PM 300 APOLLO wet-out

Transcription

1 PM 300 APOLLO wet-out Advanced CMP System for 300 mm wet-out Wafer Planarization

2 PM 300 APOLLO wet-out, advanced CMP System for 300 mm wet-out Wafer Planarization Peter Wolters is developing, producing and marketing CMP systems for wafers up to 300 mm. The PM 300 Apollo is a turn-key solution from one supplier, including the necessary process know how. Its cluster design already integrates the wafer handling and, depending on the system configuration, cleaning units. The PM 300 is one of the first CMP systems on the market dedicated to 300 mm wafer processing. Since 1998 it planarizes 300 mm production wafers with outstanding reliability. The experience of these installations is the basis for ongoing and further tool and process development. Its state-of-the-art concept enables the PM 300 to automatically optimize process performance. The system can be used for various applications, e.g. is installed at chipmakers for the planarization of structured wafers as well as at prime wafer manufacturers and wafer reclaiming companies. The unique solid design of the PM 300, based on a rigid cast iron frame, delivers the precondition for high tool reliability, high removal rates and best reproducible polishing results. This property is completed by the patented Peter Wolters Temperature Control System which provides accurate controlled temperature conditions for the polishing process. For users, who already have a standard cleaning system and want to use that for post-cmp cleaning, Peter Wolters has developed a dry in/wet out CMP system for 300 mm wafers. This PM 300 Wet Out directly handles the polished wafers into wet buffer cassettes to be stored wet before transfer to a separate wet bench for final cleaning and drying. The advantages are obvious: no redundant cleaner in the CMP system, saving foot print and costs. use of the existing cleaning equipment and technology. The advanced design of the PM 300 Apollo enables the tool to run up to three subsequent and independent process steps. By using the two independently controlled carriers, one- or multi-step applications can be optimized to meet high-throughput demands. Different advanced carrier designs are available to produce application optimized consistent wafer uniformity results and the best process performance, e.g. by the use of multizone control and edge influence. To achieve capabilities for future processes and noticeable cost-effective advantages during the polishing process, the PM 300 can be equipped with End Point Detection units, e.g. depending on the application based on motor current measurement or multi wavelength optical detection. Automated processing is supported by optional closed loop control and in-line wafer rework as well as by leading CIM technology. A self-explaining, graphical user interface and the possibility of remote control and maintenance are a matter of course.

3 PM 300 APOLLO wet-out Advanced CMP System Dry robot Wet robot Dry-in wet-out system: Handling area Wet-out station with water slide Interior of dry-in stations incl. cassettes

4 Easy-to-learn software concept with high flexibility

5 Main polishing table with polishing head and conditioning tool Secondary polishing table for final polishing or DI-water buff Wafer I/O station

6 PM 300 APOLLO wet-out Features and Benefits for the Customer Features Benefit for the customer Features Benefit for the customer Various applications Four table Polisher Planarization of structured wafers Can be adapted to the specific application of the customer Two independent linearly moving polishing heads High throughput Polishing of prime wafers For 300 mm wafers, convertible to 200 mm wafers Sophisticated system Four independent polishing tables Two in-situ / ex-situ pad conditioners Multi-step processing For longer pad life, better uniformity and higher removal rates Turn-key solution Dry-in wet-out Automated wafer handling Advanced design Hardware, software and process know-how from one supplier For customers, who use standard cleaning wet benches High reliability, reproducible process results Temperature control system Flat panel touch-screen display Advanced polishing head design with multi zone control and edge influence Provides controlled temperature for slurry, polishing tables and DI-water Cleanroom adapted ergonomic operator interface Consistent wafer uniformity results and process performance Small tool width Wafer handling concept for minimized mechanical stress Easy maintenance Maximizes yield Rigid cast iron frame Wet-out station High precision and reliability, reproducibility, best uniformity Fast polishing table for high speed polishing Separate recipes for each single wafer Makes linear CMP obsolete Enables efficient process development, high flexibility Two wet-out stations to store 2 water cassettes in a liquid after polishing Options Protects polished wafers from drying and contamination Remote control Operation access from outside the cleanroom Down-gradable from 300 mm to 200 mm Upgrade and process transition between wafer sizes Remote maintenance Software upgrade and tool diagnostics via modem Automated wafer and cassette tracking systems 100% control of each single wafer process history Self-explaining, graphical user interface High operator acceptance Mini-environment with airflow-optimised filter-fan units Reduces CoO SECSII / GEM Interface For standard fab integration and computer integrated manufacturing (CIM) Process know-how Solutions for various oxide and metal processes Turn-key solutions High removal rates and good uniformity results High throughput, maximizes yield

