Semicon West San Francisco, CA July 12, 2016 Dr. John Muth

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1 Semicon West San Francisco, CA July 12, 2016 Dr. John Muth 1

2 National Network for Manufacturing Innovation Flexible Electronics Digital Manufacturing and Design Innovation Lightweight and Modern Metals Manufacturing Innovation National Additive Manufacturing Innovation Photonics Smart Manufacturing Advanced Composites Fiber Textile PowerAmerica: Next Generation Power Electronics Manufacturing DOD DOE Future

3 VISION Dramatically accelerate commercialization of wide bandgap power electronics to power America. Developing advanced manufacturing processes to enable cost-competitive, large-scale production of wide bandgap semiconductor-based power electronics, which allow electronic systems to be smaller, faster and more efficient than power electronics made from silicon. 3

4 Mission Summary Wide Adoption of WBG Technology Brings Significant Energy Savings

5 Fundamental Principles Cost of devices will be tied to Volume. People have to believe WBG Power electronics are reliable. (Packaging!) System Level Value: Size, Weight, Power, Higher Frequency and Efficiency. PowerAmerica Foundry approach is having an impact for SiC. GaN is increasingly finding applications at lower voltages. Innovation in packaging, technical demonstrations and system level design are important for system success! Reliability needs to be a community effort. Standards!

6 Device Design Houses Reliability and Packaging Fabs Wafer Suppliers Wafer Fabs WBG Mission Ecosystem Summary Spans Numerous Industries Market Demand Feedback Accelerating WBG adoption requires a clear understanding of industry interplay OEMs 6

7 Technology Readiness Levels and Manufacturing Readiness Levels Source: NNMI prelim design report. 7

8 Replacing Mission Si-based Summary Power Devices with WBG Increases Power Density and Relaxes Cooling Requirements Volume Weight 85% volume reduction 85% mass reduction Commercial Inverter Si IGBT Based (5kW) IGBT SiC Temperature +125 C capable IGBT SiC Efficiency 25% power loss reduction Courtesy of Dr. T. McNutt, CREE APEI, Inc. XT-1000 SiC Inverter SiC Based (5kW) Shown to scale IGBT SiC IGBT SiC Operate w/ Higher Efficiency: translates to fuel savings + less waste-heat to manage Operate at Higher Temperature: smaller cooling system + limp-home margin Operate at Higher Frequency: reduce the size of passive circuit components

9 Wafer Mission Cost Reduced Summary with Volume $5,000 2 inch Wafer $1,500 4 inch Wafer $750 4 inch Wafer Manufacturing volume lowers wafer costs. Larger area wafer lowers device cost. 9

10 Manufacturing Mission Volume Summary is Critical to Cost Reduction Wolfspeed (CREE) is a manufacturer of SiC wafers and power devices 10

11 Foundry Mission Model Acelerates Summary Industry Learning A.J. Nadler CS International March

12 Ultilize 6 and 8 Silicon Foundries Leverage Existing investment In Capital Equipment. Leverage an existing highly trained workforce Benefit from existing experience in building qualified products Increase yield from better implementation of quality control. 12

13 Reducing Cost of Wide Band Gap Power Devices FABLESS Model! Anant Agarwal 13

14 A first Year Manufacturing Achievement X-Fab Announces First 6-inch SiC foundry offering 5 PowerAmerica Members used X-Fab X-Fab in discussions with several other partners USCI: SIC Diodes, MOSFETS Genesic: Diodes Monolith: Diodes, MOSFETS ABB 3.3kV MOSFETS Jay Baliga, Integrated Diode Future: JFETS, SJTs etc. Members anticipating commercialization of some of the above products in 2017 using X-fab. 14

15 A First Year Manufacturing Achievement CREE Buys APEI - New Company Wolfspeed will IPO Vertical Integration offers increased capability, Increased US competitiveness. 3.3 kv and 10 kv devices being qualified Wolfspeed modules released. Last March Last May This May CAS325M12HM2 Wolfspeed Sets a New Standard for Power Electronics with All-SiC High Performance Half-Bridge Power Module & Gate Driver Combination The first commercial product developed and manufactured by Wolfspeed s Fayetteville operation redefines high current power density, efficiency, and performance. 15

