and Parameter Single 84W LED chip MCPCB diameter = 50mm Heat source diameter = 9mm Cu Base & Cu Pillar Aluminum heat sink 1) 200mm x 200mm x 100mm 2) Number of fin = 34 3) Pitch = 6mm Ambient Temperature = 35ºC System Domain 1) X = 600mm 2) Y = 300mm 3) Z = 800mm Natural convection 7

Thermal Simulation Result Super Pillar MCPCB Max local temperature = 93.5ºC Thermal resistance = 0.70ºC/W 8

Thermal Simulation Result Conventional MCPCB Max local temperature = 160.5ºC Thermal resistance = 1.49ºC/W 9

Thermal Performance Test Test Location COFAN Electronics R&D Thermal Laboratory Test Environment Inside chamber Temperature: 25 o C +/- 1 o C Test Equipment 1. Constant Temperature Natural Convection Chamber 2. Data Acquisition/Switch Unit Agilent 34970A 3. 20 Channel Multiplexer Module Agilent 34901A 4. Power up the DUT with DC power source 5. Thermocouple OMEGA T-type 36AWG Test Procedure 1. Attach thermocouples to the designated test points 2. Test in natural convection chamber 3. Power up the light module with DC power gradually 4. Let chamber stabilize for 1hr and take temperature data 5. Turn off the power of all equipment 10

Thermal Performance Test T bottom Constant Temperature Chamber Make a groove on the bottom of MCPCB, put thermocouple wire to measure T bottom 11

Thermal Performance Test Designated Points 12

Thermal Performance Test Sample Configuration 13

Thermal Performance Test Cross Sectional View of Super Pillar MCPCB 14

Thermal Performance Test With the same power input, the Super Pillar MCPCB has an extremely low thermal resistance and effective thermal path when compared to Conventional MCPCB. There is a significant temperature difference of ~56 o C within 80 seconds. The Super Pillar decreases the junction temperature drastically. Super Pillar MCPCB Conventional MCPCB See the changes of transient locally relative temperature comparison Capturing interval: 3-4 seconds Time elapsed: ~ 80 Seconds 15

Thermal Performance Test Super Pillar can dissipate heat faster than Conventional MCPCB and reduce the LED temperature significantly. Temperature Profile 16

Thermal Performance Test Test Results Items Unit Conventional MCPCB Super Pillar Super Pillar Model Name P/N MCPCB with LZP (4x6) Emitter MCPCB with LZP (4x6) Emitter MCPCB with LZP (4x6) Emitter LED Current ma 800 780 2800 Input Voltage V 16.4 17.6 19.0 Input Power W 13.12 13.73 53.2 Ta o C 25.37 25.38 25.74 Tslug o C 64.70 55.10 107.28 T bottom o C 46.98 53.57 102.23 T board o C 45.26 49.81 93.96 R slug - bottom o C/W 1.35 0.11 0.095 R slug - board o C/W 1.48 0.39 0.25 17

Conclusion Super Pillar MCPCB provides a direct thermal conductive path for high power LEDs by bypassing the pre-preg layer. As a result, the optical efficiency increases while thermal decay decreases. This allows users to drive components at higher currents while still conserving energy. Super Pillar technology dramatically improves thermal conduction and decrease the junction temperature drastically. 18

Innovative COB - Outline Business Opportunity in LED Lighting Intellectual Property Reflective MCPCB (COB) for LED Backlight Reflective Pocket in PCB (COB) for LED Die Attach MCPCB with Thermal Conductive Pillar Applications LED Backlight for LCD TV LED Front light for E-Book Agriculture & Horticulture Lighting Street & Parking Lot Lighting Market Analysis & Forecast Analysis on the Application Markets 19

Intellectual Property - Intellectual Property 1/3 COFAN Patents in U.S.A, Taiwan, China Invention Reflective Pocket in PCB for LED Die Attach (COB) Pending Advantages Improve output efficiency of LED lighting Avoid photonic absorption and scattering over the pocket wall 20

Intellectual Property - Intellectual Property 2/3 COFAN Patents in U.S.A, Taiwan, China Invention Reflective MCPCB for LED Backlight (COB) Pending Advantages Improve LED Light Guide Efficiency Avoid Loss by surface reflection, absorption and scattering 21

Intellectual Property - Intellectual Property 3/3 COFAN Patents in U.S.A, Taiwan, China Invention MCPCB with Thermal Conductive Pillar (Non-COB) Pending Advantages Improve LED thermal dissipation Allow LED to work in extreme environmental conditions 1) Climate - Arizona summer 2) Installation - Limited space for thermal diffusion Layer 4 Thermal Conductive Pillar Layer 3 Electrode Pads and Circuit Trace Layer 2 Dielectric material. Layer 1 - Thermal Conductive Substrate 22

Quality Assurance & Quality Control Quality Standards ISO 9001:2000 ISO 9001:2008 IPC-6011 IPC-6012B ANSI/IPC-A-600 IPC-4101B UL/CSA 23

Why partner with Cofan-USA? 1. TECHNOLOGY 2. QUALITY 3. RESPONSIVENESS 4. DELIVERY 5. COST Cofan invites you, our prospective customer, to join us as we grow to the next level of success. 24

Thanks. CofanUSA 46177 Warm Springs Blvd. Fremont CA 94539 1-877-228-3250 www.cofan-usa.com CofanCanada 2900 Langstaff Rd. #18 Vaughan, ON. L4K 4R9 Canada 1-877-228-3250 www.cofan-pcb.com