7 Technical Data PM 300 APOLLO wet-out Polishing head Pad conditioner Wafer diameter 300 mm (200 mm) Down force N Rotating speed rpm Disc diameter 120 mm Backside pressure kpa Rotating speed 0-80 rpm Polishing downforce Main polishing tables Diameter Rotating speed Temperature control Secondary polishing tables Diameter N 900 mm rpm C 430 mm Option: High pressure conditioning System Weight total system Length x width x height Floor Space Interface bar kg 5765 x 2050 x 2200 mm 10,1 sqm SECS II / GEM, CIM Rotating speed rpm Temperature control C wet-out station Secondary polishing tables Spindle 2 Polishing head 2 Main polishing table 1 Pad conditioners Main polishing table 2 Load ports for FOUP cassettes Polishing head 1 Spindle 1 Touch-screen monitor Dry wafer robot Wet wafer robot Input-output stations Polishing head / wafer cleaner Touch-screen monitor

8 Peter Wolters worldwide Rendsburg Niederlassung Süd Leinfelden-Echterdingen Peter Wolters of America Inc. Plainville, Massachusetts Peter Wolters of America Inc. Chicago, Illinois Peter Wolters Japan Co., Ltd. Osaka Peter Wolters of America Inc. Service Center West Peter Wolters China Shanghai Peter Wolters U.K. Ltd. Birmingham Peter Wolters France Paris Peter Wolters Subsidiaries Novellus Subsidiaries Headquarters Rendsburg Büsumer Straße 96 D Rendsburg Phone: (++49)4331/ Fax: (++49)4331/ wolters@peter-wolters.com Niederlassung Süd Benzstraße 17 D Leinfelden-Echterdingen Phone: (++49)711/ Fax: (++49)711/ pwl_sales@peter-wolters.com Peter Wolters U.K. Ltd. Brindley Road Dodwells Bridge Ind. Estate, Hinckley, Leicestershire LE 10 3BY, England Phone: (++44) Fax: (++44) pwuk_sales@peter-wolters.com Peter Wolters France Philippe Lucas 38, Rue du Belvédère F Mareil Marly Phone: (++33) Fax: (++33) pwfr@peter-wolters.com Peter Wolters Machine Tools Ltd. Shanghai Representative Office Rm. 10B North Gate Plaza No. 99 Tianmu Xi Lu Shanghai / P. R. China Phone: (++86) (3976) Fax: (++86) sales-china@peter-wolters.com Peter Wolters Japan Co., Ltd. Daisho Bldg., 6 th floor, Rm , Esaka-cho 1-chome Suita-shi, Osaka , Japan Phone: (++81) Fax: (++81) pwj_sales@peter-wolters.com Peter Wolters of America Inc. 509 N. Third Avenue USA - Des Plaines (Chicago) IL Phone: (++1)847/ 803/ Fax: (++1)847/ 803/ pwa_sales@peter-wolters.com Peter Wolters of America Inc. P.O. Box 1585 / 14 High Street USA - Plainville Massachusetts Phone: (++1)508/ 695/ Fax: (++1)508/ 695/ pwa_sales@peter-wolters.com version 003_3/2006 This information is supplied without liability, subject to alterations