Technical Documents for Qualification of 1550nm DFB Laser Diode Module for WDM Lightwave Technologies Dept. Photonic Products Division
1. General This report describes reliability of 1.5µm DFB laser diode modules for WDM which are manufactured by 2. Part numbers This document covers the modules of following products; SLT5411-xA, SLT5411-xB SLT5412-xA, SLT5412-xB, SLT5412-xP SLT5413-xA, SLT5413-xB SLT5414-xA, SLT5414-xB, SLT5414-xP 3. Aging test results of laser chips 3-1. Aging test conditions Table 1 shows test conditions. Nine aging tests were proceeded in different conditions and different wafers. Figure 3 and figure 4 shows the aging test results of each test. 3-2. Criteria of failure 20% increase of operation current from initial value. 3-3. Distributions of lifetime Log-Normal distributions of each test are shown in Figure 1-a and Figure 1-b. Standard deviations of the distribution are 0.34 to 0.89 (average:4). Figure 2 shows the arrhenius plot of all test results. 3-4. Failure rate calculation Activation energy of 0.4eV is assumed for converting lifetime at normal operating conditions(rated power;31 C). The calculated median life time and failure rate after 15 years and 20 years are shown below. Rated Power Median Life Failure rate (15 years) Failure rate (20 years) [mw] [Hour] [FIT] [FIT] 5 1.48 10 6 2.6 14 10 1.23 10 6 9.7 43 20 7.36 10 5 188 509 4. Median life of peak wavelength drift Peak wavelength shifts to longer wavelength during the APC operation mainly caused by increment of operation current. In case initial operation current is large, which corresponds to high rated power specification, the end of life(eol) which is determined by maximum wavelength shift will be shorter than the EOL which is determined by operation current increase of 20%. Under the assumption that the EOL is wavelength shift of 0.1nm or 0.2nm, the median life and failure rate are calculated using the aging test results used in Section 3. - 1/11 -
Rated Power Wavelength shift Median Life Failure rate (15 years) Failure rate (20 years) [mw] [nm] [Hour] [FIT] [FIT] 0.2 (>1.48 10 6 ) (<2.6) (<14) 1 and 5 0.1 (>1.48 10 6 ) (<2.6) (<14) 5 1.23 10 6 9.3 42 10 0.2 (>1.23 10 6 ) (<9.7) (<43) 0.1 2 10 6 31.4 117 20 0.2 6.13 10 5 441 1000 0.1 2.99 10 5 4275 5259 LD will reach the operation current increase of 20% before wavelength shifts to defined value. 5. Reliability test results of laser modules Reliability test results of the laser modules are summarized in Table 2. Actual data are shown in p.7 through p.11. 6. Track record of 1550nm DFB laser diode modules in the field Customer Number of shipped devices (from May 1997 to Sept. 1998) Total device hours (as of May 2000) Number of failed devices : A Japanese equipment manufacturer : 2657pcs : 49767093 hours : 0pcs Total operating time (as of May 2000) : 39813674 hours (*) Estimated failure rate : 23 FIT(C.L.60%) : 58 FIT(C.L.90%) (*)Estimated operating time (Presupposition for the estimation) Installation lead time : 2 months Number of devices installed /Number of devices shipped : 80% Operating hours : 24 hours / day Revision Record Document No. Date Description Incorporated by Checked by Approved by HUX9723037-02A Sept. 18, 1998 Issue N. Kushida A.Miki T. Fujitani HUX9723037-02B Dec. 28, 1998 LD module results are added A. Miki N. Kushida T. Fujitani HUX9723037-02C May 24, 2000 Latest aging test results are T.Nakabayashi N.Kushida T.Fujitani added HUX9723037-02D Feb 23, 2001 SLT5414 series are added T.Kounosu N.Kushida K.Tanida - 2/11 -
Distribution [*sigma]. 3 2 1 0-1 #4 #3 #2 #1 #5-2 -3 1.E+04 1.E+05 1.E+06 1.E+07 Life Time [Hour] Figure 1-a Distribution of life time (test 1~5) 3 2 #9 #6 Distribution [*sigma] 1 0-1 -2 #7 #8 test # -3 1.E+04 1.E+05 1.E+06 1.E+07 Power Case Temp. Wafer lot Life Time [Hour] Figure 1-b Distribution of life time (test 6~9) Table 1. Test conditions and evaluated median life Sample size Median Life Sigma Aging Hour [mw] [deg.c] [Hour] [Hour] 1 5 50 #1 30 4.91E+05 91 11306 2 5 85 #1 19 2.76E+05 0.364 13907 3 10 85 #2 11 2.90E+05 63 5000 4 10 85 #2 10 1.82E+05 0.601 5000 5 15 70 #1 13 3.26E+05 0.888 7334 6 20 50 #1 15 1.98E+05 0.665 6821 7 20 50 #2 13 2.71E+05 0.434 5000 8 20 50 #3 10 2.83E+05 0.407 5000 9 20 50 #4 15 1.81E+05 0.335 5000 Distribution Figure 1-a Figure 1-b - 3/11 -
