0.5mm and 1mm Pitch Connectors For FPC/FFC

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1 0.5mm and 1mm Pitch onnectors For FP/FF FH Series Flip-lock Features 1. Ease of Use and Space Savings Only one finger or.9n (Newtons) of force is required to lock Hirose s rotational actuator (flip-lock) as compared to using 2 fingers and 39.2N to close a FF/FP connector from our competition. The Flip-Lock design also allows customers to place 2 or more connectors side by side as there is no need to waste additional board space for a side latch. 2. Strengthened Flip-lock ctuator The standard Flip-Lock requires only 2.0mm height above the board. strengthened lock lever is available which only requires an additional 0.4mm. 3. Supports Thin FP (0.mm) Hirose does not require double-sided FP to have any additional strengthening plate or stiffener and can therefore support a thickness of as little as 0.mm +/ Hirose Ensures Reliability Hirose s patented half tuning fork contacts maintain the required normal force without relying on the connector housing. With our competitor s conventional products the housing walls support the contact force, which does not provide for long-term reliability. 5. Prevention of Solder ridge Excess solder cavity absorbs excessive solder and avoids solder bridging.. Three different assembly types FH is offered in Top & ottom ontact and Vertical Mount and offered in both a 0.5mm contact pitch as well as a 1.0mm contact pitch (bottom contact only). Rotating One-touch Mechanism q w e pplications Notebook computers, printers, Ps, digital cameras and other compact devices for interconnecting the main circuit board with the L, H or other device.

2 Product Specifications Rating urrent rating: 0.4 Operating Temperature Range:_ to +70ç (Note 1) Storage Temperature Range:_ to +ç (Note 2) Voltage rating: V Operating Humidity Range:Relative humidity, 90% max. Storage Humidity Range:Relative humidity, 90% max. (Not dewed) (Not dewed) pplicable FP t=0.3±0.05 Tin-lead plated(note 3) t=0. ± 0.05 for FHF-*S-0.5SH Item Specification onditions 1. Insulation resistance 0M ohms minimum 0V 2. Withstanding voltage No flashover or insulation breakdown. 0V /1 minute 3. ontact resistance m ohms maximum 1m 4. urability (Insertion/withdrawal) ontact resistance: m ohms maximum cycles 5. Vibration No electrical discontinuity of 1µs or more Frequency: to 55 Hz, single amplitude of 0.75 mm, ontact resistance: m ohms maximum. 2 hours in each of the 3 directions.. Shock No electrical discontinuity of 1µs or more cceleration of 490 m/s 2, 11 ms duration, ontact resistance: m ohms maximum. sine half-wave waveform, 3 cycles in each of the 3 axis. ontact resistance: m ohms maximum. 7. Humidity(Steady state) Insulation resistance: M ohms minimum. 9 hours at temperature of ç and humidity of 90% to 95% ontact resistance: m ohms maximum. 5 cycles under conditions as follows; 8. Temperature ycle Insulation resistance: M ohms minimum. Temperature: -ç / to 35ç / 85ç / to 35ç, Time: / 5 max. / / 5 max.(minutes) No deformation of Reflow: t the recommended temperature profile 9.Resistance to Soldering heat components affecting performance. Manual soldering: 3±5ç for 3 seconds Note 1: Includes temperature rise caused by current flow. Note 2: The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature Range and Humidity range covers nonconducting condition of installed connectors in storage, shipment or during transportation. Note 3: When FP is gold plated, the connector contacts should be also gold plated: Select the (55) specification. Material Part Material Finish Remarks Polyamide, LP(0 pos.) olor : eige Insulator UL94V-0 PPS olor : ark brown ontact Phosphor bronze Tin-lead plated Metal Fittings rass Tin-lead plated Ordering Information FH - (4) - S SH (55) q w e r t y u i o q Series Name : FH t ontact alignment: Single w lank : standard type : Top contact type S : Type with strengthed flip-lock actuator y Eccentric direction: lank : standard type : Eccentric type F : Type with 0.mm FP End Thickness u ontacts Pitch : 0.5mm, 1mm e Standard type : of contacts i ontact type Eccentric type : of contacts in 0.5mm housing SH : SMT horizontal mounting type r Standard type : lank SV : SMT vertical mounting type Eccentric type : of contacts o Plating specification lank : Tin-lead plated (55) : Gold plated 7

3 Series onfiguration Pitch ottom ontact Type Top ontact Type Vertical mounting Type FH- ** S-0.5SH P. of contacts,, 11,,, 14, FP conductive surface FP conductive surface (bottom side) 0.5mm,,,, 19,,,,,, 28,,,,,,,,, 53 Type with Strengthened Lock Lever FHS- ** S-0.5SH P. of contacts,,,, 53 Type with 0.mm FP End Thickness FHF- ** S-0.5SH P.14 of contacts,,,, 14,,,,,,,, 28,,, (),,, FH- ** S-0.5SH P. of contacts,,,,,,,,, 28, 29,,,,,,, 42,, FH- ** S-0.5SV P. of contacts,,,,,,,,,,,,,,,,,, 49,, 0 FP conductive surface (bottom side) 1mm Standard FH- ** S-1SH P. Eccentric FH- ** (**) S-1SH Standard of contacts 5,, 7, 8, 9, 11,,, Eccentric of contacts 4,, 8,, 11, 14, 19, FH- ** S-1SV P.19 of contacts, 7, 8,,,, 8

4 Top ontact Type Operation 1. FP/FF Termination procedure. onnector installed on the board. 1) Lift up the actuator. Use thumb or index finger. Precautions 1) void forcing the actuator up or down without the FP/FF inserted. 2) Fully insert the FP/FF parallel to mounting surface, with the exposed conductive traces facing UP. FP insertion area FP/FF conductive traces 2) When closing down the actuator apply equal pressure to both sides of the actuator. Stiffener 3) Rotate down the actuator until firmly closed. It is critical that the inserted FP/FF is not moved and remains fully inserted. Should the FP/FF be moved, open the actuator and repeat the process, starting with Step 1 above. 3) void forced pulling of the FP. Forced pulling will cause the FP to become disconnected or damaged. 2. FP/FF Removal 1) Lift up the actuator. 2) arefully remove the FP/FF.

