Efficiency in practice, learning from projects EMPORA and e-connected. Herbert Pairitsch, Infineon Technologies Austria AG

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1 Efficiency in practice, learning from projects EMPORA and e-connected Herbert Pairitsch, Infineon Technologies Austria AG Wien,

3 Inhalt 1 Motivation 2 Infineon 3 Charging Infrastructure Summary 3

New Era: Driving Demand for Power Semiconductors '90 '10 '10 '30 Changes Courtesy: BMW Group Electrification in cars with Internal Combustion Engine as well as the trend towards e-mobility drives the

4 New Era: Driving Demand for Power Semiconductors '90 '10 '10 '30 Changes Courtesy: BMW Group Electrification in cars with Internal Combustion Engine as well as the trend towards e-mobility drives the demand for power semiconductors. Shift towards renewable energies requires significantly more high-power semiconductors per MW of power generated. Higher efficiency in power conversion reduces CO 2 emission and total cost of ownership. Courtesy: Facebook Stronger demand for goods containing power semiconductors due to increasing standard of living in BRIC countries. 4

5 Efficient use of electricity plays a central role in reducing global CO 2 emissions Source: IEA, World Energy Outlook 2010, page DRAFT - 5

6 Inhalt 1 Motivation 2 Infineon 3 Charging Infrastructure Summary 6

Infineon at a glance Business Segments Automotive 17% (ATV) 31% 41% 11% Revenue FY 2016 Industrial Power Control

17,432 employees Financials Market Position [EUR m] 3,843 4,320 5,795 6,473 Automotive Power Smart card ICs 15.

7 Infineon at a glance Business Segments Automotive 17% (ATV) 31% 41% 11% Revenue FY 2016 Industrial Power Control (IPC) Power Management & Multimarket (PMM) Chip Card & Security (CCS) Employees More than 36,000 employees worldwide (as of Sep. 2016) Americas 3,691 employees 34 R&D locations 19 manufacturing locations Europe 15,176 employees Asia/Pacific 17,432 employees Financials Market Position [EUR m] 3,843 4,320 5,795 6,473 Automotive Power Smart card ICs 15.2% 14.4% 15.5% 9.8% FY 13 FY 14 FY 15 FY 16 # 2 # 1 # 1 Revenue Segment Result Margin Strategy Analytics, April 2017 IHS Markit, Technology Group, October 2016 IHS Markit, Technology Group, July

8 Top positions in all major product categories Automotive semiconductors total market in CY 2016: $30.2bn Power semiconductors total market in CY 2015: $14.8bn Smart card ICs total market in CY 2016: $2.79bn NXP Infineon 14.0% 10.7% Infineon ON + FCS 10.3% 18.7% Infineon 24.8% Renesas 9.8% Mitsubishi 6.3% NXP 24.2% TI 7.8% STMicro 5.7% STMicro 7.4% Vishay 5.0% Samsung 16.2% Bosch 5.3% Toshiba 4.7% On Semi 4.5% Fuji 4.1% STMicro 10.5% Toshiba Rohm 2.9% 2.5% Renesas Semikron 4.1% 2.9% CEC Huada 9.3% Micron 2.0% NXP 2.4% Automotive semiconductors incl. semiconductor sensors Source: Strategy Analytics, 2016 Automotive Semiconductor Vendor Share, April 2017 Discrete power semiconductors and power modules Source: IHS Markit, Technology Group, Power Semiconductor Annual Market Share Report, October 2016 Microcontroller-based smart card ICs Source: IHS Markit, Technology Group, Smart Cards Semiconductors Report, July

Corporate Social Responsibility We create a net ecologic benefit Emission Reduction enabled by our products and solutions around 1.8 million tons CO 2 equivalents around 52.

transportation, function cars, flights, materials, chemicals, water/wastewater, direct emissions, energy consumption, waste, etc.

9 Corporate Social Responsibility We create a net ecologic benefit Emission Reduction enabled by our products and solutions around 1.8 million tons CO 2 equivalents around 52.4 million tons CO 2 equivalents CO 2 burden 1) Ratio around 1:30 CO 2 savings 2) Net ecological benefit: CO 2 emissions reduction around 50 million tons 1) This figure considers manufacturing, transportation, function cars, flights, materials, chemicals, water/wastewater, direct emissions, energy consumption, waste, etc. and is based on internally collected data and externally available conversion factors. All data relate to the 2016 fiscal year. 2) This figure is based on internally established criteria, which are explained in the explanatory notes. The figure relates to the calendar year 2015 and considers the following fields of application: automotive, LED, PC power supply, renewable energy (wind, photovoltaic), drives as well as induction cookers. CO₂ savings are calculated on the basis of potential savings of technologies in which semiconductors are used. The CO 2 savings are allocated on the basis of Infineon market share, semiconductor content and lifetime of technologies concerned, based on internal and external experts' estimations. Despite the fact that CO₂ footprint calculations are subject to imprecision due to the complex issues involved, the results are nevertheless clear. 9

