PROTECTRON MACHINED CONTACT CONNECTORS

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Nigel Terry
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1 PROTECTRON MACHINED CONTACT CONNECTORS

2 PROTECTRON INTRODUCTION INNER CLIP The inner cip consists of 4 Leaf Springs, stamped and rounded to take strip/round mae contacts at the bottom edge, faciitating ower insertion force, but high withdrawa force. This is an essentia requirement for high density contact connectors. The contact engagement in this design is a siding contact action, whie disengagement is a recoiing action on mae contacts. Contacts with ower insertion force can be made by using 6 eaf springs mosty for PGA Type Sockets. OUTER SLEEVE The outer seeve is a machined encosure, open at one end for insertion of Leaf Spring & the other end cosed. The seeve can be produced with different types of terminations. The cosed end on termination side heps in eimination of soder fux wicking action during sodering process. The Leaf Springs are therefore protected against the damaging infuences of the ceaning fux ike corrosion, contact contamination & open contacts (created by soidification of fux on the mating areas which becomes an Insuating medium). PLATING & FINISH Inner Cip & Outer Seeve can be separatey pated to match different requirements of users. Popuar pating of eaf spring is god whie that of the seeve is tin. Tin pated eaf spring & seeve can aso be offered as a cost saving option, depending on the user's requirement. INSULATORS Sockets can be mouded using the atest eectronic grade insuating materias ike Poyester, Poyphenyedene Suphide etc., meeting fammabiity grades 94V-0. For certain appications Gass Epoxy Sheets are aso recommended as insuators, where interconnects between contacts has to be aid inside the ayers eg. in Conversion Sockets. 126

3 ORDERING INFORMATION To enabe our customers to order our products easiy and without error, we have designed this ordering code with great care, to hep you to easiy arrive at the code without any difficuty. Supposing you want to order a IC Socket, 0.6 Pitch, 28 Pin, 3.2 mm tai ength, Inner contact god pated 0.25m, Outer seeve tin pated 5m, Capacitor type then the Part Number wi be P C P8 0 5 X XX X X X IC Socket Series Pitch (Row to Row) P X 0 = SIL 1 = 0.1" Pitch 3 = 0.3" Pitch 4 = 0.4" Pitch 6 = 0.6" Pitch 7 = 0.75" Pitch 9 = 0.9 Pitch Number of Contacts XX 01 to 64 Type of Termina X 0 = Fat Pin (No Mating) 1 = Soder Pin 3.2 mm Tai 2 = Soder Pin 4.2 mm Tai 3 = 2 Leve Wirewrap 9.5 mm 4 = 3 Leve Wirewrap 13 mm 5 = Adaptor Pin L-12 mm 6 = Bifurcated Pin 7 = Soder Cup Pin 8 = Turret Pin 9 = Interconnect Pin L mm A = Soder Pin 2.4 mm Tai (Utra fat) B = Soder Pin 2.8 mm Tai (Super fat) C = Headess Pin 3.2 mm Tai for Shrink dip D = Mini Spring Socket L-4.25 mm, =3.45 mm E = Mini Spring Socket L-6.3 mm, =5.5 mm F = Adaptor Pin L-10 mm, Ø0.76/Ø0.6 G = Adaptor Pin L-10 mm, Ø0.46 mm H = Soder Pin 3.2 mm Tai w/o Fishook I = Soder Pin 7.6mm Tai J = Adaptor Pin L-12.0mm, Ø0.76/Ø0.53mm K = Fat Pin (no Mating) L-16.7mm, 2.9mm Tai L = Interconnect Pin L-22.1mm, Ø0.78/Ø0.53mm M= Interconnect Pin L-22.1mm, Ø.72mm N = Soder Pin L-18mm, 13.8mm Tai O = Soder Pin L-20.9mm P = Interconnect Pin L-22.6mm, Ø0.78/Ø0.53mm Q = Soder Pin L-4.2mm w/o Tai R = Adaptor Pin L-13.3mm, Ø0.76/Ø0.46mm S = Adaptor Pin L-16mm, Ø0.75mm U = Adaptor Pin L-16mm, Ø0.48/Ø0.53mm V = Soder Pin L-13.9mm, 9.6mm Tai W= Soder Pin L-8.9mm, 4.6mm Tai FOR AVAILABILITY OF THE REQUIRED COMBINATION CHECK INDIVIDUAL DATA SHEETS Additiona Socket Identification X B =Shrink Dip C =Capacitor Type H =Soder Version I =Pug-in Version Pating Inner Cip Outer Seeve 1 = 0.25µ Au 5µ Sn 2 = 0.75µ Au 5µ Sn 3 = 5µ Sn 5µ Sn 4 = 0.75µ Au 0.25µ Au X 127

