The Continuing Revolution in Automotive Electronics

Transcription

1 The Continuing Revolution in Automotive Electronics From the Beginning to the Future Presented by Dr. W. R. Bottoms

2 From The Beginning First automobile 1769 (Cugnot-France) Steam power no electronics 63 years First electric automobile 1832 (Anderson- Scotland) Electric motor, non-rechargeable battery 28 years First internal combustion automobile 1860 (Lenoir-Belgium) 2-stroke operated on coal gas, only ignition 38 years First electric headlamps 1898 (Columbia Electric Car- Connecticut) 13 years First electric starter 1911 (Kettering [Cadillac]- Michigan) 1 year First automobile electrical system integrating ignition, lighting and electric start 1912-Cadillac-Delco

3 What Drives Automotive Electronics? Issues Independent Of Drive Train Performance related electronics Safety (Driver warnings/bio feedback for sleep alarm, speed alarm, etc.) Handling Navigation Maintenance Environmental controls Temperature Shading and both internal and external lighting (shades, photochromics, mirror dimming) Infotainment Audio Video Games Communications including auto detect for speed limit and other driver information Security Communication (both internal and external) Firewall/virus protection/ Anti-rollover Haptics Touch related driver feedback Systems integration Policy Safety systems (e.g., airbags, tire pressure sensors) Driverless vehicles Black box

4 What Drives Automotive Electronics? Internal combustion Performance related electronics Fuel economy Emissions Engine control (including remote startup for example) Engine maintenance Sound control (Active noise cancelation} Communication (both internal and external Policy Safety systems (e.g., airbags, tire pressure sensors) Emissions

5 What Drives Automotive Electronics? Electric and Hybrid Performance related electronics Regenerative breaking Power control Battery charging control Battery condition monitoring Battery maintenance For Hybrid add: Internal combustion drivers Add dual drive system coordination

6 Hybrid Vehicle System Electronics Hybrids Charging / Discharging Performance Plug-in Torque vectoring Power control Safety systems System monitoring

7 History of Automotive Wireless Communication Source: Clemson University June 2011

8 Portable Consumer Products Are Market Drivers Even for Automotive Electronics The dramatic rise of the mobile device market is expanding automotive electronics to include built-in interfaces for our portable devices. I-pods, tablets and smart phones will all be integrated to provide full portability for these appliances.

9 Components Of Today s Complex Automotive Electronics Braking (anti-lock brakes) Collision avoidance systems Communication systems Emissions controls Engine ignition (spark, timing) Entertainment systems Fuel injection Heating/air conditioning Lights, horn, wipers, defrosters Maintenance Navigation systems Noise cancellation Safety systems Seat & pedal positions Security systems Steering (steering assist, 4- wheel steering) Suspension systems Transmission controls

10 Components Of Today s Complex Automotive Electronics Braking (anti-lock brakes) Collision avoidance systems Communication systems Emissions controls Engine ignition (spark, timing) Entertainment systems Fuel injection Heating/air conditioning Lights, horn, wipers, defrosters Maintenance Navigation systems Noise cancellation Safety systems Seat & pedal positions Security systems Steering (steering assist, 4-wheel steering) Suspension systems Transmission controls Current automobiles have more than 130 microprocessors The number of processors expected to double in 5 years. A typical automobile contains about 5 miles of wiring.

11 These Components Must Be CAN Introduced in 1986 (Controller Area Network) Interconnected Serial bus for distributed control system Twisted-pair media use Bandwidth up to 1 Mbps Up to 40 devices.

12 These Components Must Be Interconnected MOST Introduced in 1998 (Media Oriented Systems Transport) The MOST bus uses ring topology and synchronous communication for audio, video, voice and data signals. It supports both photonic and electronic data and is used by almost every car manufacturer in the world.

13 The Electronic Content Is Rising % of Materials cost % of 150mm diameter wafer Compact car Luxury Car Hybrid Car Personal Computer

14 The Direction Of Automotive Electronics Is Clear Electronics and Information Communications Technology are radically transforming the car as a product and an experience. The automobile industry no longer solely operates in the mechanical world. More and more, it is becoming part of the ICT and electronics worlds. High-tech players can seriously disrupt, either directly or indirectly, the automotive landscape as we know it today. Source: Google, 2012 Almost every car company has acknowledged that future success lies in creating vehicles that are differentiated by electronics and software, rather than just by design and branding. The Automotive industry (like many other industries) is becoming more dependent on the electronics industry.

