MANTECH ELECTRONICS Internatinal Cmpnents Distributr TEL JHB : (011) 493-9307 CAPE : (021) 535-3150 KZN : (031) 309-7692 FAX : (011) 493-9319 sales@mantech.c.za www.mantech.c.za SMD PACKAGES Cntents 1. Tw-terminal packages 2. Three-terminal packages 3. Packages with fur r mre terminals Surface-munt cmpnents are usually smaller than their cunterparts with leads, and are designed t be handled by machines rather than by humans. The electrnics industry has standardized package shapes and sizes (the leading standardisatin bdy is JEDEC). These include:
Tw-terminal packages Rectangular passive cmpnents (mstly resistrs and capacitrs): 01005 (0402 metric) : 0.016" 0.008" (0.4 mm 0.2 mm) Typical pwer rating fr resistrs 1/32 Watt 0201 (0603 metric) : 0.024" 0.012" (0.6 mm 0.3 mm) Typical pwer rating fr resistrs 1/20 Watt 0402 (1005 metric) : 0.04" 0.02" (1.0 mm 0.5 mm) Typical pwer rating fr resistrs 1/16 Watt 0603 (1608 metric) : 0.063" 0.031" (1.6 mm 0.8 mm) Typical pwer rating fr resistrs 1/16 Watt 0805 (2012 metric) : 0.08" 0.05" (2.0 mm 1.25 mm) Typical pwer rating fr resistrs 1/10 r 1/8 Watt 1206 (3216 metric) : 0.126" 0.063" (3.2 mm 1.6 mm) Typical pwer rating fr resistrs 1/4 Watt 1210 (3225 metric) : 0.126" 0.1" (3.2 mm 2.5 mm) Typical pwer rating fr resistrs 1/2 Watt 1806 (4516 metric) : 0.177" 0.063" (4.5 mm 1.6 mm) 1812 (4532 metric) : 0.18" 0.12" (4.5 mm 3.2 mm) Typical pwer rating fr resistrs 1/2 Watt 2010 (5025 metric) : 0.2" 0.1" (5.0 mm 2.5 mm) 2512 (6332 metric) : 0.25" 0.12" (6.35 mm 3.0 mm) Tantalum capacitrs [2]: EIA 3216-12 (Kemet S, AVX S): 3.2 mm 1.6 mm 1.2 mm EIA 3216-18 (Kemet A, AVX A): 3.2 mm 1.6 mm 1.8 mm EIA 3528-12 (Kemet T, AVX T): 3.5 mm 2.8 mm 1.2 mm EIA 3528-21 (Kemet B, AVX B): 3.5 mm 2.8 mm 2.1 mm EIA 6032-15 (Kemet U, AVX W): 6.0 mm 3.2 mm 1.5 mm EIA 6032-28 (Kemet C, AVX C): 6.0 mm 3.2 mm 2.8 mm EIA 7260-38 (Kemet E, AVX V): 7.2 mm 6.0 mm 3.8 mm EIA 7343-20 (Kemet V, AVX Y): 7.3 mm 4.3 mm 2.0 mm EIA 7343-31 (Kemet D, AVX D): 7.3 mm 4.3 mm 3.1 mm EIA 7343-43 (Kemet X, AVX E): 7.3 mm 4.3 mm 4.3 mm SOD: Small Outline Dide SOD-523: 1.25 0.85 0.65 mm [3] SOD-323: 1.7 1.25 0.95 mm SOD-123: 3.68 1.17 1.60 mm SOD-80C: 3.50mm 1.50mm Mre inf [4] MELF Metal Electrde Leadless Face (mstly resistrs and dides): Barrel shaped cmpnents, dimensins d nt match thse f rectangular references fr identical cdes.