4 PROTECTRON TECHNICAL SPECIFICATIONS FOR IC SOCKETS Connector Parts Materias & Finishes Insuator Body Gass fied poyester, sef extinguishing, rated UL94 V-0 Outer Seeve Screw machined brass, pated 0.25 micron god or 5 micron Tin - ead over nicke pate Inner Cip Beryium - Copper, heat - treated, god or Tin pated Pins (Without Inner Cip) Screw machined brass or phosphor bronze Pated 0.25 microns god or 5 microns Tin over nicke pate Mechanica Properties Mechanica ife : 50 cyces Insertion force : Average insertion force with stee pin dia 0.41 =< 2 N (0.2 Kg) Extraction force : Average withdrawa force with stee pin dia 0.41 = > 0.5 N (0.05 Kg) Type of Cip 4 Finger stamped contact Minimum insertion depth : 2.6 mm Maximum insertion depth : 3.6 mm Eectrica Properties Rated current : 1 A Rated votage : 100 V AC Votage proof : 600 V AC Contact Resistance : 20 m ohms. Insuation resistance : ³5000 M 500 V DC Capacitance : 0.3Pf Max. (1Pf for shrink dip series) Environmenta Properties Operating temperature range : -65 C, +125 C Resistance to sodering heat : +260 C, 10 seconds Environment category : 65 / 125 /

5 PIN LAYOUT ø TO 0.56 ø0.40 TO 0.56 ø0.40 TO * * 0.45 ø0.25* = Fat Pin 1 = Soder Pin 3.20mm Tai 2 = Soder Pin mm Tai 3 = 2 Leve W/W 9.5mm Sq. MACHINED CONTACT CONNECTORS ø0.40 TO * 0.45 ø ø ø ø = 3 Leve W/W 13mm 5 = Adaptor Pin 6 = Bifurcated Pin 7 = Soder Cup Pin 8 = Turret Pin 9 = Interconnect Pin C = Headess Pin 3.2mm Tai PIN LAYOUT - PGA SOCKETS ø0.40 TO * 0.45 ø0.40 TO * 0.45 ø0.40 TO * ø Sq ø0.46 ø ø ø ø0.76 ø0.40 TO * ø0.8 ø ø ø1.37 ø0.50 ø ø1.15 ø Sq. D = 3.2mm Tai PGA Pin E = 4.2mm Tai PGA Pin F = 13mm PGA W/W 129

B PROTECTRON DUAL IN - LINE SOCKETS STANDARD SOLDER TAIL Features End to end, side to side stackabe No soder vicking Stands 4.2mm high on PCB Lead spacing 2.54mm Takes IC pins 0.43 dia / 0.25 x 0.

OPEN FRAME ORDERING INFORMATION P805 X XX X X IC Socket Row Pitch Number of Type of Pins Pating Series Spacing Contacts Inner Cip Outer Seeve P805 1 = 0.1" Pitch 01 1 = PC Pin 3.2mm 1 = 0.

