PowerQUICC2 Pro Communications Processor /8311 Product Family Rev. 1.0 / 2.0 / 2.1 Qualification Report /8311-516 Lead, 27 x 27 mm, 1mm pitch TEPBGA type 2 CVRAFF VRAFF ECVRAF EVRAF SC8311EVRAFF SC8311VRAFF SC8311VRAFFA SC8311EVRAFFA SC8311CVRAFFA SC8311ECVRAFFA VRAFFA CVRAFFA ZQAFFA CZQAFFA EZQAFFA ECZQAFFA SC8311CVRADDB SC8311CVRAFFB SC8311CVRAGDB SC8311VRADDB SC8311VRAFFB SC8311VRAGDB SC8311ECVRADDB SC8311ECVRAFFB SC8311ECVRAGDB SC8311EVRADDB SC8311EVRAFFB SC8311EVRAGDB CVRADDB CVRAFFB CVRAGDB VRADDB Technology: CMOS90G Package: 27 X 27 TEPBGA type 2 Page 1 of 9
VRAFFB VRAGDB ECVRADDB ECVRAFFB ECVRAGDB EVRADDB EVRAFFB EVRAGDB CZQADDB ZQAFFB ECZQADDB Technology: CMOS90G Package: 27 X 27 TEPBGA type 2 Page 2 of 9
Product Information /8311 Product / Technology / Fab / Package Description Package 516 Lead TBGA ( VR ) 27 x 27 mm, 1mm pitch Device /8311 PowerQUICC2 Pro Rev 1.0 / 2.0 / 2.1 Mask Set M46H / M03R Die Coating(s) None Die Fab Facility External Fab Fab Process Technology 90nm, C90G-HPA process Poly / Metal layers 1P / 7M2T Package Assembly Facility Freescale Kuala Lumpur Final Manufacturing (KLM) Test Facility Freescale Kuala Lumpur Final Manufacturing (KLM) Freescale Austin, Texas Moisture Sensitivity Level MSL3 / 260 C Reflow C5 Sphere Composition Pb Free: 95.5% Sn, 4.0% Ag, 0.5% Cu (516 Lead TEPBGA (VR)) Substrate Supplier Purpose 516 Lead TEPBGA type 2 - Supplier A Industrial tier qualification Technology: CMOS90G Package: 27 X 27 TEPBGA type 2 Page 3 of 9
/8311 PowerQUICC2 Pro Product Reliability Data Summary Electrical Characterization Lot / Mask Set / Rev / Pkg N62691, N62596, N6283900 / M46H / Rev 1.0 PN86449313, PN86454400, PN86454300 / Rev 2.0 Room, Hot and Cold Temperatures 0 / 30 0 / 30 DW8313M03R1 / Rev 2.1 0 / 10 Totals 0 / 70 Electrostatic Discharge (ESD) and Latch-up Test Lot / Mask Set / Rev / Pkg HBM / 2KV MM / 200V CDM / 500V No Socket Latch-up / 200mA N62691 / Rev 1.0 0 / 3 0 / 3 0 / 3 0 / 6 N62596 / Rev 1.0 0 / 3 0 / 3 0 / 3 0 / 6 N6283900 / Rev 1.0 0 / 3 0 / 3 0 / 3 0 / 6 PN86449313 / Rev 2.0 0 / 3 0 / 3 0 / 3 - PN86454400 / Rev 2.0 0 / 3 0 / 3 0 / 3 - PN86454300 / Rev 2.0 0 / 3 0 / 3 2 / 3* - Totals 0 / 18 0 / 18 2 / 18 0 / 18 Note: * some pins of SGMII Phy do not meet the 500V CDM ESD criteria. Errata issued. All pins pass at 400V. Early Life Failure Rate (ELFR) Vd1/Vd2 1.7v/4v, Tj 130C (Avg) MPC8323 Rev 1.0 and 1.1 Lot / Mask Set / Rev 1 Hour 3 Hours 6 Hours 12 Hours 24 Hours 48 hours MD10429, MD10430, MD10431 (Rev 1.0) 5 / 3539 3 / 3455 0 / 3434 0 / 3428 0 / 3424 1* / 3406 PN7B658800, PN7B658800, PN7B4800R1 (Rev 1.1) _ 0 / 3546(a,b) Failures * One unit failed for platform scan,, (NDF) No Defect Found in analysis. a: 13 units short, 1 unit open and 1 unit leakage fail, Failure analysis showed EOS b: 1 unit failed for open due to substrate crack per FA Technology: CMOS90G Package: 27 X 27 TEPBGA type 2 Page 4 of 9