MicrMelf (MMU) Size 0102: L:2.2mm D:1.1mm (slder pad fits rectangular 0805) 1/5 Watt (0.2W) 100V MiniMelf (MMA) Size 0204: L:3.6mm D:1.4mm (slder pad fits rectangular 1206) 1/4 Watt (0.25W) 200V Melf (MMB) Size 0207: L:5.8mm D:2.2mm 1 Watt (1.0W) 500V Three-terminal packages SOT: small-utline transistr, with three terminals SOT-23: 3 mm 1.3/1.75 mm 1.3 mm bdy - three terminals fr a transistr, r up t eight terminals fr an integrated circuit [5] [6] SOT-223: 6.7 mm 3.7 mm 1.8 mm bdy - fur terminals, ne f which is a large heat-transfer pad SOT-323: 2 mm 1.25 mm 0.95 mm bdy - three terminals fr a transistr [7] DPAK (TO-252): discrete packaging. Develped by Mtrla t huse higher pwered devices. Cmes in three- r five-terminal versins [8] D2PAK (TO-263) - bigger than the DPAK; basically a surface munt equivalent f the TO220 thrughhle package. Cmes in 3, 5, 6, 7, 8 r 9-terminal versins [9] D3PAK (TO-268) - even larger than D2PAK [10]
Packages with fur r mre terminals (drawings f mst f the fllwing packages can be fund n [11]) Dual-in-line Small-utline integrated circuit (SOIC) - small-utline integrated circuit, dual-in-line, 8 r mre pins, gull-wing lead frm, pin spacing 1.27 mm J-Leaded Small Outline Package (SOJ) - the same as SOIC except J-leaded [12] TSOP - thin small-utline package, thinner than SOIC with smaller pin spacing f 0.5 mm SSOP - Shrink Small-Outline Package, pin spacing f 0.635 mm r in sme cases 0.8mm TSSOP - Thin Shrink Small-Outline package. QSOP - Quarter-Size Small-Outline package, with pin spacing f 0.635 mm VSOP - Very Small Outline Package, even smaller than QSOP; 0.4, 0.5 mm r 0.65 mm pin spacing Quad-in-line PLCC - plastic leaded chip carrier, square, J-lead, pin spacing 1.27 mm QFP - Quad Flat Package, varius sizes, with pins n all fur sides LQFP - Lw-prfile Quad Flat Package, 1.4 mm high, varying sized and pins n all fur sides PQFP - plastic quad flat-pack, a square with pins n all fur sides, 44 r mre pins CQFP - ceramic quad flat-pack, similar t PQFP MQFP - Metric Quad Flat Pack, a QFP package with metric pin distributin TQFP - thin quad flat pack, a thinner versin f PQFP QFN - quad flat pack, n-leads, smaller ftprint than leaded equivalent LCC - Leadless Chip Carrier, cntacts are recessed vertically t "wick-in" slder. Cmmn in aviatin electrnics because f rbustness t mechanical vibratin. MLP - Leadframe package with a 0.5 mm cntact pitch, n leads [13] PQFN - pwer quad flat-pack, n-leads, with expsed die-pad[s] fr heatsinking Grid arrays PGA - Pin grid array. BGA - ball grid array, with a square r rectangular array f slder balls n ne surface, ball spacing typically 1.27 mm LGA - Same Manufacture prcess f BGA, has Advantage being cler than BGA by quick Heat Deceptin feature. N Balls nly Patch. FBGA - fine pitch ball grid array, with a square r rectangular array f slder balls n ne surface LFBGA - lw prfile fine pitch ball grid array, with a square r rectangular array f slder balls n ne surface, ball spacing typically 0.8 mm TFBGA - thin fine pitch ball grid array, with a square r rectangular array f slder balls n ne surface, ball spacing typically 0.5 mm
CGA - clumn grid array, circuit package in which the input and utput pints are high temperature slder cylinders r clumns arranged in a grid pattern. CCGA - ceramic clumn grid array, circuit package in which the input and utput pints are high temperature slder cylinders r clumns arranged in a grid pattern. The bdy f the cmpnent is ceramic. µbga - micr-bga, with ball spacing less than 1 mm LLP - Lead Less Package, a package with metric pin distributin (0.5 mm pitch). Nn-packaged devices (althugh surface munt, these devices require specific prcess fr assembly): COB - chip-n-bard; a bare silicn chip, that is usually an integrated circuit, is supplied withut a package (usually a lead frame vermlded with epxy) and is attached, ften with epxy, directly t a circuit bard. The chip is then wire bnded and prtected frm mechanical damage and cntaminatin by an epxy "glb-tp". COF - chip-n-flex; a variatin f COB, where a chip is munted directly t a flex circuit. COG - chip-n-glass; a variatin f COB, where a chip is munted directly t a piece f glass - typically an LCD. There are ften subtle variatins in package details frm manufacturer t manufacturer, and even thugh standard designatins are used, designers need t cnfirm dimensins when laying ut printed circuit bards.