FUZETEC TECHNOLOGY CO., LTD.
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1 NO. PQ18-01ER Product Specification and Approval Sheet Version A9 Page 1/5 Surface Mountable PTC Resettable Fuse: FSMD1206 Series 1. Summary (a) RoHS Compliant & Halogen Free (b) Applications: All high-density boards (c) Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices (d) Operation : 0.05A~2.0A (e) Maximum Voltage: 6V~60VDC (f) Temperature Range : -40 to Agency Recognition UL : C-UL: TÜ V: File No. E File No. E File No. R Electrical Characteristics (23 ) Part Number Hold Trip Rated Voltage Max Typical Power Max Time to Trip Resistance Time RMIN R1MAX IH, A IT, A VMAX, VDC IMAX, A Pd, W A Sec Ohms Ohms FSMD R FSMD R FSMD R FSMD R FSMD R FSMD R FSMD R FSMD R FSMD R FSMD R FSMD R FSMD R FSMD R FSMD R FSMD R FSMD R FSMD R FSMD R IH=Hold current-maximum current at which the device will not trip at 23 still air. IT=Trip current-minimum current at which the device will always trip at 23 still air. V MAX=Maximum voltage device can withstand without damage at it rated current.(i MAX) I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23 still air environment. RMIN=Minimum device resistance at 23 prior to tripping. R1MAX=Maximum device resistance at 23 measured 1 hour after tripping or reflow soldering of 260 for 20 seconds. Termination pad characteristics Termination pad materials: Pure Tin
2 NO. PQ18-01ER Product Specification and Approval Sheet Version A9 Page 2/5 4. FSMD Product Dimensions (Millimeters) Part A B C D E Number Min Max Min Max Min Max Min Max Min Max FSMD R FSMD R FSMD R FSMD R FSMD R FSMD R FSMD R FSMD R FSMD R FSMD R FSMD R FSMD R FSMD R FSMD R FSMD R FSMD R FSMD R FSMD R
3 Time-to-trip (S) Percent of Rated Hold and Trip NO. PQ18-01ER Product Specification and Approval Sheet Version A9 Page 3/5 5.Thermal Derating Curve 200% FSMD1206 Series 150% 100% 50% 0% Ambient Temperature ( ) 6.Typical Time-To-Trip at 23 Z= FSMD R A= FSMD R B= FSMD R C= FSMD R D= FSMD R E= FSMD R / R F= FSMD R / R G= FSMD R / R H= FSMD R / R I= FSMD R J= FSMD R / R K= FSMD R L= FSMD R 100 Z A B C D E F G H I J K L Fault current (A)
4 NO. PQ18-01ER Product Specification and Approval Sheet Version A9 Page 4/5 7. Material Specification Terminal pad material: Pure Tin Soldering characteristics: Meets EIA specification RS 186-9E, ANSI/J-std-002 Category 3 8. Part Numbering and Marking System Part Numbering System F S M D 1206 R Voltage Rating Rating Part Marking System F FA Part Identification Example Fuzetec Logo FZ = FSMD R FA = FSMD R FJ = FSMD R FK = FSMD R FB = FSMD R FL = FSMD R FP = FSMD R FC = FSMD R FM = FSMD R FD = FSMD R FN = FSMD R FE = FSMD R FO = FSMD R FF = FSMD R FG = FSMD R FQ = FSMD R FH = FSMD R FI = FSMD R Warning: -Operation beyond the specified maximum ratings or improper use may result in damage and possible electrical arcing and/or flame. -PPTC device are intended for occasional overcurrent protection. Application for repeated overcurrent condition and/or prolonged trip are not anticipated. 甲 -Avoid contact of PPTC device with chemical solvent. Prolonged contact will damage the device performance.
5 NO. PQ18-01ER Product Specification and Approval Sheet Version A9 Page 5/5 9. Pad Layouts Solder Reflow and Rework Recommendations The dimension in the table below provide the recommended pad layout for each FSMD1206 device Pad dimensions (millimeters) A B C Device Nominal Nominal Nominal All 1206 Series Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Tsmax to Tp) 3 /second max. Preheat : Temperature Min (Tsmin) 150 Temperature Max (Tsmax) 200 Time (tsmin to tsmax) seconds Time maintained above: Temperature(T L ) Time (t L ) seconds Peak/Classification Temperature(Tp) : 260 Time within 5 of actual Peak : Temperature (tp) seconds Ramp-Down Rate : 6 /second max. Time 25 to Peak Temperature : 8 minutes max. Note 1: All temperatures refer to of the package, measured on the package body surface. Reflow Profile Solder reflow Due to Lead Free nature, Temperature and Dwelling time for the soldering zone is higher than those for Regular. This may cause damage to other components. 1. Recommended max past thickness > 0.25mm. 2. Devices can be cleaned using standard methods and aqueous solvent. 3. Rework use standard industry practices. 4. Storage Envorinment : < 30 / 60%RH Caution: 1. If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. 2. Devices are not designed to be wave soldered to the bottom side of the board.
FSMD Page 8-12
OVERVIEW FRX... Page 2-4 FRU... Page 5-7 FSMD 2920... Page 8-12 FSMD 1210... Page 13-15 FSMD 1206... Page 16-18 FSMD 0805... Page 19-21 3 1 Radial Leaded PTC Resettable Fuse : FRX Series 1. Summary (a)
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Description The 0805 series provides miniature surface mount resettable overcurrent protection with holding current from 0.1A to 1.1A. This series is suitable for ultra portable applications where space
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More informationFeatures. Samples. I max (A) P d. typ. (W)
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More informationFeatures. V max (Vdc) I max (A) typ. (W) P d
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