Electronic Costing & Technology Experts Power electronics MEMS & Sensors LED & Optoelectronics Advanced Packaging System TRENDS IN AUTOMOTIVE SIP SYSTEMS: REVIEW BASED ON TEARDOWN OF ACTUAL SOLUTIONS SiP Conference China 2018 Oct. 17-19, 2018 Shanghai, China Romain Fraux CEO System Plus Consulting
6 COMPANIES TO SERVE YOUR BUSINESS Yole Group of Companies Market, technology and strategy consulting www.yole.fr Manufacturing costs analysis Teardown and reverse engineering Cost simulation tools www.systemplus.fr IP analysis Patent assessment www.knowmade.fr Design and characterization of innovative optical systems www.piseo.fr Innovation and business maker Due diligence www.bmorpho.com www.yole.fr 2
OUR GLOBAL ACTIVITY Europe office Frankfurt Paris Nantes Vénissieux Nice HQ in Lyon Yole Korea Yole Japan Greater China office 40% 30% of our business Seoul Tokyo Hsinchu Yole Inc. Phoenix Palo Alto 30% of our business of our business 3
BUSINESS MODEL Reverse Costing Teardown + Cost Analysis Customer Specific Catalog Costing Tools Training 4
FIELDS OF EXPERTISE Discrete Module Compound (GaN, SiC) Power RF UV LED Lamp White/Blue Automotive Consumer Energy Medical Telecom WLP SiP Embedded 3D Packaging/TSV Infrared Visible Pressure Sensor Gyro/Accelero IMU/Combo Oscillators/Compass Environment Gas Sensor Fingerprint Microphone Light/Optic 5
OUTLINE Introduction System in Package in Automotive Power Modules Sensors Transmission RF Computing System in Package illustration Source: Amkor 6
INTRODUCTION Advanced Packaging 7
INTRODUCTION Automotive Electronics Source: Bosch 8
System in Package in Automotive Power Modules Sensors Transmission RF Computing 9
POWER MODULES Power Modules Market This Market forecast shows that the market for the Power Module devices will follow a rising trend with an estimated 1.5 billion increase in the next five years. 10
POWER MODULES Molded IGBT Modules IGBTs and Diodes molded in a package. Strong presence in EV/HEV power units (VW, Toyota, Mitsubishi TPM IGBT Module Bosch T-PM IGBT Module 11 Toyota Prius DSC Module Infineon HybridPACK DSC Module
POWER MODULES Molded IGBT Modules Exemple of Internal Structure Diode Top copper leadframe IGBT Thick copper leadframe Mitsubishi TPM Module Opening Emitter plate Copper Spacer IGBT Diode Collector plate Toyota Double Side Cooling Module Cross-Section 12
POWER MODULES ADI µmodules µmodules offer real SiP integration µmodule Top View, X-Ray View, Opening View & Cross-Section View 13
POWER MODULES Linear Technology µmodules 40A DC/DC Regulator with: Integrated constant-frequency current mode regulator Power MOSFETs 0.18μH Stacked Inductor Protection circuitry 5V regulator and other supporting discrete components. Stacked Inductor LTM4636 µmodule Package Molding LTM4636 µmodule Cross-Sections 14
POWER MODULES Linear Technology µmodules Triple 10A Step-Down DC/DC μmodule Regulator Included in the package are the switching controllers, power FETs, inductors, and most support components Switching mode DC/DC converters Inductors MOSFETs Controller LTM4633 µmodule Top View & Opening View 15
POWER MODULES Infineon DrBlade Integrated Power Stage ASE aeasi Packaging Platform (Advanced Embedded Active System Integration) Organic Substrate Process Flow Modified to Meet High Power Applications 2 Power MOSFET + 1 Driver RDL: 2+1 Layer Infineon TDA21320 Top View, Bottom View & X-Ray View MOSFET Solder Copper Line Copper Line MOSFET Copper HS Infineon TDA21320 Cross-Section 16 Copper Line