5 0.5mm Pitch Top ontact Type 0.5 (0.2) Mated ross-sectional iagram FP/FF ontact Surface (1.9) (1.) 2 (1.85) (5).2 1. (0.) (3.) 2 E Part FH-S-0.5SH FH-S-0.5SH FH-S-0.5SH FH-S-0.5SH FH-S-0.5SH FH-S-0.5SH FH-S-0.5SH FH-S-0.5SH FH-S-0.5SH FH-28S-0.5SH FH-29S-0.5SH FH-S-0.5SH FH-S-0.5SH FH-S-0.5SH FH-S-0.5SH FH-S-0.5SH FH-S-0.5SH FH-42S-0.5SH FH-S-0.5SH FH-S-0.5SH L No Note 1 : Embossed tape reel packaging (2,000 pieces/reel). Order by number of reels. Note 2 : The design is such that the FP/FF protrudes on an upward angle so that other parts can be mounted beneath the PF/FF. In view of this, please take note of the gap at the top surface of the connector. Unit:mm E

6 Recommended FP/FF dimensions and Land/Metal Mask dimensions 0.5mm Pitch Product FP/FF dimensions Land / Metal Mask dimensions 0.5mm Pitch ottom ontact Type 0.5mm Pitch Top ontact Type 3.5MIN 0.5± ±0.05 ±0.05 ± ±0.03(FP) 0.3±0.03(FF) Product Type Types other than 0.3±0.05min those below Stiffener thickness should be 0.8 mm (7.5 mil) min Types with an FP end 0.±0.05 thickness of 0. mm MIN Unit: mm ± ± ± ±0.1 ±0.1 ± ±0.03(Land) 0.±0.03(Metal mask) Recommended metal mask thickness : 0.mm Unit: mm Even contact number Odd contact number 2MIN 0.5±0.1 3MIN 0.5± ±0.03(FP) 0.3± ±0.03(FF) ±0.05 ± ± ±0.1 ± ±0.1(Land) 0.5±0.05(Metal mask) No.1 contact 4.5± ± ±0.1 ± ±0.1(Land) 0.5±0.05(Metal mask) No.1 contact 0.5±0.05 1± ±0.1(Land) 0.5± ±0.05(Metal mask) 1± ±0.1(Land) 0.5±0.05(Metal mask) 1±0.05 ±0.05 1±0.05 1±0.05 ±0.05 1± ± mm Pitch Vertical Mounting Type *Set the stiffener thickness to 0.8 (7.5mil) min Unit: mm Recommended metal mask thickness : 0.mm Unit: mm

7 Packaging Specification Embossed arrier Tape s Horizontal Type (ommon to ottom/top ontact, 0.5mm/1mm Pitch) (2.0) Flat surface for placement with utomatic equipment 0.5mm Pitch ottom/top ontact Type mm Pitch ottom ontact Type Standard Type Note: 2,000 pieces per reel Note: 2,000 pieces per reel. Eccentric Type Unit:mm Unit:mm

8 Reel s (ommon to ll Types) End portion Mounting portion Lead portion (0mm min.) lank portion ( pockets min.) Embossed carrier tape lank portion ( pockets min.) Top cover tape Recommended Temperature Profile HRS test conditions Solder method :Reflow, IR/hot air (Nihon en-netsu o., Ltd. s Part : SENSY NR-2) Environment: :Room air Solder composition :Paste, 3%Sn/37%Pb (Senju Metal Industry, o., Ltd. s Part : OZ3-1--9) Test board :Glass epoxy mm 80mm 1.mm thick Land dimensions :Top and bottom contact type 0.3mm 1.3mm Vertical mounting type 0.mm 1.5mm Metal mask :Top and bottom contact type 0.mm 1.3mm 0.mm thick Vertical mounting type 0.5mm 1.5mm 0.mm thick This temperature profile is based on the above conditions. In individual applications the actual temperature may vary, depending on solder paste type, volume/thickness and board size/thickness. onsult your solder paste and equipment manufacturer for specific recommendations. 23

9 FH Series FP/FF onstruction (Recommended Specifications) 1. FF FF : Flexible Flat able Material Name Material Thickness (µm) Hard copper foil with tin plating 35 dhesive Polyester type Polyester dhesive Polyester type Stiffener Polyester type 8 (Note) Total 295 *Real tolerance of thickness dimension is on the order of ± µm (275 to 3 µm) Note: Use of a thicker FF results in a stiffer lock action and the lock is more easily released. factor that contributes to thicker FF is the use of 0 µm stiffener which is thicker than the standard (8 µm) product. This results in a total thickness of 357 µm. When using FF, control of FF thickness becomes easy if you indicate to us the thickness of the stiffener. 2. FP FP : Flexible Printed ircuit Material Name overing layer film Material Polyamide 1 mil over adhesive Surface treatment opper foil ase adhesive Tin-lead u 1oz ase film Reinforcement material adhesive Stiffener Polyamide 1 mil Heat-hardened adhesive Polyamide 7 mil Total Thickness (µm) Precautions 1. This specification is a recommendation for the construction of the FH Series FP and FF (t=0.3 ±0.05). 2. For details about the construction, please contact the FP/FF manufacturers.

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