6 B PROTECTRON DUAL IN - LINE SOCKETS STANDARD SOLDER TAIL Features End to end, side to side stackabe No soder vicking Stands 4.2mm high on PCB Lead spacing 2.54mm Takes IC pins 0.43 dia / 0.25 x 0.45 fat construction Pin insertion depth, 3.2mm min. OPEN FRAME ORDERING INFORMATION P805 X XX X X IC Socket Row Pitch Number of Type of Pins Pating Series Spacing Contacts Inner Cip Outer Seeve P805 1 = 0.1" Pitch 01 1 = PC Pin 3.2mm 1 = 0.25µ Au 5µ Sn 3 = 0.3" Pitch to 2 = PC Pin 4.2mm 2 = 0.75µ Au 5µ Sn 4 = 0.4" Pitch 64 3 = 5µ Sn 5µ Sn 6 = 0.6" Pitch 4 = 0.75µ Au 0.25µ Au 9 = 0.9" Pitch ø Ø ø No. OF CONTACTS -1 x 2.54 C ±0.1 B: 2.54 mm (0.1") B: 7.62 mm (0.3") B: mm (0.4") B:15.24 mm (0.6") B: mm (0.9") C: 5.08 mm C: 10.1 mm C: 12.6 mm C:17.7 mm C: 25.3 mm P8051-XX-XX P XX P XX P XX P XX P XX P XX P XX P XX 02 to 80 contacts P XX P XX P XX P XX P XX P XX P XX P XX P XX P XX P XX B: Pitch Row to Row C: Tota Socket Width DUAL IN - LINE SOCKETS WITH INTEGRATED DECOUPLING CAPACITOR Features End to end, side to side stackabe No soder vicking Stands 4.2mm high on PCB Lead spacing 2.54 mm Output pins integrated with decouping capacitor Open insuator frame ORDERING INFORMATION P805 X XX X X IC Socket Row Pitch Number of Type of Pins Pating Series Spacing Contacts Inner Cip Outer Seeve P805 3 = 0.3" Pitch 01 1 = PC Pin 3.2 mm 1 = 0.25µ Au 5µ Sn C: Capacitor 4 = 0.4" Pitch to 2 = PC Pin 4.2 mm 2 = 0.75µ Au 5µ Sn 0.1 µ F 50 V 6 = 0.6" Pitch 64 3 = 5µ Sn 5µ Sn 9 = 0.9" Pitch 4 = 0.75µ Au 0.25 µ Au B: 7.62 mm (0.3") B:10.16 mm (0.4") B:15.24 mm (0.6") B: mm (0.9") C: 10.1 mm C: 12.6 mm C:17.7 mm C: 25.3 mm P XXC P XXC P XXC Not avaiabe P XXC P XXC P XXC P XXC P XXC P XXC P XXC B: Pitch Row to Row C: Tota Socket Width ø x ø (PCB HOLE) C B OPEN FRAME 2.80 Ø A No. OF CONTACTS -1 x

7 B DUAL IN - LINE SOCKETS WIRE WRAP 2, 3 LEVEL Features End to end, side to side stackabe No soder vicking Lead spacing 2.54 mm 2 & 3 eve Wirewrap Stands 4.9 mm on PCB ORDERING INFORMATION P805 X XX X X IC Socket Row Pitch Number of Type of Pins Pating Series Spacing Contacts Inner Cip Outer Seeve P805 1 = 0.1" Pitch 01 3 = 2 eve W/W 9.52 mm 1 = 0.25 µ Au 5 µ Sn 3 = 0.3" Pitch to 4 = 3 eve W/W 1.3 mm 2 = 0.75 µ Au 5 µ Sn 4 = 0.4" Pitch 64 3 = 5 µ Sn 5 µ Sn 6 = 0.6" Pitch 4 = 0.75 µ Au 0.25 µ Au 9 = 0.9" Pitch B: 2.54 mm (0.1") B:7.62 mm (0.3") B:10.16 mm (0.4") B:15.24 mm (0.6") B: mm (0.9") C: 5.08 mm C:10.1 mm C: 12.6 mm C:17.7 mm C: 25.3 mm 2.54 No. OF CONTACTS -1 x 2.54 C ±0.1 OPEN FRAME SQ B: Pitch Row to Row C: Tota Socket Width ø MACHINED CONTACT CONNECTORS P8051-XX-XX P XX P XX P XX P XX P XX P XX P XX P XX 02 to 80 Contacts P XX P XX P XX P XX P XX P XX P XX P XX P XX P XX 131

