SMD Pressure and Flow Sensors for Industrial Compressed Air in LTCC Technology
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1 SMD Pressure and Flow Sensors for Industrial Compressed Air in LTCC Technology A. Barras, G. Boutinard Rouelle, T. Maeder, P. Ryser Sensor Packaging session June 17 th, 15:15 Laboratoire de Production Microtechnique Ecole Polytechnique Fédérale de Lausanne (EPFL) STI-LPM, Station 17, 1015 Lausanne, Switzerland
2 What is it all about? Two sensors: in LTCC for the pneumatic industry SMD mountable by soldering with integrated electronics For measuring: air pressure bar air flow NL/min Summary 2of 26
3 Presentation outline 1. Introduction the needs of the industry 2. Pressure sensor piezoresistive 3. Flow sensor anemometer 4. Merging integrated sensor 5. Conclusions? Outline 3of 26
4 1. Motivations Precise fluid measurement (p, T, flow): OK numerous methods already exist usually with specific CMOS chips Still an issue: circuit diagnostics coarse measurements Industrial devices need to be safe & reliable! Introduction 4of 26
5 1. Motivations, cont d Focussing on custom pneumatic circuits: actuator feedback: has the piston moved? direct monitoring: what s the valve output pressure? circuit diagnostics: is the channel clogged? A solution: integrated sensors simple cheap easily mountable (SMD) integrated electronics (no need for signal processing) Measurement of pressure and flow Introduction 5of 26
6 Presentation outline 1. Introduction the needs of the industry 2. Pressure sensor piezoresistive 3. Flow sensor anemometer 4. Merging integrated sensor 5. Conclusions? Outline 6of 26
7 2. Requirements LTCC technology Nominal pressure: 6 bar (min 10 bar peak) Piezoresistors on circular membrane Assembly and connections by flip-chip no external tubing and wires tight proof use of different solder pastes d = 1.18 [mm] z x r = 1.8 [mm] y 1 st sensor: pressure 7of 26
8 2. Requirements, cont d Robust and reliable: must be insensitive to mounting stresses Easy adjustment of gain/offset Wheatstone bridge programmable integrated amplifier (ZMD 31010) 1 st sensor: pressure 8of 26
9 2. Electrical circuit 3 pins: ground, signal, power Hybrid design: thick-film + SMD devices 1 st sensor: pressure 9of 26
10 2. Electrical circuit 3 pins: ground, signal, power Hybrid design: thick-film + SMD devices First coarse offset adjustment: by digital laser trimming (R 5 R 7 shunted, factor of 3 3 =27) 1 st sensor: pressure 10 of 26
11 2. Electrical circuit 3 pins: ground, signal, power Hybrid design: thick-film + SMD devices First coarse offset adjustment: by digital laser trimming (R 5 R 7 shunted, factor of 3 3 =27) Final offset & gain with ZMD chip 1 st sensor: pressure 11 of 26
12 2. Fluidics 200-µm membrane decoupled from fluidic inlet (reduction of assembly stress influence) Channel in zigzag Membrane Zigzag channel 1 st sensor: pressure Fluidic inlet 12 of 26
13 2. Screen-printing, stacking Visible on the right: Vias Ag, DuPont 6141 Conductor tracks Ag:Pd, DuPont 6146 Resistors DuPont 2041, 10 kω/ Tape 1 Tape 2 Tape 3 Tape 4 Tape 5 Tape 5 (B) 1 st sensor: pressure 13 of 26
14 2. Screen-printing, stacking Visible on the right: Vias Ag, DuPont 6141 Conductor tracks Ag:Pd, DuPont 6146 Tape 1 Tape 2 Tape 3 Tape 4 Tape 5 Tape 5 (B) 1 st sensor: pressure 14 of 26
15 2. Screen-printing, stacking Visible on the right: Vias Ag, DuPont 6141 Tape 1 Tape 2 Tape 3 Tape 4 Tape 5 Tape 5 (B) 1 st sensor: pressure 15 of 26
16 2. Screen-printing, stacking Visible on the right: Conductor tracks Ag:Pd, DuPont 6146 Tape 1 Tape 2 Tape 3 Tape 4 Tape 5 Tape 5 (B) 1 st sensor: pressure 16 of 26
17 2. Lamination and firing 80 bar, 25 C, 10 min Firing in air, 875 C, heating ramp 5 K/min Sintering Organics burnout 1 st sensor: pressure 17 of 26
