NTC Thermistor:TSM Series

Transcription

1 Features 1. RoHS & HF compliant 2. EIA size: 0201, 0402, 0603, Highly reliable structure 4. Operating temperature range: -40 ~ Wide resistance range 6. Cost effective 7. Agency recognition: UL/cUL/TUV Recommended Applications 1. Battery pack 2. Motherboard/ Notebook computer/ Personal computer 3. Liquid crystal display 4. Cellular phones 5. Bluetooth headset Part Number Code Product Type THINKING TSM NTC Thermistor TSM Series Size (EIA) A Definition of B Value A B 25/85 B B 25/50 Zero Power Resistance at 25 (R 25) x10 2 Ω= 1 KΩ x10 3 Ω=10 KΩ x10 3 Ω=47KΩ of R 25 F ±1% G ±2% H ±3% J ±5% K ±10% First Two Digits of B Value : : Last Two Digits of B Value 0 A 1 B 2 H 8 J 9 K of B Value 1 ±1% 2 ±2% 3 ±3% Packaging R Reel B Bulk Optional Suffix Z RoHS & HF Compliant Structure and Dimensions (Unit: mm) Part No. Size L1. W H max. L2 & L3 TSMA TSM TSM TSM ± ± ±0.20 THINKING ELECTRONIC INDUSTRIAL CO., LTD

2 Electrical Characteristics Zero Power Resistance at 25 C of R 25 THINKING ELECTRONIC INDUSTRIAL CO., LTD of B value Max. Power at 25 Factor Thermal Time Constant Operating Range Safety Approvals B Value Part No. UL/ TUV R 25(KΩ) ( ±%) (K) (±%) P max(mw) δ(mw/ C) τ(sec.) T cul L~T U( C) TSMAA682 34D* /85 TSMAA103 34D* Approx. Approx ~ +125 TSMAB * /50 TSMAB * TSM0A103 34D* TSM0A * TSM0A * TSM0A * TSM0A * / Approx. Approx. TSM0A * ~ TSM0A * TSM0A104 39H* TSM0A * TSM0A * TSM0B * / TSM1A * / TSM1A222 34D* TSM1B * / TSM1A472 34D* TSM1A * TSM1A502 34D* TSM1A682 34D* / TSM1A * TSM1A103 34D* TSM1A103 39H* TSM1B * 10 25/ TSM1A * TSM1A * Approx Approx TSM1A223 39H* ~ TSM1A333 39H* / TSM1A473 39H* TSM1A503 39H* TSM1A683 39H* TSM1A * TSM1B * / TSM1A * TSM1A * TSM1A * / TSM1A * TSM1A * TSM1A * TSM1B * / TSM2A * TSM2A472 34D* TSM2A502 34D* TSM2A682 34D* TSM2A103 34D* TSM2A * Approx Approx TSM2A103 39H* 10 25/ ~ TSM2A * TSM2A * TSM2A * TSM2A223 39H* TSM2A303 39H* TSM2A473 39H*

3 Electrical Characteristics Part No. Zero Power Resistance at 25 C of R 25 B Value of B value Max. Power at 25 Factor Thermal Time Constant Operating Range R 25(KΩ) ( ±%) (K) (±%) P max(mw) δ(mw/ C) τ(sec.) T L~T U( C) TSM2A503 39H* TSM2A683 39H* TSM2A * / TSM2A * TSM2A * Note 1: = of R 25 Note 2: * = of B value Note 3: UL&cUL File No. E TUV File No. R *Special specifications are available upon request Approx 2.4 Approx ~+125 Safety Approvals UL/ cul TUV Max. Power Derating Curve 100 T U :Maximum operating temperature ( ) T L :Minimum operating temperature ( ) For example: 0 Ambient temperature (Ta)=55 Maximum operating temperature (T U )=125 P Ta =(T U -Ta)/(T U -25) Pmax=70% Pmax T L 0 25 T U Ambient temperature ( ) THINKING ELECTRONIC INDUSTRIAL CO., LTD