8 PROTECTRON SINGLE IN - LINE SOCKETS Features Can be cut easiy into required sizes Lead spacing 2.54mm Easy to stack Avaiabe in specific ength ORDERING INFORMATION P805 X XX X X IC Socket Row Pitch Number of Type of Pins Pating Series Spacing Contacts Inner Cip Outer Seeve P805 0 = SIL 01 1 = Soder Pin 3.2 mm tai 1 = 0.25 µ Au 5 µ Sn to 2 = Soder Pin 4.2 mm tai 2 = 0.75 µ Au 5 µ Sn 64 3 = 2 Leve Wirewrap 3 = 5 µ Sn 5 µ Sn 4 = 3 Leve Wirewrap 4 = 0.75 µ Au 0.25 µ Au 5 = Adaptor Pin H - For 5 to 9 type of pin 6 = Bifurcated Pin 1= 5 µ Sn H 7 = Soder Cup Pin 4 = 0.25 µ Au 8 = Turret Pin 9 = Interconnect Pin For other type of pins refer pg No. OF POSITIONS x 2.54 No. OF CONTACTS -1 x A A ø PCB HOLE SECTION-AA ø0.40 TO 0.56 ø0.25* TO * 0.45 ø0.40 TO * Sq = Soder Pin 3.20mm Tai 2 = Soder Pin mm Tai 3 = 2 Leve W/W 9.5mm ø0.40 TO * 0.45 ø ø ø ø ø ø = Adaptor Pin 6 = Bifurcated Pin ø1.0 ø ø ø Sq = 3 Leve W/W 13mm ø ø ø1.37 ø0.50 ø = Soder Cup Pin 8 = Turret Pin 9 = Interconnect Pin 132

1" Pitch 01 5 = Adaptor Pin 1 = 5 µ Sn 3 = 0.3" Pitch to 6 = Bifurcated Pin 4 = 0.25 µ Au 4 = 0.4" Pitch 64 7 = Soder Cup Pin 6 = 0.6" Pitch 8 = Turret Pin 9 = 0.

9 DUAL IN - LINE ADAPTORS STANDARD SOLDER TAIL Features Straight soderabe sockets with 0.46 mm For piggy back constructions Lead spacing 2.54 mm Aso avaiabe with different pin engths, on request ORDERING INFORMATION P805 X XX X X IC Socket Row Pitch Number of Type of Pins Pin Pating Series Spacing Contacts P805 1 = 0.1" Pitch 01 5 = Adaptor Pin 1 = 5 µ Sn 3 = 0.3" Pitch to 6 = Bifurcated Pin 4 = 0.25 µ Au 4 = 0.4" Pitch 64 7 = Soder Cup Pin 6 = 0.6" Pitch 8 = Turret Pin 9 = 0.9" Pitch 9 = Interconnect Pin For other type of terminas, refer pg ø0.64 C B OPEN FRAME MACHINED CONTACT CONNECTORS B: 2.54 mm (0.1") B:7.62 mm (0.3") B:10.16 mm (0.4") B:15.24 mm (0.6") B: mm (0.9") C: 5.08 mm C:10.1 mm C: 12.6 mm C:17.7 mm C: 25.3 mm P8051-XX-XX P XX P XX P XX P XX P XX P XX P XX P XX 02 to 80 Contacts P XX P XX P XX P XX P XX P XX P XX P XX P XX P XX 3.80 ø0.46 B: Pitch Row to Row C: Tota Socket Width SHRINK DIP SOCKETS AND STRIPS SOLDER TAIL Features End to end, side to side, stackabe No soder vicking Stands 4.2 mm high on PCB Open Frame Lead spacing 0.07 (1.778 mm) OPEN FRAME ORDERING INFORMATION P805 X XX X X IC Socket Row Pitch Number of Type of Pins Pating Series Spacing Contacts Inner Cip Outer Seeve P805 3 = 0.3" Pitch 01 C = PC Pin 1 = 0.25 µ Au 5µ Sn B : Shrink 4 = 0.4" Pitch to 3.2 mm Tai 2 = 0.75 µ Au 5µ Sn Dip 6 = 0.6" Pitch 64 3 = 5µ Sn 5µ Sn 7 = 0.75" Pitch B: 7.62 mm (0.3") B:10.16 mm (0.4") B:15.24 mm (0.6") B: mm (0.75") C: 10.1 mm C: 12.6 mm C:17.7 mm C: mm P XXB P XXB P XXB P XXB P XXB P XXB P XXB P XXB P XXB P XXB P XXB P XXB P XXB SINGLE ROW STRIPS P XXB ø x ø (PCB HOLE) B: Pitch Row to Row C: Tota Socket Width C B Ø

PROTECTRON DUAL IN-LINE SOCKETS ULTRA FLAT OPEN FRAME Features Uses Utrafat, open frame socket body 4 finger short cip Contact point at 1.9mm Utrafat profie ony Lead spacing 2.54mm Stands 2.

