Introduction to Power Electronics - A Tutorial. Burak Ozpineci Power Electronics and Electrical Power Systems Research Center

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Introduction to Power Electronics - A Tutorial Burak Ozpineci Power Electronics and Electrical Power Systems Research Center

Agenda 1. The definition of power electronics 2. Power semiconductors 3. Power semiconductor losses 4. Types of power converters 5. Power conversion 6. Thermal management 2 Managed by UT-Battelle

What is Power Electronics? Power Electronics is used to change the characteristics (voltage and current magnitude and/or frequency) of electrical power to suit a particular application. It is an interdisciplinary technology. 3 Managed by UT-Battelle

Applications of Power Electronics Transportation Electric/ Hybrid Electric Vehicles Electric Locomotives Electric Trucks, Buses, Construction Vehicles, Golf Carts Utilities Line transformers Generating systems Grid interface for alternative energy resources (solar, wind, fuel cells, etc.) and energy storage FACTS HVDC Solid state transformer Solid state fault current limiter Solid state circuit breaker Industrial/ Commercial Motor drive systems Electric machinery and tools Pumps/ compressors Process control Factory automation Consumer Products Air conditioners/ Heat pumps Appliances Computers Lighting Telecommunications Uninterruptible power supplies Battery chargers Medical equipment 4 Managed by UT-Battelle

Fuel Cell Powertrain Hybrid Design 200V DC inherently decreases with higher current 42V DC 200V DC Inverter AC voltage with controllable voltage and frequency: 0-500V and 0-200Hz 5 Managed by UT-Battelle

History of Power Devices Power diodes (or rectifiers) Bipolar transistor 1948 Power BJT (bipolar junction transistor) - 1960 Thyristor or SCR (Silicon controlled rectifier) - 1957 Power MOSFETs (Metal oxide semiconductor field effect transistor) - 1970 IR 400V 25A power MOSFET 1978 IGBT (insulated gate bipolar transistor) 1990 a hybrid between a MOSFET and a BJT 6 Managed by UT-Battelle

List of typical power devices Two terminal devices PiN diodes (for voltages >300V) Schottky diodes (for voltages <300V, no reverse recovery loss) Three terminal devices switches BJT (not used much in power converters, high voltage blocking capability) MOSFET (commonly used for voltage <300V, very fast devices) IGBT (for voltages >300V, a hybrid of BJTs and MOSFETs) Thyristors GTO, IGCT, ETO, MCT, etc. (high voltage applications) 7 Managed by UT-Battelle

Ideal Characteristics of a Power Device 1. Block arbitrarily large forward and reverse voltages with zero current flow when off. 2. Conduct arbitrarily large currents with zero voltage drop when on. no conduction losses 3. Switch from off to on or vice versa instantaneously. no switching losses 4. Negligible power (small voltage or current) required to trigger switch. for controllable switches 5. Free i v off on 8 Managed by UT-Battelle

Power Diode/Rectifier Diodes block voltage in reverse direction and allow current in forward direction. They start conduction once the voltage in the forward direction goes beyond a certain value. Piece-wise linear model Diode symbol and I-V characteristics Diode turn-off characteristics Reverse recovery characteristics 9 Managed by UT-Battelle

Insulated Gate Bipolar Transistor IGBTs are preferred devices for voltages above 300V and below 5kV. They are turned on and off by applying low voltage voltage pulses to their gate. Reference for figures - Mohan, Undeland, and Robbins, Power Electronics: Converters, Applications, and Design, Wiley, 2003, ISBN:978-0-471-22693-2 10 Managed by UT-Battelle

Desirable Characteristics of a Power Device 1. Small leakage current in off state. 2. Small on-state voltage drop to minimize conductive losses. 3. Short turn-on and turn-off times (high switching frequency). 4. Large forward and reserve voltage blocking capability minimizes need to series several devices. 5. High on-state current rating minimizes need to parallel devices. 11 Managed by UT-Battelle

Desirable Characteristics of a Power Device (cont ) 6. Positive temperature coefficient for on-state resistance. This helps ensure paralleled devices share current equally. 7. Small control power (low voltage or current) to gate (switch) devices. 8. Capability to withstand rated current or voltage when switching. eliminates need for snubbers (external protection). 9. Capability to withstand large dv/dt and di/dt, again so that external protection circuits are not needed. 12 Managed by UT-Battelle