/8311 PowerQUICC2 Pro Product Reliability Data Summary (cont.) High Temperature Operating Life Test (HTOL) Vd1/Vd2 1.4v/4v, Tj 130C (Avg) Lot / Mask Set / Rev 118 hrs readpoint for 2.5 yr. Op life, Vdd 1V 168 hrs readpoint for 4 yr. Op life, Vdd 1V 470 hrs read point for 10 yr. Op life, Vdd 1V N62691 / Rev 1.0-0 / 80 0 / 80 N62596 / Rev 1.0-0 / 80 0 / 80 N6283900 / Rev 1.0-0 / 80 0 / 80 QL3 / Rev 1.0-0 / 80 0 / 80 PN86449313 / Rev 2.0 0 / 80-0 / 80 PN86454400 / Rev 2.0 0 / 80-0 / 80 PN86454300 / Rev 2.0 0 / 80-0 / 80 DW8313M03R1 / Rev 2.1 0 / 80-0 / 80 Totals 0 / 320 0 / 320 0 / 640 Target: <100 FITs, 60%C.L. High Temperature Operating Life Test (HTOL) Drift Analysis Voltage 1.4v/4v, Tj 130ºC (Avg) Lot / Mask Set / Rev 470 hrs read point for 10 yr. Op life, Vdd 1V N62691 / Rev 1.0 0 / 10 N62596 / Rev 1.0 0 / 10 N6283900 / Rev 1.0 0 / 10 PN86449313 / Rev 2.0 0 / 10 PN86454400 / Rev 2.0 0 / 10 PN86454300 / Rev 2.0 0 / 10 DW8313M03R / Rev 2.1 0 / 10 Totals 0 / 70 High Temperature Operating Life Test (HTOL) Fmax Analysis Voltage 1.4v/4v, Tj 130ºC (Avg) Lot / Mask Set / Rev 470 hrs read point for 10 yr. Op life, Vdd 1V N62691 / Rev 1.0 0 / 10 N62596 / Rev 1.0 0 / 10 N6283900 / Rev 1.0 0 / 10 PN86449313 / Rev 2.0 0 / 10 PN86454400 / Rev 2.0 0 / 10 PN86454300 / Rev 2.0 0 / 10 DW8313M03R / Rev 2.1 0 / 10 Totals 0 / 70 Technology: CMOS90G Package: 27 X 27 TEPBGA type 2 Page 5 of 9
/8311 PowerQUICC2 Pro Product Reliability Data Summary (cont.) Moisture Sensitivity Level Characterization, Rev 1.0/2.0-516 Lead 27mm TEPBGA type 2 Package Assy Site / Substrate Supplier / Lots MSL3 / 260ºC KLM / Substrate Supplier A / Assy lots 1-3 0 / 66 KLM / Substrate Supplier A / Assy lot 1, rev 2.0 0 / 22 KLM / Substrate Supplier A / Assy lot 1, rev 2.1 0 / 22 Totals 0 / 110 Temperature Cycle / -55ºC to 125ºC Air to Air with Preconditioning @ MSL3 / 260ºC IR Reflow, Rev 1.0/2.0-516 Lead 27mm TEPBGA type 2 Package Assy Site / Substrate Supplier / Lots 200 Cycles 400 Cycles 1000 Cycles KLM / Substrate Supplier A / Assy lots 1-3 0 / 240 2* / 240 0 / 238 KLM / Substrate Supplier A / Assy lot 4 0 / 150 0 / 150 0 / 150 KLM / Substrate Supplier A / Assy lot 1, rev 2.0 0 / 80 0 / 80 0 / 80 KLM / Substrate Supplier A / Assy lot 1, rev 2.1 0 / 80 0 / 80 0 / 80 Totals 0 / 550 2* / 550 0 / 548 *FA done on two fails at 400 Temp Cycles, corrective action in place. Temperature Humidity Bias / 85ºC, 85%R.H., 0.9v/3.3v with Preconditioning @ MSL3 / 260ºC IR Reflow, Rev 1.0-516 Lead 27mm TEPBGA type 2 Package Assy Site / Substrate Supplier / Lots 504 Hours 1008 Hours KLM / Substrate Supplier A / Assy lots 1-3 0 / 240 1** / 239 Totals 0 / 240 0 / 239 **FA on one unit showed EOS event. High Temperature Bake / 150 C, Rev 1.0-516 Lead 27mm TEPBGA type 2 Package Assy Site / Substrate Supplier / Lots 504 Hours 1008 Hours