10 PROTECTRON DUAL IN-LINE SOCKETS ULTRA FLAT OPEN FRAME Features Uses Utrafat, open frame socket body 4 finger short cip Contact point at 1.9mm Utrafat profie ony Lead spacing 2.54mm Stands 2.4mm on PCB Hoe dried into soder tai to aow proper IC insertion Fits standard PC board hoes ø x C B 1.80 ø Ø ø0.76 [2.54x(NO. OF CONTACTS/ROW-1)] 2.54x(NO. OF CONTACTS/ROW) ORDERING INFORMATION P805 X XX X X IC Socket Row Pitch Number of Type of Pin Pating Series Spacing Contacts Inner Cip outer seeve P805 3=0.3" Pitch 01 A-Soder Pin 1=0.25m Au 5m Sn D=Utra Pin 4=0.4" Pitch to 2.4mm Tai 2=0.75m Au 5m Sn 6=0.6" Pitch 64 3=5m Sn 5m Sn 4=0.75m Au 5m Sn B:7.62mm (0.3 ) B=10.16mm (0.4 ) B=15.25mm (0.6 ) C=10.1mm C=12.6mm C=17.7mm P XXD P XXD P XXD P XXD P XXD P XXD P XXD P XXD P XXD P XXD P XXD P XXD P XXD P XXD P XXD P XXD P XXD P XXD P XXD P XXD P XXD P XXD P XXD P XXD 134

CONVERSION SOCKETS Features Easy to stack Avaiabe to specific design Pease specify dimensions A, B, C, D Lead spacing 2.54 mm IC can be Pug-in or Sodered Gass epoxy insuators Converts 1.

80 1.6 0.80 A 3.20 B PLUGIN VERSION (INVERSION SOCKET) 1.32 PTH HOLE 0.10 2.10 A B 2.90 B A 2.

11 CONVERSION SOCKETS Features Easy to stack Avaiabe to specific design Pease specify dimensions A, B, C, D Lead spacing 2.54 mm IC can be Pug-in or Sodered Gass epoxy insuators Converts 1. Lower row spacing DIL IC / s to higher row PC board. 2. Higher row spacing DIL IC / s to ower row PC board. Fig - 1 Fig - 2 MACHINED CONTACT CONNECTORS B A 1.32 PTH HOLE A 3.20 B PLUGIN VERSION (INVERSION SOCKET) 1.32 PTH HOLE A B 2.90 B A 2.90 SOLDER VERSION ORDERING INFORMATION P805 X XX X X X Conversion Row Number of Type of Pins Pating Socket Conversion Contacts Inner Cip Outer Seeve Series From B to A & A to B P " to 0.6" = A 04 H 0 = Fat Pin 1 = 0.25 µ Au 5 µ Sn H = Soder Fig 2 0.4" to 0.6" = B to (No mating) 2 = 0.75 µ Au 5 µ Sn Version 0.3" to 0.9" = C 64 1 = Soder Pin 3 = 5 µ Sn 5 µ Sn I = Pug-in 3.2 mm Tai 4 = 0.75 µ Au 0.25 µ Au Version 0.6" to 0.3" = D H - For 0 type of pin Fig 1 0.6" to 0.4" = E 1 = 5 µ Sn 0.9" to 0.3" = F 4 = 0.25 µ Au 0.3" to 0.3" = G SOJ to SOWIC Adaptor P805K-20-54S (TYP) 10PADS AT PITCHP0.65mm (TYP) x%%c0.82 PITCH(TYP)

PROTECTRON DUAL IN - LINE SOCKETS METAL CARRIER Specification Same as IC Sockets Materia & Finish Body : Brass Outer Seeve : Brass, Tin-Lead Pated Inner Cip : Beryium Copper, God-Pated Features

78mm Higher packaging density No fux intrusion after sodering ORDERING INFORMATION P805 X M XX X X IC Socket Row Pitch Number of Type of Pins Pating Series Spacing Contacts Inner Cip Outer Seeve P805