15 Ethernet Is Coming to the Automotive Data Network "We will start seeing automotive Ethernet replacing CAN in eight to 10 years. Ali Abaye, Broadcom- August 2013 When car cameras start handling higher-risk jobs like lane departure warnings, reading traffic signals, or spotting pedestrians in the crosswalk, carmakers don't want visual information to be sent as compressed video. For such applications, OEMs are beginning to look to Gigabit Ethernet. In 2020, there will be cars equipped with Gigabit Ethernet. Peter Hank, NXP Semiconductors August 2013

16 The Network Will Not Be Just In The Vehicle Resources in the vehicle will reduce need for infrastructure investment. Cars will all connected to the network. As they are moving, they will send real time information that s collected by all the other cars. There will be no more traffic lights because everybody knows where everybody is. The data collection from cars sending their position real time will be picked up and processed by a network that can then control position and speed to avoid any collisions. This network may be the first and perhaps only infrastructure change we ll see. The networking of vehicles using the existing highway infrastructure will also increase safety and capacity reducing total investment requirement.

17 What is Available Today Advanced safety technologies to help drivers avoid collisions by: improving their vision and awareness of road hazards Brakes automatically if sensors predict the vehicle is at risk of a collision. Adaptive Cruise Control and collision avoidance Uses radar, ultrasonic sensors and vision sensing detection a vehicle ahead and calculate its distance and relative speed Sends a message to the onboard computer to maintain a driverselected following time/distance. Initiates automatic braking and throttle control to maintain selected following distance. The driver needs to remain attentive to traffic and road conditions and provide the steering, braking or other inputs necessary to retain control of the vehicle.

18 What is Available Today Advanced safety technologies to help drivers avoid collisions by: improving their vision and awareness of road hazards Brakes automatically if sensors predict the vehicle is at risk of a collision. Adaptive Cruise Control and collision avoidance Uses radar, ultrasonic sensors and vision sensing detection a vehicle ahead and calculate its distance and relative speed Sends a message to the onboard computer to maintain a driverselected following time/distance. Initiates automatic braking and throttle control to maintain selected following distance. The driver needs to remain attentive to traffic and road conditions and provide the steering, braking or other inputs necessary to retain control of the vehicle.

19 What is Available today? Automated parallel parking: All major manufacturers appear to have this option available. USA Today tested several cars with the following results: Land Rover 21.9 seconds Mercedes Benz 27.4 seconds Nissan 30.5 seconds Ford 31 seconds Best driver 16 seconds

20 The Google Car Has Likely Been To A Neighborhood Near You It has a driver but the driver does not drive. It has been a legal and liability issue in California.

21 The Driverless Car Is Coming Nissan announces plans to release Driverless Cars by 2020 August 29, 2013 Nissan may be late to market. Recently, Google's self-driving car received a driver s license from the state of Nevada

22 Hybrid and Electric Vehicle Components Have High Temperature Requirements Thermal management challenges force the use of new semiconductor materials SiC and GaN based power devices will be used for harsh environments and high operating temperatures 5 x 5 mm square SiC chip glowing red-hot operating at junction temperatures as high as 650 C.

23 Automotive Electronics Are Unique Requirements: Perform the functions to meet market demand In use reliability of 15 years or more Continuous reduction of cost per function Operation in harsh environments Difficult Challenges: EMI protection is now a big issue and it will be even more challenging in the future Bluetooth and Zigbee are already embedded, broadband RF is probably next. With higher speed radios and rising electrical energy, EMI will be an increasing challenge Thermal Management for device, package, modules and sub-systems