KLM / Substrate Supplier A / Assy lots 1-3 0 / 240 0 / 240 Totals 0 / 240 0 / 240 Autoclave / 121ºC, 100% RH, 15 PSIG with Preconditioning @ MSL3 / 260ºC IR Reflow, Rev 1.0-516 Lead 27mm TEPBGA type 2 Package Assy Site / Substrate Supplier / Lots 96 hour KLM / Substrate Supplier A / Assy lot 1-3 0 / 45 Totals 0 / 45 Unbiased HAST / 130ºC, 85% RH, 33 PSIG with Preconditioning @ MSL3 / 260ºC IR Reflow, Rev 1.0-516 Lead 27mm TEPBGA type 2 Package Assy Site / Substrate Supplier / Lots 96 hour KLM / Substrate Supplier A / Assy lot 1-3 0 / 240 Totals 0 / 240 Technology: CMOS90G Package: 27 X 27 TEPBGA type 2 Page 6 of 9
/8311 PowerQUICC2 Pro Product Reliability Data Summary (cont.) KLM wafer backgrind & saw and Sn3.5Ag lead free solder spheres data:- Moisture Sensitivity Level Characterization, Rev 1.0 516 Lead 27mm TEPBGA type 2 Package Assy Site / Substrate Supplier / Lots MSL3 / 260ºC KLM / Substrate Supplier A / Assy lots QL1-3 0 / 66 Totals 0 / 66 Temperature Cycle / -55ºC to 125ºC Air to Air with Preconditioning @ MSL3 / 260ºC IR Reflow, Rev 1.0 516 Lead 27mm TEPBGA type 2 Package Assy Site / Substrate Supplier / Lots 200 Cycles 400 Cycles 1000 Cycles KLM / Substrate Supplier A / Assy lots QL1-3 0 / 80 0 / 78 (a) 0 / 77 (b) Totals 0 / 80 0 / 78 0 / 77 (a); (b): FA done on three open fails of Temp Cycles, updated inspection procedure as a corrective action. Temperature Humidity Bias / 85ºC, 85%R.H., 0.9v/3.3v with Preconditioning @ MSL3 / 260ºC IR Reflow, Rev 1.0 516 Lead 27mm TEPBGA type 2 Package Assy Site / Substrate Supplier / Lots 504 Hours 1008 Hours KLM / Substrate Supplier A / Assy lots QL1-3 0 / 240 0 / 240 Totals 0 / 240 0 / 240 Technology: CMOS90G Package: 27 X 27 TEPBGA type 2 Page 7 of 9
/8311 PowerQUICC2 Pro Product Reliability Data Summary (cont.) 8313 FIT Rate as a function of Junction Temperature for various Voltages 1000.0 Failure Rate (FIT) 100.0 10.0 1.0 0.1 35 45 55 65 75 85 95 105 115 125 Junction Temperature (C) 1 1 0.9 1.1 8313 MTTF as a function of Junction Temperature for various voltages 1,000,000 100,000 MTTF (Years) 10,000 1,000 100 10 1 35 45 55 65 75 85 95 105 115 125 Junction Temperature (C) 1 1 0.9 1.1 Technology: CMOS90G Package: 27 X 27 TEPBGA type 2 Page 8 of 9
Revision History Revision History Date Comment Author Revision Original 05/10/07 /8311 Rev 1.0 Qualification Report. Dipak Gandhi Rev A 07/10/07 Added MPC8311 part # Dipak Gandhi Rev B 08/01/07 Added FIT target in HTOL section Dipak Gandhi Rev C 08/27/07 Updated for Industrial qualification (TC,THB) Dipak Gandhi Rev D 10/25/07 Updated ELFR results Dipak Gandhi Rev E 12/06/07 Added KLM wafer backgrind and saw study results (lot QL1-QL3) page 2 and 6 Dipak Gandhi Rev F 07/31/08 Added Rev 2.0 data Dipak Gandhi Rev G 10/06/08 Added Rev 2.1 data Dipak Gandhi Technology: CMOS90G Package: 27 X 27 TEPBGA type 2 Page 9 of 9