12 PROTECTRON DUAL IN - LINE SOCKETS METAL CARRIER Specification Same as IC Sockets Materia & Finish Body : Brass Outer Seeve : Brass, Tin-Lead Pated Inner Cip : Beryium Copper, God-Pated Features Exceent air-cooing of IC's Very ow profie. Board can be dried so that the contacts can be Inserted down to the shouder eaving max. profie above board of 0.78mm Higher packaging density No fux intrusion after sodering ORDERING INFORMATION P805 X M XX X X IC Socket Row Pitch Number of Type of Pins Pating Series Spacing Contacts Inner Cip Outer Seeve P805 3 = 0.3" Pitch Meta 01 to 64 1 = PC pin 3.2mm 1 = 0.25 µ Au 5 µ Sn 6 = 0.6" Pitch carrier 2 = PC pin 4.2mm 3 = 5 µ Sn 5 µ Sn 9 = 0.9" Pitch D= Mini Spring Skt, L- 4.25mm, =3.45mm E= Mini Spring Skt, L- 6.3mm, =5.5mm Q = Soder pin w/o tai (L-4.2mm) B: 7.62mm (0.3") B: mm (0.6") B: mm (0.9")m P XX P XX P XX P XX P XX P XX P XX P XX P XX P XX Note: For further detais, check with factory x No. OF POSITIONS B B: Pitch Row to Row MINI SPRING SOCKETS P8040 Series Specification Same as IC Sockets Materia & Finish Outer Seeve : Brass, Tin-Lead Pated Inner Cip : Beryium Copper, God Pated Features! Accepts mating pins of size Æ0.50±0.05mm! Sockets are soder mount types! Avaiabe in two engths! Mounting Hoe Dia is Æ1.35+0/-0.02mm BODY CONTACT CLIP TO ACCEPT A PROBE OF ø0.50 Finish Part Number = 3.45mm = 5.50mm Tin Pated P P L '' 0.80 ø

13 TECHNICAL SPECIFICATIONS FOR PGA SOCKETS Connector Parts Materias & Finishes Insuator Body Outer Seeve Inner Cip Pins (Without Inner Cip) Gass fied thermopastic poyester, sef extinguishing, rated UL94 V-0 or Gass Epoxy Laminate Screw machined brass, god or Tin pated Beryium - Copper, heat - treated, god or Tin pated Screw machined brass pated 0.25 microns god or 5 microns tin - ead over nicke pate MACHINED CONTACT CONNECTORS Mechanica Properties Mechanica ife : 50 Cyces (min) Insertion force : Average insertion force with stee dia 0.41 = < 1 N (0.1 Kg) Extraction force : Average withdrawa force with stee pin dia 0.41 = > 0.15 N (0.015 Kg) Type of Cip 6 Finger stamped contact Minimum insertion depth : 2.6 mm Maximum insertion depth : 3.6 mm Eectrica Properties Rated current : 1 A Rated votage : 100 V AC Votage proof : 600 V AC Contact resistance : 20 m ohms Insuation resistance : ³5000 M 500 V DC Environmenta Properties Operating temperature range : 65 C, +125 C Resistance to sodering heat : +260 C, 10 seconds Environment category : 65 / 125 /

PROTECTRON PIN GRID ARRAY SOCKETS SERIES PGA Dimension with n1 = and n2 = The dimensions can be cacuated : For mouded poyester bodies number of contacts in one ine (5 n1³21) characteristic size of

