Development of high reliability fuse for space use
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1 The26th Microelectronics Workshop 1 Development of high reliability fuse for space use TATEYAMA KAGAKU DEVICE TECHNOLOGY CO.,LTD
2 CONTENTS 2 1. Background 2. Development of SMD Fuse 3. Function of fuse 3.1 Common function 3.2 Necessary function for space use Resistance to vibration and shock Performance in vacuum environment 4. Feature of TATEYAM s Fuse 5. Assurance of pre-arcing time characteristic 6. Roadmap
3 1. Background 3 About TATEYAMA History ( Space component business ) Chip Resistor 1994 : Started producing and supplying chip resistors for Space use 2007 : Chip Resistor acquired JAXA qualification 2010 : Chip Thermistor acquired JAXA qualification Chip Thermistor 2011 : Leaded Fuse acquired JAXA qualification Proceeding development for Space component business as a core technology, Thick Film Printing Technology Leaded Fuse
4 1. Background 4 In 2011, TATEYAMA acquired JAXA qualification and started selling Leaded Fuse for Space use. Space set makers are changing electric parts from leaded type to SMD type as a purpose of lighter weight and lower cost. According to a request of SMD type fuse by users, we started developing.
5 2. Development of SMD Fuse 5 Specification Rating Voltage ( V ) Rating Current ( A ) Resistance Max (m ohm) Pre-arcing time ( m sec ) 250% 400% 600% Operating Temperature Maximum breaking capacity [DC] Style J ~ ~ ~ ~ ,000A J
6 2. Development of SMD Fuse Specification 6 Style and Dimension Style Dimension ( mm ) A B C D E F J J
7 2. Development of SMD Fuse Specification 7 Construction 5. Protective coating 1. Molded resin 2. Substrate 3. Lead adhesive 4. Lead terminal 6. Upper-glass 7. Fuse-element 8. Lower-glass 2. Substrate 9. Electrode pad Special Feature Upper-glass layer on fuse-element and solid
8 2. Development of SMD Fuse 8 One of the design target : Light-weight Voltage ( V ) Rating Leaded Fuse SMD Fuse ( new ) Current ( A ) Style Weight ( mg ) J J Style Weight ( mg ) J J Leaded Fuse style J1 2. Leaded Fuse style J2 3. SMD Fuse style J1 4. SMD Fuse style J2 72V-10A : Change style from J2 to J1 Style J1 : Weight cut-down / 36% Style J2 : Weight cut-down / 61%
9 2. Development of SMD Fuse 9 New design for SMD Fuse Used design of parallel-elements for Light-weight. Achieved downsizing(72v-10a) and low-height by reducing the arc-energy. Single-element Parallel-elements ( 5P ) Test condition ( short circuit ) Sample: 72V-7.5A Voltage: 72V (rating voltage) Current : 1,000A( A/s) Arcing I 2 t : 0.33 (A 2 s) Arcing I 2 t : 0.11 (A 2 s) 200A 170A 72V 72V 100μs 42μs
10 3. Function of fuse Common function Application condition with fuses mounted In Normality In Abnormality Fuse operation Shall not be open circuit Shall be open circuit and not be reconnected 3.2 Necessary function for space use Resistance to vibration and shock Performance in vacuum environment
11 3.2 Necessary function for space use Resistance to vibration and shock Necessary to have resistance to vibration and shock caused by launch of locket Construction of fuse and Resistance to vibration and shock Construction Cavity-style Solid-style Resistance to vibration and shock Weak Passable High
12 3.2 Necessary function for space use Performance in vacuum environment Fuse shall show same performance in both vacuum and non-vacuum environment (Non-influence by atmospheric pressure) Effect of vacuum environment a) Change of pre-arcing time by reduction of heat radiation b) Open circuit by reduction of vapor pressure
13 3.2.2 Performance in vacuum environment 13 Effect of vacuum environment a) Change of pre-arcing time Balance between self-heating and heat radiation Joule heat by current Heat radiation Get to thermal balance Keep current-carrying Joule heat by current > Heat radiation Temperature rise Lead to fusion (open)
