16. Package Information for Stratix II & Stratix II GX Devices

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1 16. Packag Information for Stratix II & Stratix II GX vics SII Introduction This chaptr provids packag information for Altra Stratix II and Stratix II GX dvics, including: vic and packag cross rfrnc Thrmal rsistanc valus Packag outlins Tabls 16 1 and 16 2 show which Altra Stratix II and Stratix II GX dvics, rspctivly, ar availabl in FinLin BGA (FBGA) packags. Tabl Stratix II vics in FBGA Packags vic Packag Pins P2S15 Flip-chip FBGA 484 Flip-chip FBGA 672 P2S30 Flip-chip FBGA 484 Flip-chip FBGA 672 P2S60 Flip-chip FBGA 484 Flip-chip FBGA 672 Flip-chip FBGA 1,020 P2S90 Flip-chip FBGA 484 Flip-chip FBGA 780 Flip-chip FBGA 1,020 Flip-chip FBGA 1,508 P2S130 Flip-chip FBGA 780 Flip-chip FBGA 1,020 Flip-chip FBGA 1,508 P2S180 Flip-chip FBGA 1,020 Flip-chip FBGA 1,508 Altra Corporation 16 1 May 2007

2 Thrmal Rsistanc Tabl Stratix II GX vics in FBGA Packags vic Packag Pins P2SGX30 Flip-chip FBGA 780 P2SGX60 Flip-chip FBGA 780 Flip-chip FBGA 1,152 P2SGX90 Flip-chip FBGA 1,152 Flip-chip FBGA 1,508 P2SGX130 Flip-chip FBGA 1,508 Thrmal Rsistanc Thrmal rsistanc valus for Stratix II dvics ar providd for a board that mts JC spcifications and for a typical board. Th following valus ar providd: θ JA ( C/W) still air Junction-to-ambint thrmal rsistanc with no air flow whn a hat sink is not usd. θ JA ( C/W) 100 ft./min. Junction-to-ambint thrmal rsistanc with 100 ft./min. airflow whn a hat sink is not usd. θ JA ( C/W) 200 ft./min. Junction-to-ambint thrmal rsistanc with 200 ft./min. airflow whn a hat sink is not usd. θ JA ( C/W) 400 ft./min. Junction-to-ambint thrmal rsistanc with 400 ft./min. airflow whn a hat sink is not usd. θ JC Junction-to-cas thrmal rsistanc for dvic. θ JB Junction-to-board thrmal rsistanc for dvic. Tabls 16 3 provids θ JA (junction-to-ambint thrmal rsistanc), θ JC (junction-to-cas thrmal rsistanc), and θ JB (junction-to-board thrmal rsistanc) valus for Stratix II dvics on a board mting JC spcifications for thrmal rsistanc calculation. Th JC board spcifications rquir two signal and two powr/ground plans and ar availabl at Tabl Stratix II vic Thrmal Rsistanc for Boards Mting JC Spcifications (Part 1 of 2) vic Pin Count Packag Still Air 100 ft./min. 200 ft./min. 400 ft./min. θ JC ( C/W) θ JB ( C/W) P2S FBGA FBGA P2S FBGA FBGA Altra Corporation Stratix II GX vic Handbook, Volum 2 May 2007

3 Packag Information for Stratix II & Stratix II GX vics Tabl Stratix II vic Thrmal Rsistanc for Boards Mting JC Spcifications (Part 2 of 2) vic Pin Count Packag Still Air 100 ft./min. 200 ft./min. 400 ft./min. θ JC ( C/W) θ JB ( C/W) P2S FBGA FBGA ,020 FBGA P2S Hybrid FBGA FBGA ,020 FBGA ,508 FBGA P2S FBGA ,020 FBGA ,508 FBGA P2S180 1,020 FBGA ,508 FBGA Tabl 16 4 provids θ JA (junction-to-ambint thrmal rsistanc), θ JC (junction-to-cas thrmal rsistanc), and θ JB (junction-to-board thrmal rsistanc) valus for Stratix II dvics on a board with th information shown in Tabl Tabl Stratix II vic Thrmal Rsistanc for Typical Board (Part 1 of 2) vic Pin Count Packag Still Air 100 ft./min. 200 ft./min. 400 ft./min. θ JC ( C/W) θ JB ( C/W) P2S FBGA FBGA P2S FBGA FBGA P2S FBGA FBGA ,020 FBGA P2S Hybrid FBGA FBGA ,020 FBGA ,508 FBGA Altra Corporation 16 3 May 2007 Stratix II GX vic Handbook, Volum 2