14 PROTECTRON PIN GRID ARRAY SOCKETS SERIES PGA Dimension with n1 = and n2 = The dimensions can be cacuated : For mouded poyester bodies number of contacts in one ine (5 n1³21) characteristic size of the window (3 n2³10) For machined gass-epoxy bodies A = n1 x 2.54 A = n1 x B = (n1-1) x 2.54 B = (n1-1) x 2.54 C = (n2 x 2.54) C = (n2 x 2.54) Insuator thickness For mouded For machined poyester bodies gass - epoxy bodies mm 1.6 ± 0.1 mm 2.54 R 1.2 C B A Features High density connecting devices for PGA Chips. Low contact insertion and withdrawa forces. Avaiabe in various pin grid sizes, pin counts & staggered versions. Any combination of pin grid & contact oading can be suppied. Insuator of gass fied thermopastic or fibergass epoxy avaiabe. With or without window. MAX 0.3 ORDERING INFORMATION PX XX XXX X X X PGA Socket Grid Size Number of Size of Tai Type Pating Series Spacing Contacts window Inner Cip Outer Seeve A - Grid Array SKT 05 = 5x5 025 A = No Window A = Soder Pin 3 mm Tai, 1 = 0.25 µ Au 5 µ Sn Poyester Insuator 06 = 6x6 to B accepts Ø0.7 - Ø0.8 mm 2 = 0.75 µ Au 5 µ Sn 07 = 7x7 999 C B = Interconnect Pin L=15.2 mm 3 = 5 µ Sn 5 µ Sn H - Grid Array SKT 08 = 8x8 D C = Interconnect Pin L=18.8 mm 4 = 0.75 µ Au 0.25 µ Au Gass Epoxy Insuator 09 = 9x9 E For D = PGA Soder Pin 3.20mm Tai 10 = 10x10 F Window E = PGA Soder Pin 4.2 mm Tai F - Grid Array SKT 11 = 11x11 G Sizes F = 3 eve PGA w/w H Staggered contacts 12 = 12x12 H refer G = Soder Pin 3.9 mm Tai Gass Epoxy Insuator 13 = 13x13 I sheets 5 = Adaptor Pin H* H* - For type 5 pin 14 = 14x14 J 1 = 5 µ Sn G - Grid Array SKT 15 = 15x15 K 4 = 0.25 µ Au Zig Zag type 16 = 16x16 L 1.6 mm thickness 17 = 17x17 M H - Not avaiabe on High Density staggered 18 = 18x18 PGA Socket version 19 = 19x19 20 = 20x20 21 = 21x21 138

15 PIN GRID ARRAY SOCKETS STANDARD FOOT PRINTS SERIES PGA 5 x 5 25 Pins 6 x 6 36 Pins 7 x 7 49 Pins 8 x 8 44 Pins MACHINED CONTACT CONNECTORS PX AXX PX AXX PX AXX PX BXX 8 x 8 64 Pins 9 x 9 32 Pins 9 x 9 56 Pins 9 x 9 72 Pins PX AXX PX CXX PX CXX PX AXX 9 x 9 81 Pins 10 x Pins 10 x Pins 10 x Pins PX AXX PX DXX PX DXX PX OXX 10 x Pins 10 x Pins 10 x Pins 10 x Pins PX AXX PX BXX PX AXX PX BXX 139

16 PROTECTRON PIN GRID ARRAY SOCKETS STANDARD FOOT PRINTS SERIES PGA 10 x Pins 11 x Pins 11 x Pins 11 x Pins PX AXX PX EXX PX AXX PX EXX 11 x Pins 11 x Pins 11 x Pins 11 x Pins PX EXX PX CXX PX EXX PX AXX 11 x Pins 11 x Pins 11 x Pins 11 x Pins PX CXX PX EXX PX DXX PX CXX 11 x Pins 11 x Pins 11 x Pins 11 x Pins PX CXX PX AXX PX CXX PX CXX 140

17 PIN GRID ARRAY SOCKETS STANDARD FOOT PRINTS SERIES PGA 11 x Pins 11 x Pins 11 x Pins 11 x Pins MACHINED CONTACT CONNECTORS PX CXX PX CXX PX AXX PX AXX 12 x Pins 12 x Pins 12 x Pins 12 x Pins PX FXX PX DXX PX DXX PX DXX 12 x Pins 12 x Pins 12 x Pins 12 x Pins PX DXX PX DXX PX CXX PX AXX 13 x Pins 13 x Pins 13 x Pins 13 x Pins PX GXX PX GXX PX AXX PX GXX 141

18 PROTECTRON PIN GRID ARRAY SOCKETS STANDARD FOOT PRINTS SERIES PGA 13 x Pins 13 x Pins 13 x Pins 13 x Pins PX EXX PX GXX PX GXX PX EXX 13 x Pins 13 x Pins 13 x Pins 13 x Pins PX EXX PX EXX PX - 13A EXX PX EXX 13 x Pins 13 x Pins 13 x Pins 13 x Pins PX AXX PX EXX PX - 13A EXX PX AXX 13 x Pins 13 x Pins 13 x Pins 13 x Pins PX EXX PX AXX PX CXX PX CXX 142