16 Don t Underestimate the value of WBG Optimized High Voltage Modules Essential Enablers Low Inductance for high frequency switching Heat removal, to allow high temperature operation Standardization of footprints New topologies for simpler circuits better reliability Demonstrations of Reliability to inspire confidence Challenges Packaging materials for high voltages Sinterable contacts for double side cooling Better wire bonding strategies Cost! Advantage of Low Voltage Modules Similar advantages but less clear, because of module vs discrete cost tradeoffs in system design. Automated manufacturing is key. 16

17 First Year Academic Achievements Demonstrations of Volume Reduction and Efficiency Increase Enabled by use of SiC Modules Husain/Hopkins 55kW inverter for EV 3X denser than Toyota Prius 12.1 kw/l close to 13.4 kw/l DOE 2020 Goal Lukic MV Fast Charger 10 x size reduction; 4x weight reduction Cheaper Installation Simpler Topology Better Cooling, Faster Switching Higher Efficiency Li - Gen-1 50 kw Silicon Carbide Based Transformerless Photovoltic Converter 98% Efficiency, 8 W/in3 Takes Advantage of Novel Topology 17

18 First Year Manufacturing Achievement John Deere- Project acceleration achieved. Proceeding to vehicle deployment of 200 kw 1050 V inverter in BP2 ahead of schedule. Commercialization in Toshiba Project acceleration achieved. Proceeding to design/build of 50 kw PV inverter product for product release in Navitas Demonstrating a 25W wired fast charger (>93% efficiency, >10W/in3) at a lower $/W than existing siliconbased systems, representing a nearly 70% increase over existing best-in-class 15W chargers in their same footprint

19 First Year Manufacturing Achievements Agile Switch- Released WBG Product Fast funding allowed project to be completed for APEC. Gave Agile Switch a first to market advantage. ~100 organizations following-up to evaluate system 19

20 Data Centers: 1% to 2% of World Energy Area of Rapid Innovation Today 1 to 2% of Energy Consumption and Increasing. Improving Data Center efficiency by 1% equivalent to three 1 GW Power Plants. Potential of Gallium Nitride to enable high voltage to come directly to the board save transmission losses, eliminate separate power supply. Reduce AC-DC conversion steps and associated losses. Less heat and more efficient heat transfer with low profile components. 20

21 Efficiency Policy Initiatives will require new technologies 100% 95% Potentially Wide Band Gap for higher efficiency? % % % 0% 25% 50% 75% 100% Load

22 Impact of High Freq. on Capacitors and Magnetics EMI Filter MHz PFC MHz LLC DCX 60% expected volume reduction 700W/in 3 projected (without cap ) 700W/in 3 Work performed by Dr. Fred Lee, Virgina Tech. 22

23 More Highly Automated Manufacturing Courtesy of Virgina Tech, Fred Lee 23

24 A Strong Workforce and Education Program Academia Government Industry Pipeline to MS and PhD WBG MS Concentration Web Portal Distance Education Train the Trainer Community College Short Courses K-12 DOE/DOD National Labs Internships NIST Manufacturing Extension Partnerships NSF Advanced Technology Education Internships Scholarships Sponsor Capstone Projects Contribute to Short Courses, STEM Outreach Jobs Professional Development Executive Workshops 24

25 Education and Workforce Partners K12 Community College PowerAmerica Industry Membership University Executive Workshops Industrial Workforce 25

26 New PowerAmerica Initiatives Device Bank: Goal is to make HV devices and Modules accessible for non-commercial research and development purposes to increase innovation and stimulate new demonstrations and new products. PowerAmerica Process for SiC Goal is to make a SiC foundry process that has low IP barriers to enable more companies to experiment with SiC foundry. Increased Partnerships for SiC and GaN reliability studies Goal is to increase Industry confidence is adoption WBG devices and modules for power electronics. Open Project Call in September

27 Special Thanks to: Anant Agarwal, DOE Pawel Gradzki, ARPA-E Laura Marlino, Oak Ridge National Labs Mark Shuart, Facilities, AMO Valri Lightner, Facilities, AMO Rob Ivester, Deputy Director, AMO Mark Johnson, Director Advanced Manufacturing Office

28 Q & A 28