4 Thrmal Rsistanc Tabl Stratix II vic Thrmal Rsistanc for Typical Board (Part 2 of 2) vic Pin Count Packag Still Air 100 ft./min. 200 ft./min. 400 ft./min. θ JC ( C/W) θ JB ( C/W) P2S FBGA ,020 FBGA ,508 FBGA P2S180 1,020 FBGA ,508 FBGA Tabl Board Spcifications Nots (1), (2) Pin Count Packag Signal Layrs Powr/Ground Layrs Siz (mm) 1,508 FBGA ,020 FBGA FBGA FBGA FBGA Nots to Tabl 16 5: (1) Powr layr Cu thicknss 35 um, Cu 90%. (2) Signal layr Cu thicknss 17 um, Cu 15%. Tabl 16 6 provids θ JA (junction-to-ambint thrmal rsistanc) and θ JC (junction-to-cas thrmal rsistanc) valus for Stratix II dvics. Tabl Stratix II GX vic Thrmal Rsistanc vic Pin Count Packag Still Air 100 ft./min. 200 ft./min. 400 ft./min. θ JC ( C/W) P2SGX FBGA P2SGX FBGA ,152 FBGA P2SGX90 1,152 FBGA ,508 FBGA P2SGX130 1,508 FBGA Altra Corporation Stratix II GX vic Handbook, Volum 2 May 2007

5 Packag Information for Stratix II & Stratix II GX vics Packag Outlins Th packag outlins ar listd in ordr of ascnding pin count. Altra packag outlins mt th rquirmnts of JC Publication No Pin FBGA - Flip Chip All dimnsions and tolrancs conform to ASM Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an I dot, or a spcial fatur, in its proximity on th packag surfac. Tabls 16 7 and 16 8 show th packag information and packag outlin figur rfrncs, rspctivly, for th 484-pin FBGA packaging. Tabl Pin FBGA Packag Information scription Spcification Ordring cod rfrnc Packag acronym Substrat matrial Soldr ball composition JC outlin rfrnc Maximum lad coplanarity Wight Moistur snsitivity lvl F FBGA BT Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) MS-034 variation: AAJ inchs (0.20 mm) 5.8 g Printd on moistur barrir bag Tabl Pin FBGA Packag Outlin imnsions (Part 1 of 2) Symbol Millimtr Min. Nom. Max. A 3.50 A A A BSC BSC Altra Corporation 16 5 May 2007 Stratix II GX vic Handbook, Volum 2

6 Packag Outlins Tabl Pin FBGA Packag Outlin imnsions (Part 2 of 2) Symbol Millimtr Min. Nom. Max. b BSC Figur 16 1 shows a packag outlin for th 484-pin FinLin BGA packaging. Figur Pin FBGA Packag Outlin TOP VIW BOTTOM VIW Pin A1 Cornr Pin A1 I b A A2 A3 A1 672-Pin FBGA - Flip Chip All dimnsions and tolrancs conform to ASM Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an I dot, or a spcial fatur, in its proximity on packag surfac Altra Corporation Stratix II GX vic Handbook, Volum 2 May 2007

7 Packag Information for Stratix II & Stratix II GX vics Tabls 16 9 and show th packag information and packag outlin figur rfrncs, rspctivly, for th 672-pin FBGA packaging. Tabl Pin FBGA Packag Information scription Spcification Ordring cod rfrnc Packag acronym Substrat matrial Soldr ball composition F FBGA BT Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) JC Outlin Rfrnc MS-034 Variation: AAL-1 Maximum Lad coplanarity Wight Moistur Snsitivity lvl inchs (0.20 mm) 7.7 g Printd on moistur barrir bag Tabl Pin FBGA Packag Outlin imnsions Symbol Millimtrs Min. Nom. Max. A 3.50 A A A BSC BSC b BSC Altra Corporation 16 7 May 2007 Stratix II GX vic Handbook, Volum 2

8 Packag Outlins Figur 16 2 shows a packag outlin for th 672-pin FinLin BGA packaging. Figur Pin FBGA Packag Outlin TOP VIW BOTTOM VIW Pin A1 Cornr Pin A1 I b A A2 A3 A Altra Corporation Stratix II GX vic Handbook, Volum 2 May 2007

9 Packag Information for Stratix II & Stratix II GX vics 780-Pin FBGA - Flip Chip All dimnsions and tolrancs conform to ASM Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an I dot, or a spcial fatur, in its proximity on packag surfac. Tabls and show th packag information and packag outlin figur rfrncs, rspctivly, for th 780-pin FBGA packaging. Tabl Pin FBGA Packag Information scription Spcification Ordring cod rfrnc F Packag acronym FBGA Substrat matrial BT Soldr ball composition Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) JC outlin rfrnc MS-034 variation: AAM-1 Maximum lad coplanarity inchs (0.20 mm) Wight 8.9 g Moistur Snsitivity Lvl Printd on moistur barrir bag Tabl Pin FBGA Packag Outlin imnsions Millimtrs Symbol Min. Nom. Max. A 3.50 A A A BSC BSC b BSC Altra Corporation 16 9 May 2007 Stratix II GX vic Handbook, Volum 2

10 Packag Outlins Figur 16 3 shows a packag outlin for th 780-pin FinLin BGA packaging. Figur Pin FBGA Packag Outlin TOP VIW BOTTOM VIW Pin A1 Cornr Pin A1 I b A A2 A3 A Altra Corporation Stratix II GX vic Handbook, Volum 2 May 2007