1.E+07 Median Life [Hour] 1.E+06 1.E+05 Criteria : Iop=20% #1 #3 #2 Ea=0.4eV is assumed. 1.E+04 022 024 026 028 03 032 034 1/Tj [1/K] Figure 2. Arrhenius Plot of Median Life The sample size of each point show in Fig.2. #1~#3 shows the Tj of operating conditions. #1,#2 and #3 corresponds to Pf=20mW, 10mW, 5mW, respectively. - 4/11 -
Test 1-a 50deg.C 5mW APC n=15 Test 1-b 50deg.C 5mW APC n=15 0 2000 4000 6000 8000 10000 12000 0 2000 4000 6000 8000 10000 12000 Test 2-a 85deg.C 5mW APC n=8 Test 2-b 85deg.C 5mW APC n=11 0 5000 10000 15000 0 5000 10000 15000 Test 3 85deg.C 10mW APC n=11 Test 4 85deg.C 10mW APC n=10 0 1000 2000 3000 4000 5000 6000 0 1000 2000 3000 4000 5000 6000 Figure 3. Aging test results (Test 1~Test4) - 5/11 -
Test 5 70deg.C 15mW APC n=13 Test 6 50deg.C 20mW APC n=15 0 2000 4000 6000 8000 0 2000 4000 6000 8000 Test 7 50deg.C 20mW APC n=13 Test 8 50deg.C 20mW APC n=10 0 1000 2000 3000 4000 5000 6000 0 1000 2000 3000 4000 5000 6000 Test 9 50deg.C 20mW APC n=15 0 1000 2000 3000 4000 5000 6000 Figure 4. Aging test results (Test 5~Test9) - 6/11 -
Table 2. Reliability Test Results of 1550nm DFB LD Modules Heading Mechanical Integrity Endurance Special Tests ref. : GR-468-CORE Item Test Conditions Sampling Failure Limits Mechanical Shock 1500G,ms 3axis, 5times/axis 11 0 Vibration 20G, 20~2000Hz 4min/cycle, 4cycles/axis 11 0 Thermal Shock T=100 C, 15cycles 11 0 Pf<±dB Solderability 350 C, 3sec. 11 0 Im<±10% Fiber Pull 1kg, 10sec., 3times 11 0 at Iop=const. -40 C to +70 C Tld=25±1 C Temperature Cycling 100times pass/fail 11 0 500times for info. High Temp. Storage +85 C, 2000hours 11 0 Low Temp. Storage -40 C, 2000hours 11 0 Damp Heat 85 C/85%, 2000Hours 11 0 Tc=70 C, Tld=25 C P f =20mW (at beginning) 10 0 2500hours Accelerated Aging Tc=70 C, Tld=25 C P f =11mW (at beginning) 5000hours 9 0 Internal Moisture 11 0 ESD Threshold 100pF, 1.5kΩ, ±500V, 5times/each polarity 6 0 Iop<±20% at Im=const. Tld=25±1 C water vapor 5000ppm Pf<±dB Im<±10% R therm <±10% R Peltier <±10% at Iop=const. Tld=25±1 C - 7/11 -
Mechanical shock Criteria : Pf<±dB, Im<±10% sample size : n=11 1 5.0 Im [%] - -5.0 - After -1 After Vibration Criteria : Pf<±dB, Im<±10% sample size : n=11 1 5.0 Im [%] - -5.0 - After -1 After Thermal Shock Solderability Criteria : Pf<±dB sample size : n=11 Criteria : Pf<±dB sample size : n=11 1.5 1.5 - - - - -1.5 After -1.5 After Dip - 8/11 -
Fiber Pull Criteria : Pf<±dB sample size : n=11 1.5 - - -1.5 After Pull Temperature Cycling Criteria : Pf<±dB, Im<±10% sample size : n=11 1 5.0 Im [%] - -5.0-0 50 100 200 300 400 500 Cycles -1 0 50 100 200 300 400 500 Cycles High Temperature Storage Low Temperature Storage Criteria : Pf<±dB sample size : n=11 Criteria : Pf<±dB sample size : n=11 1.5 1.5 - - - - -1.5 0 500 1000 1500 2000 Time [Hours] -1.5 0 500 1000 1500 2000 Time [Hours] - 9/11 -
Damp Heat Criteria : Pf<±dB sample size : n=11 1.5 - - -1.5 0 500 1000 1500 2000 2500 Time [Hours] Accelerated Aging Criteria : Iop<±20% sample size : n=10 1.4 1.4 1.3 1.2 n=5 1.3 1.2 n=5 Iop/Iop0 1.1 0.9 Iop/Iop0 1.1 0.9 0.8 0.8 0.7 0.7 0.6 0 500 1000 1500 2000 2500 3000 0.6 0 500 1000 1500 2000 2500 3000 Accelerated Aging Criteria : Iop<±20% sample size : n=9-10/11 -
Internal Moisture Criteria : water vapor<5000ppm sample size : n=11 Sample No. A-1 A-2 A-3 A-4 A-5 A-6 A-7 A-8 A-9 A-10 A-11 H2O(vapor) [ppm] 1200 1700 1600 2100 1100 1900 1400 1300 1400 2800 1800 H2 [%] 2 2 2 4 2 1 2 2 2 2 2 N2 [%] 99.85 99.76 99.81 99.70 99.85 99.78 99.78 99.83 99.82 99.61 99.75 O2 [%] <1 1 <1 1 1 N.D. 1 <1 N.D. 2 1 ESD Threshold Criteria : Pf<±dB, Im<±10%, R therm <±10%, R Peltier <±10% sample size : n=6 Cumulative Failure ESD Voltage Sample LD PD Peltier Cooler Thermistor [V] Pin No.12 & 13 Pin No.4 & 5 Pin No.6 & 7 Pin No.1 & 2 500 6 0 0 0 0 1000 6 0 0 0 0 2000 6 0 6 0 0-11/11 -