PACKAGE OPTION ADDENDUM 5-Dec-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan

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PACKAGE OPTION ADDENDUM www.ti.com 5-Dec-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) 76005012A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC 7600501EA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC 7600501EA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC 7600501FA ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC 7600501FA ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC 76041012A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC 76041012A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC 7604101EA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC 7604101EA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC 7604101FA ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC 7604101FA ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC JM38510/07701BEA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC JM38510/07701BEA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC JM38510/07701BFA ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC JM38510/07701BFA ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC JM38510/30701B2A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC JM38510/30701B2A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC JM38510/30701BEA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC JM38510/30701BEA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC JM38510/30701BFA ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC JM38510/30701BFA ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC JM38510/30701SEA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC JM38510/30701SEA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC JM38510/30701SFA ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC JM38510/30701SFA ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC SN54LS138J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SN54LS138J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SN54S138J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SN54S138J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SN74LS138D ACTIVE SOIC D 16 40 Green (RoHS & SN74LS138D ACTIVE SOIC D 16 40 Green (RoHS & SN74LS138DE4 ACTIVE SOIC D 16 40 Green (RoHS & SN74LS138DE4 ACTIVE SOIC D 16 40 Green (RoHS & SN74LS138DG4 ACTIVE SOIC D 16 40 Green (RoHS & SN74LS138DG4 ACTIVE SOIC D 16 40 Green (RoHS & SN74LS138DR ACTIVE SOIC D 16 2500 Green (RoHS & SN74LS138DR ACTIVE SOIC D 16 2500 Green (RoHS & Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 5-Dec-2005 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) SN74LS138DRE4 ACTIVE SOIC D 16 2500 Green (RoHS & SN74LS138DRE4 ACTIVE SOIC D 16 2500 Green (RoHS & SN74LS138DRG4 ACTIVE SOIC D 16 2500 Green (RoHS & SN74LS138DRG4 ACTIVE SOIC D 16 2500 Green (RoHS & SN74LS138N ACTIVE PDIP N 16 25 Pb-Free (RoHS) SN74LS138N ACTIVE PDIP N 16 25 Pb-Free (RoHS) SN74LS138N3 OBSOLETE PDIP N 16 TBD Call TI Call TI SN74LS138N3 OBSOLETE PDIP N 16 TBD Call TI Call TI SN74LS138NE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) SN74LS138NE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) SN74LS138NSR ACTIVE SO NS 16 2000 Green (RoHS & SN74LS138NSR ACTIVE SO NS 16 2000 Green (RoHS & SN74LS138NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & SN74LS138NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & SN74S138AD ACTIVE SOIC D 16 40 Green (RoHS & SN74S138ADE4 ACTIVE SOIC D 16 40 Green (RoHS & SN74S138AN ACTIVE PDIP N 16 25 Pb-Free (RoHS) SN74S138AN3 OBSOLETE PDIP N 16 TBD Call TI Call TI SN74S138ANE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) SN74S138ANSR ACTIVE SO NS 16 2000 Green (RoHS & SN74S138ANSRE4 ACTIVE SO NS 16 2000 Green (RoHS & Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC SNJ54LS138FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC SNJ54LS138FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC SNJ54LS138J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SNJ54LS138J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SNJ54LS138W ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC SNJ54LS138W ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC SNJ54S138FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC SNJ54S138FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC SNJ54S138J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC Addendum-Page 2

PACKAGE OPTION ADDENDUM www.ti.com 5-Dec-2005 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) SNJ54S138J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SNJ54S138W ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC SNJ54S138W ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & : TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3

MECHANICAL DATA MLCC006B OCTOBER 1996 FK (S-CQCC-N**) 28 TERMINAL SHOWN LEADLESS CERAMIC CHIP CARRIER 18 17 16 15 14 13 12 NO. OF TERMINALS ** MIN A MAX MIN B MAX 19 11 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) A SQ B SQ 20 21 22 23 24 25 26 27 28 1 2 3 4 10 9 8 7 6 5 28 44 52 68 84 0.442 (11,23) 0.640 (16,26) 0.739 (18,78) 0.938 (23,83) 1.141 (28,99) 0.458 (11,63) 0.660 (16,76) 0.761 (19,32) 0.962 (24,43) 1.165 (29,59) 0.406 (10,31) 0.495 (12,58) 0.495 (12,58) 0.850 (21,6) 1.047 (26,6) 0.458 (11,63) 0.560 (14,22) 0.560 (14,22) 0.858 (21,8) 1.063 (27,0) 0.020 (0,51) 0.010 (0,25) 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 0.045 (1,14) 0.035 (0,89) 4040140/ D 10/96 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. This package can be hermetically sealed with a metal lid. D. The terminals are gold plated. E. Falls within JEDEC MS-004 POST OFFICE BOX 655303 DALLAS, TEXAS 75265

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