11 Packag Information for Stratix II & Stratix II GX vics 1,020-Pin FBGA - Flip Chip All dimnsions and tolrancs conform to ASM Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an I dot, or a spcial fatur, in its proximity on packag surfac. Tabls and show th packag information and packag outlin figur rfrncs, rspctivly, for th 1,020-pin FBGA packaging. Tabl ,020-Pin FBGA Packag Information scription Spcification Ordring cod rfrnc Packag acronym Substrat matrial Soldr ball composition F FBGA BT Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) JC outlin rfrnc MS-034 variation: AAP-1 Maximum lad coplanarity Wight Moistur snsitivity lvl inchs (0.20 mm) 11.5 g Printd on moistur barrir bag Tabl ,020-Pin FBGA Packag Outlin imnsions Symbol Millimtrs Min. Nom. Max. A 3.50 A A A BSC BSC b BSC Altra Corporation May 2007 Stratix II GX vic Handbook, Volum 2

12 Packag Outlins Figur 16 4 shows a packag outlin for th 1,020-pin FinLin BGA packaging. Figur ,020-Pin FBGA Packag Outlin TOP VIW BOTTOM VIW Pin A1 Cornr Pin A1 I b A A2 A3 A Altra Corporation Stratix II GX vic Handbook, Volum 2 May 2007

13 Packag Information for Stratix II & Stratix II GX vics 1,152-Pin FBGA - Flip Chip All dimnsions and tolrancs conform to ASM Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an I dot, or a spcial fatur, in its proximity on packag surfac. Tabls and show th packag information and packag outlin figur rfrncs, rspctivly, for th 1,152-pin FBGA packaging. Tabl ,152-Pin FBGA Packag Information scription Spcification Ordring cod rfrnc Packag acronym Substrat matrial Soldr ball composition F FBGA BT Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) JC outlin rfrnc MS-034 variation: AAR-1 Maximum lad coplanarity Wight Moistur snsitivity lvl inchs (0.20 mm) 12.0 g Printd on moistur barrir bag Tabl ,152-Pin FBGA Packag Outlin imnsions Symbol Millimtrs Min. Nom. Max. A 3.50 A A A BSC BSC b BSC Altra Corporation May 2007 Stratix II GX vic Handbook, Volum 2

14 Packag Outlins Figur 16 5 shows a packag outlin for th 1,152-pin FinLin BGA packaging. Figur ,152-Pin FBGA Packag Outlin TOP VIW BOTTOM VIW Pin A1 Cornr Pin A1 I b A A2 A3 A Altra Corporation Stratix II GX vic Handbook, Volum 2 May 2007

15 Packag Information for Stratix II & Stratix II GX vics 1,508-Pin FBGA - Flip Chip All dimnsions and tolrancs conform to ASM Y14.5M Controlling dimnsion is in millimtrs. Pin A1 may b indicatd by an I dot, or a spcial fatur, in its proximity on packag surfac. Tabls and show th packag information and packag outlin figur rfrncs, rspctivly, for th 1,508-pin FBGA packaging. Tabl ,508-Pin FBGA Packag Information scription Spcification Ordring cod rfrnc Packag acronym Substrat matrial Soldr ball composition F FBGA BT Rgular: 63Sn:37Pb (Typ.) Pb-fr: Sn:3Ag:0.5Cu (Typ.) JC outlin rfrnc MS-034 Variation: AAU-1 Maximum lad coplanarity Wight Moistur snsitivity lvl inchs (0.20 mm) 14.6 g Printd on moistur barrir bag Tabl ,508-Pin FBGA Packag Outlin imnsions Symbol Millimtrs Min. Nom. Max. A 3.50 A A A BSC BSC b BSC Altra Corporation May 2007 Stratix II GX vic Handbook, Volum 2

16 Packag Outlins Figur 16 6 shows a packag outlin for th 1,508-pin FinLin BGA packaging. Figur ,508-Pin FBGA Packag Outlin TOP VIW BOTTOM VIW Pin A1 Cornr Pin A1 I b A A2 A3 A Altra Corporation Stratix II GX vic Handbook, Volum 2 May 2007

17 Packag Information for Stratix II & Stratix II GX vics ocumnt Rvision History Tabl shows th rvision history for this chaptr. Tabl ocumnt Rvision History at and ocumnt Vrsion Changs Mad Summary of Changs No chang May 2007, v4.3 Fbruary 2007 v4.2 No chang cmbr 2005, v4.1 Octobr 2005 v4.0 For th Stratix II GX vic Handbook only: Formrly chaptr 15. Th chaptr numbr changd du to th addition of th Stratix II GX ynamic Rconfiguration chaptr. No contnt chang. Minor chang to Tabl Addd th ocumnt Rvision History sction to this chaptr. Formrly chaptr 14. Chaptr numbr chang only du to chaptr addition to Sction I in Fbruary 2006; no contnt chang. Chaptr updatd as part of th Stratix II vic Handbook updat. Addd chaptr to th Stratix II GX vic Handbook. Altra Corporation May 2007 Stratix II GX vic Handbook, Volum 2

18 ocumnt Rvision History Altra Corporation Stratix II GX vic Handbook, Volum 2 May 2007

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