18 2. Assembly on test PCB Inlet solder pad Sensor solder pads Mechanical solder pads Fluidic solder pad External contact pads Contact pads 1 st sensor: pressure Vias 18 of 26
19 1 st sensor: pressure 19 of 26
20 2. Performance Very good repeatability: <0.1% Influence of strain at solder joints: max ±0.3% Output Voltage [V] Ratiometric output voltage = f(pressure) 3 ramps of pattern [bar] each Output Voltage [V] = * Pressure [bar] Input Pressure [bar] 20 of 26
21 Presentation outline 1. Introduction the needs of the industry 2. Pressure sensor piezoresistive 3. Flow sensor anemometer 4. Merging integrated sensor 5. Conclusions? Outline 21 of 26
22 3. Requirements Fluids: compressed air, non agressive Flow range: NL/min (with bypass) Working pressure: 6 bar Reaction time: <3 s Measuring principle: calorimetric + anemometric Upstream Downstream R 1 R 2 R 3 R 4 R T Flow Microfluidic channel R heater Thermal losses through LTCC LTCC bulk Thermal field dissipated by R heater 2 nd sensor: flow 22 of 26
23 3. Calorimetric or anemometric? Thermal mass flowmeter principles: Calorimetric: heat diffuses faster than air flow (small flows) Anemometric:flow goes faster than heat diffuses (high flows) Regulation: constant heater temperature Senser 1 Heater Senser 2 Flow T 1 T 2 T 1 T 2 Flow = 0 Symmetric heat repartition T 1 = T 2 Flow 0 Asymmetric heat repartition T 1 < T 2 2 nd sensor: flow 23 of 26
24 3. Design 1 central heater, 4 sensing elements, 1 temperature probe Mounted onto PCB by soldering LTCC bulk R 1 R 2 R 4 R 3 Sensor R Heater Bypass PCB Fluidic interface Main flow Main channel PCB circuit 2 nd sensor: flow 24 of 26
25 3. Sensor layout + variants 5-layer structure Materials: DuPont 951; Heraeus HL2000, HL800 Layout variants: channel width + height; bridge geometry Tape 1 top lid Tape 2 top channel Resistors Channel Tape 3 resistors Tape 4 bot. channel Tape 5 bottom lid Vias 2 nd sensor: flow 25 of 26
26 3. Sensor layout + variants 5-layer structure Materials: DuPont 951; Heraeus HL2000, HL800 Layout variants: channel width + height; bridge geometry Tape 1 top lid Tape 2 top channel Resistors Channel Tape 3 resistors Tape 4 bot. channel Tape 5 bottom lid Vias 2 nd sensor: flow 26 of 26
27 3. Results Anemometric output suitable for our flow range Calorimetric for precision measurement of very small flows Voltage [mv] Anemometric: heater power Heater power [W] Calorimetric: output voltage Flow [NL/min] 2 nd sensor: flow 27 of 26
28 3. Tape issues LTCC tapes: DuPont 951 Heraeus HL2000 Heraeus HL800 takes advantage of drum skin effect promising results, no drum skin effect higher tendency to warp; OK for thicker structures DP951 HL2000 Differential sintering issues HL800 Use sacrificial layers Sagging of slender structures 2 nd sensor: flow 28 of 26
29 Presentation outline 1. Introduction the needs of the industry 2. Pressure sensor piezoresistive 3. Flow sensor anemometer 4. Merging integrated sensor 5. Conclusions? Outline 29 of 26
30 4. Merging sensors On-going development: integrated sensor and electronics pressure flow temperature Membrane (pressure sensor) Air inlet R sensing temperature Air outlet Cut-out for stress decoupling LTCC Pressure channel R heater flowmeter Outlook 30 of 26
31 Presentation outline 1. Introduction the needs of the industry 2. Pressure sensor piezoresistive 3. Flow sensor anemometer 4. Merging integrated sensor 5. Conclusions? Outline 31 of 26
32 5. Conclusions Simple & cheap LTCC air pressure + flow sensors Pressure bar Piezoresistive measurement Programmable integrated ZMD bridge signal conditioner Flow Anemometric (heating power) sufficient for industrial diagnostics Calorimetric (diff. voltage) optional for precise measurements Conclusions 32 of 26
33 The end questions? Thank you for your attention and enjoy Rimini! 33 of 26
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