4 R-T Characteristic Curves (representative) TSM0A * ~ TSM0A * TSM1A * ~ TSM1A * Resistance(KΩ) ( ) Resistance(KΩ) TSM0A * TSM0A * TSM0A104 39H* TSM0A ** TSM0A * TSM0A * TSM0A * TSM0A103 34D* TSM0A * TSM1A * ( ) TSM1A * TSM1A * TSM1A * TSM1A * TSM1A683 39H* TSM1A503 39H* TSM1A473 39H* TSM1A333 39H* TSM1A223 39H* TSM1A103 34D* TSM1A103 39H* TSM1A682 34D* TSM1A502 34D* TSM1A472 34D* TSM2A472 34D* ~ TSM2A * Resistance(KΩ) TSM2A * TSM2A * TSM2A * TSM2A683 39H* TSM2A503 39H* TSM2A473 39H* TSM2A223 39H* TSM2A103 34D* TSM2A103 39H* THINKING ELECTRONIC INDUSTRIAL CO., LTD ( )

5 Soldering Recommendation IR-reflow Soldering Profile Preheating 255~260 C Peak temp Cooling 217 C 60~150 sec 150~200 C 150±20 Tamb 3 C /sec (max.) 60~180 sec 3 C/sec (max.) 20~40 sec 6 C /sec (max.) t Time Reworking Conditions with Soldering Iron Item of Soldering Iron-tip Soldering Time Diameter of Soldering Iron-tip Conditions 360 (max.) 3 sec (max.) Φ3mm (max.) Recommended Soldering Pad Dimensions Y X 8 minutes max G Z Size Z (mm) G (mm) X (mm) Y (mm) THINKING ELECTRONIC INDUSTRIAL CO., LTD

6 Notice of Soldering and Mounting on PC Board (a)incorrect Nozzle for Chip Mounting (b)correct Nozzle for Chip Mounting Board Guide PC Board Supporting Pins For mounting SMDs on a PC board, supporting pin is suggested for use (refer to figure b) to avoid cracks caused by external stress(refer to figure a). (c)cracks SMDs are located near an easily warped area Stress at the separate line is possible to damage SMDs. If circuit bending is needed for PC board design, please refer to figure (c) for mounting positions to avoid cracks caused by stress imposed on the product. O means better, is acceptable, and X is worst. (d)component Orientation Incorrect Orientation Correct Orientation Locate SMDs horizontally to the direction that stress acts During circuit bending, please locate SMDs horizontally to the direction in which stress act to avoid its cracks (refer to figure d). THINKING ELECTRONIC INDUSTRIAL CO., LTD

7 Reliability Item Standard Test conditions / Methods Specifications Bending Strength IEC Warp : 2mm Speed < 0.5mm/sec. Duration: 10 sec on PCB. Solderability IEC ± 5, 3 ± 0.3 sec Resistance to Soldering Heat High Storage Damp Heat, Steady State IEC IEC IEC ± 5, 10 ± 1 sec. 125 ± 5, 1000 ± 24 hrs 40 ± 2, 90~95% RH, 1000 ± 24 hrs R25/R25 5 % At least 95% of terminal electrode is covered by new solder R 25/R 25 3 % R 25/R 25 5 % R 25/R 25 3 % The conditions shown below shall be repeated 5 cycles on PCB Step ( ) Period (minutes) Rapid Change of IEC ± 5 30 ± 3 2 Room temperature 5 ± 3 R 25/R 25 3 % ± 5 30 ± 3 4 Room temperature 5 ± 3 Max. Power IEC ± 5, Pmax., 1000 ± 24 hrs R 25/R 25 5 % THINKING ELECTRONIC INDUSTRIAL CO., LTD

8 Package Taping Specification 0201& 0402 & 0603 & 0805 type (Unit: mm) Index Type A 0 B 0 2 W ±0.2 E F P 1 P 2 P 0 D 0 K (Unit: mm) Index Type A 0 ±0.2 B 0 ±0.2 W ±0.2 E F P 1 P 2 P 0 D 0 K THINKING ELECTRONIC INDUSTRIAL CO., LTD

9 Quantity Type Quantity (pcs/reel) , , , ,500 Storage Conditions of Products Storage Conditions : 1. Storage : -10 ~ Relative Humidity: 75%RH 3. Keep away from corrosive atmosphere and sunlight. Shelf Life : 1 year THINKING ELECTRONIC INDUSTRIAL CO., LTD