19 PIN GRID ARRAY SOCKETS STANDARD FOOT PRINTS SERIES PGA 13 x Pins 13 x Pins 13 x Pins 13 x Pins MACHINED CONTACT CONNECTORS PX CXX PX CXX PX AXX PX CXX 13 x Pins 13 x Pins 13 x Pins 14 x Pins PX AXX PX CXX PX AXX PX IXX 14 x Pins 14 x Pins 14 x Pins 14 x Pins PX FXX PX FXX PX FXX PX AXX 14 x Pins 14 x Pins 14 x Pins 14 x Pins PX FXX PX DXX PX DXX PX DXX 143

20 PROTECTRON PIN GRID ARRAY SOCKETS STANDARD FOOT PRINTS SERIES PGA 14 x Pins 14 x Pins 14 x Pins 15 x Pins PX BXX PX BXX PX AXX PX IXX 15 x Pins 15 x Pins 15 x Pins 15 x Pins PX GXX PX AXX PX GXX PX AXX 15 x Pins 15 x Pins 15 x Pins 15 x Pins PX - 15A EXX PX AXX PX EXX PX EXX 15 x Pins 15 x Pins 15 x Pins 15 x Pins PX EXX PX EXX PX EXX PX CXX 144

21 PIN GRID ARRAY SOCKETS STANDARD FOOT PRINTS 15 x Pins 15 x Pins 15 x Pins SERIES PGA 15 x Pins MACHINED CONTACT CONNECTORS PX CXX PX CXX PX AXX PX AXX 16 x Pins 16 x Pins 16 x Pins 17 x Pins PX AXX PX AXX PX AXX PX IXX 17 x Pins 17 x Pins 17 x Pins 17 x Pins PX IXX PX GXX PX EXX PX AXX 18 x Pins 18 x Pins 18 x Pins 19 x Pins PX HXX PX FXX PX AXX PX GXX 145

22 PROTECTRON PIN GRID ARRAY SOCKETS STANDARD FOOT PRINTS SERIES PGA 19 x Pins 19 x Pins 20 x Pins PX GXX PX AXX PX AXX PIN GRID ARRAY SOCKETS CUSTOM GRID DESIGN If the desired footprint does not exist in this cataogue, pease photocopy the page, compete it and send it to PROTECTRON A B C D E F G H J K L M N O P Q R S T U V W X Y Z 1. Type of PGA 2. Type of Pin YOUR ADDRESS ORDERING INFORMATION TOP VIEW A B C D E F G H J K L M N O P R S T U V W X Pating 4. Size of body Exampe : Fi in the Position of pins Mark of the window x Insuator 146

23 TECHNICAL SPECIFICATIONS FOR PLCC SOCKETS Connector Parts Materias & Finishes Insuator Body Poyphenyedene Suphide (PPS) Contact Copper aoy, tin pated over nicke. Mechanica Properties Soder Tai Version SMD Version Mechanica ife 50 cyces min. 25 cyces min. Contact Pressure 1.5 N min. per contact 1.2 N min. per contact MACHINED CONTACT CONNECTORS Eectrica Properties Soder Tai Version SMD Version Rated Current 2A 1A Contact resistance 20 m W max. 20 m W max Insuation resistance 5000 M W min M W min. Dieectric strength 600 VRMS min. 600 VRMS min. Capacitance 2 Pf max. 2 Pf max. Environmenta Properties Operating temperature range : -55 / +125 c Vibration (No eectrica discontinuity > 1 micro sec) : 10 to 2000 Hz, 15g. 147

SGM Series. Size 22 Contacts. Qualified to MIL-DTL IEC Publication HIGH DENSITY RECTANGULAR CONNECTORS with FIXED CONTACTS

SGM Series. Size 22 Contacts. Qualified to MIL-DTL IEC Publication HIGH DENSITY RECTANGULAR CONNECTORS with FIXED CONTACTS Size 22 Contacts Qualified to MI-DT-28748 IEC Publication 807-1 Telecommunication U.. File #E140980 MIITARY SPECIFICATIONS: Qualified to MI-DT-28748/7 and MI- DT-28748/8. INTERNATIONA STANDARDS: IEC 807-1