24 Roadmap For Automotive Electronics Category Characteristics Unit Mileage Power device Medium car at JC08 mode Inverter power density km/litter W/cm X Specific on-resistance at breakdown voltage of 1.2kV 40 IGBT 25 IGBT 5 SiC/GaN 4 SiC/ GaN 3 SiC/ GaN 3 SiC/GaN 13X Drain current density A/cm Die size Si SiC/GaN mm sq Battery for HEV (high power) Battery for BEV (High energy) Energy density Power density Energy density Power density Wh/kg kw/kg Wh/kg kw/kg X Capacitor Capacity of capacitor pack F Motor power kw Network Power train, body (CAN Flex Ray) Mbps Media, information Mbps Sensor ECU Number of sensors Number of ECUs pcs pcs %

25 Packaging Requirements For Automotive Electronics Category Power train - Combustion Trend ECU-built in engine Fuel-saving vehicle management Requirements to packages High-temperature durable packaging Power train -Motor High power, fast switching devices Intelligent battery management: Lower Ron Low Rth, cooling system Management chip built-in cell Network Information/ entertainment Body and security Safety X-by-wire; FlexRay (10Mbps) Longer harness (50km now) Reducing number of MCUs by networking Plastic optical fiber Probe-car infrastructure Traffic information infrastructure Integration of MEMS sensor, actuator, interface chip, etc. Sensors and real-time processing Monitoring a driver and lanes Man-machine interface to inform the risk to the driver Predictive safety mechanism Integration with network chip Low impedance EM immunity design Higher-pin count packages Smaller, cheaper EO devices Higher data rate Multiple communication path to outside sources Inverter-embedded motor Integration module self-generating electricity High speed package mm-wave devices Sensor/CPU/actuator integrated module

26 Techniques To Lower Resistance Lowering R on Reduction of Interconnection resistance Au wire Lead Frame Au Wire (Source,Gate) Die Die pad(drain) ~1.0mohm ~0.5mohm Thick Cu wire Al ribbon Cu-Si-Cu stack Cu clip

27 Thermal Management for Inverters Forced air cooling Indirect liquid cooling Both-sides Indirect liquid cooling Direct liquid cooling

28 Key Parameters For Automotive Electronics 2012 ITRS Table AP28 Key Parameters for Automotive Electronics Year of Production Regulation against CO2 emission (g/km) EU (% to meet 120g/km) CO2 emission (g/km) 75% to 120g/km 80% to 120g/km 100% to 120g/km California (g/km) Japan, JC08 mode (km/litter), equivalent CO2 emission (g/km) Battery performancefor HEV (Power oriented development) km/l 130g/km Power density per weight (W/kg) Energy density per weight (Wh/kg) Battery performancefor BEV (Energy oriented development) Power density per weight (W/kg) Energy density per weight (Wh/kg) Capacitor pack (F) Power devices Inverter power density (W/cm3) Specific on-resistance at breakdown voltage of 1.2kV [mohm*cm2@1.2kv] Drain current density (A/cm2) Max die size of Si-based power device (mm sq.) Max die size of SiC/based power device (mm sq.) Motor power (kw) Only issues of concern through 2015 are Junction temperature Networks control and mold temperature and we think we have known Number of devices solutions Power train and body (Mbps) Media and information (Mbps) Sensors (pieces/car) ECUs (pieces/car) Power devices for automotive electronivccs Earliest Max ambient temperature of power device issues for 125which 125 we 125have no 125 know solution are in Si- Si- Si- Si- Si- Si- Si- and they are control Si- Si- of junction temperature Si- Si- Si- Si- Si- Device Max junction temperature (degree C) Rthja required for inverter power density (W/cm3) with regard to Ta of 125deg C (deg C/W/cm3) Max mold temperature (deg C) package termical resistance (m Ohm) Logic devices Temperature attached to engine (degree C) Max junction temperature (degree C) Bond pad structure OPM OPM OPM OPM OPM OPM OPM OPM OPM OPM OPM OPM OPM OPM Wire bonding Au/Cu wire Au/Cu wire Au/Cu wire Au/Cu wire Au/Cu wire Au/Cu wire Au/Cu wire Au/Cu wire Au/Cu wire Au/Cu wire Au/Cu wire Au/Cu wire Au/Cu wire Au/Cu wire SiP structure QFP/SOP/BGA (Side by side+ 3D) Manufacturable solutions exist, and are being optimized Manufacturable solutions are known Interim solutions are known Manufacturable solutions are NOT known Notes for Table AP Interconnection and cooling will be added for power devices in future revisions