Switching Characteristics The switching losses increase with Increasing switching frequency The turn on and off times Reference for figures - Mohan, Undeland, and Robbins, Power Electronics: Converters, Applications, and Design, Wiley, 2003, ISBN:978-0-471-22693-2 13 Managed by UT-Battelle

Types of Power Conversion AC-DC Converter (Rectifier) Converts input AC to variable magnitude DC, e.g. battery chargers, computer power supplies AC-AC Converter (Cycloconverter or Frequency Changer) Converts input AC to variable magnitude variable frequency AC, e.g. ship propulsion systems DC-AC Converter (Inverter) Converts input DC to variable magnitude variable frequency AC, e.g. electric/hybrid electric traction drives DC-DC Converter (DC Chopper - Buck/Boost/ Buck-Boost Converter) Converts input DC to variable magnitude DC, e.g., voltage regulators Input Output 14 Managed by UT-Battelle

Applications of Power Converters DC-DC converters - Switched Mode Power Supplies (SMPS) - Makes up about 75% of power electronics industry. Power Supplies for Electronic Equipment Robotics Automotive/Transportation Switching Power Amplifiers Photovoltaic Systems DC-AC - Inverter AC Machine Drive (permanent magnet, switched reluctance, or induction machine) Uninterruptible Power Supply (UPS) Machine Tools Induction Heating Steel Mills Locomotive Traction Static Var Generation (Power Factor Correction) Photovoltaic or Fuel Cell Interface with Utility 15 Managed by UT-Battelle AC-DC - rectifier DC Machine Drive Input Stage to DC/DC or DC/AC Converter Energy Storage Systems Battery Chargers Aerospace Power Systems Subways, Trolleys High Voltage DC (HVDC) Transmission AC-AC Converters - Voltage Controller 1Ф to 3Ф Converters Lighting /Heating Controls Large Machine Drives

Rectification Single phase, half wave Reference for figures - Mohan, Undeland, and Robbins, Power Electronics: Converters, Applications, and Design, Wiley, 2003, ISBN:978-0-471-22693-2 16 Managed by UT-Battelle

Rectification Single phase full wave 17 Managed by UT-Battelle Reference for figures - Mohan, Undeland, and Robbins, Power Electronics: Converters, Applications, and Design, Wiley, 2003, ISBN:978-0-471-22693-2

Rectification- three phase, full bridge Reference for figures - Mohan, Undeland, and Robbins, Power Electronics: Converters, Applications, and Design, Wiley, 2003, ISBN:978-0-471-22693-2 18 Managed by UT-Battelle

Three-phase rectifier with large filter capacitor 19 Managed by UT-Battelle Reference for figures - Mohan, Undeland, and Robbins, Power Electronics: Converters, Applications, and Design, Wiley, 2003, ISBN:978-0-471-22693-2

DC-DC Conversion Step down converter Step up converter Reference for figures - Mohan, Undeland, and Robbins, Power Electronics: Converters, Applications, and Design, 20 Managed by UT-Battelle Wiley, 2003, ISBN:978-0-471-22693-2

Inverters PWM operation Square wave operation Reference for figures - Mohan, Undeland, and Robbins, Power Electronics: Converters, Applications, and Design, Wiley, 2003, ISBN:978-0-471-22693-2 21 Managed by UT-Battelle

Three-phase inverters Reference for figures - Mohan, Undeland, and Robbins, Power Electronics: Converters, Applications, and Design, Wiley, 2003, ISBN:978-0-471-22693-2 22 Managed by UT-Battelle

Component Temperature Control 1. For high reliability, the worst-case junction temperature in semiconductor devices is typically limited to less than 125C. 2. Some Si semiconductor devices can operate at up to 200C, but their lifetime will be low and they likely will have poor performance characteristics. Also, manufacturers will not guarantee parameters above the maximum temperature of 125-150C. 3. Failure rate for semiconductor devices doubles for each 10-15C temperature rise above 50C. 23 Managed by UT-Battelle

Component Temperature Control (cont ) 4. Best for heat sink fins to be vertical and have ample room for natural convection without a fan 5. Heat sink cooling methods 1) Natural convection 2) Forced air-fan( ac fan is more reliable than a dc fan) 3) Liquid cooling requires a radiator and a pump 24 Managed by UT-Battelle

Device Packaging and Power module Courtesy of ORNL s A. Wereszczak and G. Muralidharan 25 Managed by UT-Battelle