10 Inhalt 1 Motivation 2 Infineon 3 Charging Infrastructure Summary 10

11 Results of e-connected 2009 Energy Efficiency: EUR 1744m Communications: EUR 917m Security: EUR 341m 11

12 e-connected II 2010 Energy Efficiency: EUR 1744m Communications: EUR 917m Security: EUR 341m 16.M ärz.2 Pa

13 Need for different kinds of charging equipment Quelle: C. Bleijs, EDF 13

14 Additional need for electric energy Quelle: C. Bleijs, EDF 14

Norming and Standardisation is mandatory Copyright Infineon

16 Example: Charging Plug Energy Efficiency: EUR 1744m Communications: EUR 917m Security: EUR 341m 16.M ärz.2 Quelle: P. Van den Bossche, Vrije Universiteit Brussel Pa

17 Sites for charging 2010 (US) Communications: EUR 917m Security: EUR 341m 16.M ärz.2 Quelle: Quelle: B. McBeth, Daimler Pa

18 Die Projektpartner empor Das Projekt empora ist eine Initiative der Plattform Austrian Mobile Power Das Konsortium vereint österreichische Leitbetriebe Austrian Mobile Power Management GmbH Verbund, Wien Energie, Salzburg AG, EVN Magna Steyr, Magna Electronics, AVL List, AVL Ditest, Infineon Siemens AG Österreich, HEI Raiffeisen Leasing, Mobility House, REWE AIT / Arsenal

19 Kurzdarstellung Arbeitspaket AP 2.4 empor Konzept, Weiterentwicklung und Umsetzung eines unidirektionalen On-board Chargers mit größtmöglicher Leistung auf kleinstem Raum. D2 D5..6 Um dieses Ziel zu erreichen, wird angestrebt beim On-board Charger ohne aktive 400 Kühlung auszukommen. Im Rahmen dieses Arbeitspaketes wird ein modulares VDC hocheffizientes System für den Leistungsbereich von 3,3 kw bis 10 kw entwickelt und die Erweiterungsmöglichkeiten in den Bereich von 20 kw bis 40 kw vorbereitet. Nach den bisherigen Vorarbeiten S1 wird es notwendig sein, eine eigene Fertigungstechnologie auf Basis der Hochvoltkompensationsschalter (CoolMOS ) zu entwerfen. Die Eigenschaften dieser Technologie D3..4 werden nicht nur nochmals deutlich reduzierter spezifischer Einschaltwiderstand D1 sein sondern auch in Hinblick auf die Zieltopologie optimiertes dynamisches Schaltverhalten VDC

20 State of the art: Three Phase Module (15KW/20kW) L1 L2 D 1 D 3 D 5 Q 1 Q 2 Q 7 Q 8 Q 9 Q 10 D 7 D 8 D 9 D V - 750V L3 Q 3 Q 4 Q 11 Q 12 D 11 D 12 D 2 D 4 D 6 Q 5 Q 6 Q 13 Q 14 D 13 D 14 Function PFC switch (Q 1 -Q 6 ) PFC diode (D 1 -D 6 ) dc dc switch (Q 7 -Q 14 ) dc-dc diode (D 7 -D 14 ) Low voltage dual driver High voltage driver Recommended Products until Now Three-phase Input Vienna PFC stage 600V CoolMOS C7 series, P6 series, H5 IGBT 1200V thinq! SiC G5 Software switching type full-bridge stage 650V CoolMOS CFD2, upcoming CFD7, P7 1200V thinq! SiC G5 Driver IC (PFC & LLC) 2EDN752XX / 2EDN852XX 1EDI60N12AF / 1EDI20N12AF 20

21 Off-board EV fast charger Topology Changing with SiC MOSFET Three-Phase Modified Vienna PFC (20KHZ-70KHZ) P Interleaved LLC DC/DC Converter (~60KHZ-150KHZ) AC Input a b c i u i v i w u v w S 1 S 4 S 2 S 5 S 3 S 6 E d E d O B a t t e r y N Fs=40KHZ~60KHZ AC Input Three-phase B6 Rectifier PFC 650V-840Vdc link Si to SiC H bridge LLC DC/DC Converter Fs=100KHZ~500KHZ 21 B a t t e r y

22 Inhalt 1 Motivation 2 Infineon 3 Charging Infrastructure Summary 22

23 Summary System approach is always necessary Fast Charging: higher efficiencies at lower system cost (Trend: 95% 97%) On Board Charger: even more price sensitive (Trend: 3,6 kw 7,2 kw) Public Charging: Selling a package (charging alone is no busines model) Copyright Infineon Technologies AG All rights reserved. 23

Berenberg Bank and Goldman Sachs German Corporate Conference Unterschleißheim, 18 September Dominik Asam Chief Financial Officer

Berenberg Bank and Goldman Sachs German Corporate Conference Unterschleißheim, 18 September 2017 Dominik Asam Chief Financial Officer Table of Contents 1 Infineon at a Glance 2 Manufacturing update 3 Growth