29 Key Parameters For Automotive Electronics 2013 ITRS Table AP28 Key Parameters for Automotive Electronics Year of Production Regulation against CO2 emission (g/km) EU (% to meet 120g/km) CO2 emission (g/km) 65% to 120g/km 75% to 120g/km 80% to 120g/km 100% to 120g/km California (g/km) Japan, JC08 mode (km/litter), equivalent CO2 emission (g/km) Battery performancefor HEV (Power oriented development) km/l 130g/km Power density per weight (W/kg) Energy density per weight (Wh/kg) Battery performancefor BEV (Energy oriented development) Power density per weight (W/kg) Energy density per weight (Wh/kg) Capacitor pack (F) Power devices Inverter power density (W/cm3) Specific on-resistance at breakdown voltage of 1.2kV [mohm*cm2@1.2kv] Drain current density (A/cm2) Max die size of Si-based power device (mm sq.) Max die size of SiC/based power device (mm sq.) Motor power (kw) Networks Power train and body (Mbps) Media and information (Mbps) Number of devices Sensors (pieces/car) ECUs (pieces/car) Power devices for automotive electronivccs Max ambient temperature of power device Device Si- Si- Si- Si- Si- Si- Si- Si- Si- Si- Si- Si- Si- Si- Si- Max junction temperature (degree C) Rthja required for inverter power density (W/cm3) with regard to Ta of 125deg C (deg C/W/cm3) Max mold temperature (deg C) package termical resistance (m Ohm) Logic devices Temperature attached to engine (degree C) Max junction temperature (degree C) Bond pad structure OPM OPM OPM OPM OPM OPM OPM OPM OPM OPM OPM OPM OPM OPM OPM Wire bonding Au/Cu wire Au/Cu wire Au/Cu wire Au/Cu wire Au/Cu wire Au/Cu wire Au/Cu wire Au/Cu wire Au/Cu wire Au/Cu wire Au/Cu wire Au/Cu wire Au/Cu wire Au/Cu wire Au/Cu wire SiP structure QFP/SOP/BGA (Side by side+ 3D) Manufacturable solutions exist, and are being optimized Manufacturable solutions are known Interim solutions are known Manufacturable solutions are NOT known Notes for Table AP Interconnection and cooling will be added for power devices in future revisions

30 Changes in Key Parameters for 2013 ITRS Year of Production Year of Production Device Device Si- Si- Si- Si- Si- Si- Si- Si- Si- Si- Si- Si- Si- Si- Max junction temperature (degree C) Rthja required for inverter power density (W/cm3) with regard to Ta of 125deg C (deg C/W/cm3) Max mold temperature (deg C) package termical resistance (m Ohm) Logic devices Si- Si- Si- Si- Max junction temperature (degree C) Temperature attached to engine (degree C) Rthja required for inverter power density (W/cm3) with regard to Ta of 125deg C (deg C/W/cm3) Max junction temperature (degree C) Bond pad structure OPM OPM OPM OPM OPM OPM OPM OPM OPM OPM OPM OPM OPM OPM OPM Wire bonding Au/Cu wire Au/Cu wire Au/Cu wire Au/Cu wire Au/Cu wire Au/Cu wire Au/Cu wire Au/Cu wire Au/Cu wire Au/Cu wire Au/Cu wire Au/Cu wire Au/Cu wire Au/Cu wire Au/Cu wire Max mold temperature (deg C) package termical resistance (m Ohm) Logic devices Accelerated SiC and GaN Reduced max junction temperature For power devices Reduced mold temperature For power devices Reduced temperature attached to engine and Max junction temperature for logic devices Temperature attached to engine (degree C) Max junction temperature (degree C) Bond pad structure OPM OPM OPM OPM Wire bonding Au/Cu wire Au/Cu wire Au/Cu wire Au/Cu wire Si- Accelerated adoption of Cu wire bonds

31 Thank You for your attention