System in Package in Automotive Power Modules Sensors Transmission RF Computing Source: Bosch 17
SENSORS Around 50 MEMS Components in a Car Source: Bosch 18
SENSORS Around 50 MEMS Components in a Car Source: Bosch 19
SENSORS Around 50 MEMS Components in a Car Source: Bosch 20
SENSORS TPMS: Tire Pressure Monitoring System Mendatory in several countries TPMS Sensor TPMS Integration TPMS Opening 21
SENSORS TPMS: Tire Pressure Monitoring System Freescale (NXP) TPMS Metal lid Package Molding Silicone gel Package Molding Pressure Sensor Accelerometer ASIC Leadframe Freescale FXTH87 TPMS Package Views, Opening & Cross-Section 22
SENSORS TPMS: Tire Pressure Monitoring System Infineon TPMS ASIC MEMS Package molding MEMS ASIC Copper leadframe Infineon SP37 TPMS Package Views, Opening & Cross-Section 23
SENSORS Airbag ECU Airbag ECU uses multiple inertial sensors Continental Airbag ECU 24 TRW (ZF) Airbag ECU
SENSORS Airbag ECU Continental Airbag ECU 2 x Panasonic Combo Sensors (Single-Axis gyro + 2-Axis Accelerometer) 2 x NXP Accelerometer (Single + Dual-Axis Accelerometer) Accelerometer Gyroscope ASIC Accelerometer ASIC Panasonic Combo Sensors 25 NXP Single & Dual-Axis Accelerometers
SENSORS Airbag ECU TRW (ZF) Airbag ECU 1 x Panasonic Gyroscopes (Single-Axis) 2 x NXP Accelerometer (Single + Dual-Axis Accelerometer) Accelerometer ASIC Gyroscope ASIC NXP Single-Axis Accelerometer Panasonic Single-Axis Gyro 26 NXP Dual-Axis Accelerometer
System in Package in Automotive Power Modules Sensors Transmission RF Computing 27
TRANSMISSION CONTROL UNIT Transmission Control Unit (TCU) Standard ECU Bosch TCU (Source: Bosch) 28
TRANSMISSION CONTROL UNIT Continental TCU Double Clutch Transmission (DCT) Bare-Die High-Density Interconnect (BD-HDI) substrate technology 13 ICs, 10+ MOSFETs, Diodes, Passives ICs MOSFETS Continental Advanced TCU 29
System in Package in Automotive Power Modules Sensors Transmission RF Computing 31
RF GPS IC Multi-die integration Ublox GPS Chip 32
RF Vehicle Central Infotainment Unit Network Access Device Module (NAD) 2G, 3G, 4G LTE, GNSS xxxxx 33
RF Vehicle Central Infotainment Unit Network Access Device Module (NAD) 2G, 3G, 4G LTE, GNSS Cross section of Electronic Board (10 layers) Wistron NeWeb Corp. NAD Module 34
System in Package in Automotive Power Modules Sensors Transmission RF Computing 35
COMPUTING Single-Chip Module Single-Chip Module Introduction (Source: NXP) 36
COMPUTING nepes Roadmap Nepes Roadmap (Source: Nepes) 37
COMPUTING nepes System in Fan-Out WLP System-in-Package at wafer-level LPDDR2 Package-on-Package Configuration Embedded Flash Embedded PMIC Discrete passives components Flash Memory (SPI NOR ) Via Frame (Through Package Via) DRAM Package SiP (AP + Flash + PMIC) i.mx6q or imx6d Application Processor PMIC Source : Nepes Flash AP Package Cross-Section 2017 by System Plus Consulting 38
COMPUTING nepes System in Fan-Out WLP Chip first type Fan-Out 4 Redistribution Layers (RDLs) Via Frame (Through Package Via) formed from a PCB panel for the redistribution of the memory but also to increase the strength of the package Redistribution Layers 2017 by System Plus Consulting Package Molding Application Processor SMD Capacitor 4-Layer RDL Solder Ball Package Cross-Section Bumps & RDLs 2017 by System Plus Consulting 39
AVAILABLE REPORTS And many more! www.systemplus.fr 40
THANK YOU! Reverse Costing Teardown + Cost Analysis Customer Specific Catalog Costing Tools Training 41