14 3.2.2 Performance in vacuum environment 14 Effect of vacuum environment a) Change of pre-arcing time Heat radiation From surface of fuse-element = + From fuse-element to electrode In case that fuse-element is exposed to the air, radiation from surface of fuse-element decrease or is lost in vacuum environment. Change of pre-arcing time ( become shorter )
15 3.2.2 Performance in vacuum environment 15 Effect of vacuum environment b) Open circuit by reduction of vapor pressure Vapor pressure curve
16 3.2.2 Performance in vacuum environment 16 Effect of vacuum environment b) Open circuit by reduction of vapor pressure In case that fuse-element is exposed in the air, fuse-element is sublimated to the gas and open in vacuum environment Photo: Fuse-element after 80% load current In vacuum, exposed fuse-element was opened at 5 minutes Necessary construction for space use: Non-exposing construction of the fuse-elements
17 4. Feature of TATEYAMA s Fuse 17 Upper-glass layer Function of upper-glass layer Heat radiation from surface of fuse-element by heat conduction Safely shutting current down Absorbing shock made by arc at clearing action Electric insulation after firing Getting electric insulation caused by compound made by clearing action Mechanism of clearing action Self-heating by overload current Fuse-element melts and changes to gas Gas diffuses into upper-glass Upper-glass melted by heat and make compound Made compound shows electric insulation Upper-glass Compound Fuse-element
18 5. Assurance of pre-arcing time characteristic 18 Quality conformance inspection Group A ( JAXA-QTS-2210 ) Group Examination or Test Number of units ( /Lot ) A1 X-ray inspection ALL A2 Thermal shock ( 5 cycle ) Burn-in ( 168h ) Resistance ALL A3 Externals, dimensions and marking AQL 1.0% A4 Current-carrying capacity Dielectric strength Overload interrupt Insulation resistance A5 Terminal strength 4 A6 Solderability 4 A7 DPA 3 21
19 Applied current 5. Assurance of pre-arcing time characteristic 19 Sorting pre-arcing time process ( in-process inspection ) Measurement 1 ; Resistance value which is free from the influence of self-heating Measurement 2 ; Resistance value at the time of temperature rise by self-heating Making a prediction of pre-arcing time by change of resistance value ( alternative parameter ) Measurement 2 Measurement 1 time
20 Pre-arcing time ( m sec ) Pre-arcing time ( m sec ) 5. Assurance of pre-arcing time characteristic 20 Pre-arcing time at 250% rated current Resistance value ( m ohm ) 1 7.0% 7.5% 8.0% 8.5% 9.0% 9.5% Alternative-parameter
21 Pre-arcing time ( m sec ) 5. Assurance of pre-arcing time characteristic 21 Verification of parallel-elements by Alternativeparameter Clearing Time after Life Test ( at 250% rated current ) Element dimension (width) : standard (100%) 6P : 100% 5P+85% : 100% 5P+115% 〇 : 100% 4P+85%+115% : 100% 4P+75%+125% Green: No Life Test Red : After 1,000 hours Blue : After 2,000 hours % 7.2% 7.4% 7.6% 7.8% 8.0% 8.2% 8.4% 8.6% Alternative-parameter
22 6. Roadmap 22 EV More High-power More Small, Lightweight
23 23 JAXA qualified parts of TATEYAMA
24 Leaded Fuse On EPPL 24 Construction & Feature Rating 1. Molded resin 2. Substrate Rating Pre-arcing time [25 ] (ms) 3. Lead adhesive 4. Lead terminal Part Number Voltage (V) Current (A) 250% 400% 600% Style JAXA2210/101-A72V1AL 1.0 JAXA2210/101-A72V1.5AL Protective coating 6. Upper-glass JAXA2210/101-A72V2AL 2.0 JAXA2210/101-A72V3AL JAXA2210/101-A72V5AL 5.0 JAXA2210/101-A72V7.5AL ~ 300 ~ 15.0 ~ 3.00 J1 7. Fuse-element 8. Lower-glass 2. Substrate 9. Electrode pad Superior resistance to vibration and shock Keep the same performance in both vacuum and non-vacuum environment JAXA2210/101-A72V10AL 10.0 JAXA2210/101-A72V15AL 15.0 JAXA2210/101-A126V1AL 1.0 JAXA2210/101-A126V3AL JAXA2210/101-A126V5AL ~300 ~15.0 ~3.00 J2 J2 Dimension Style Dimension [mm] A B C D E F J J A B D F C E
25 Thick Film Chip Resistor 25 Construction & Feature Rating Type Designation Dimension
26 NTC Chip Thermistor On EPPL 26 Construction & Feature Rating Type Designation Dimension
27 27 Thank you very much!
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