Malaysian Pacific Industries Berhad Investors Briefing

Transcription

1 Malaysian Pacific Industries Berhad Investors Briefing Q3 FY2017 DIFFERENTIATION THROUGH INNOVATION

2 Q3 FY17 Summary REVENUE Revenue lower by 4% sequentially & up 5% against last year MARKET Wafer constraints & Industry inventory correction CASH Net cash increased to RM420M vs RM387m of last Qtr DIVIDEND 1st interim 8 sen & 2nd interim 19 sen PAT Q3 PAT RM53.3m with EPS at 22.75c

3 MPI GROUP RESULTS AT A GLANCE Q3 FY17 Q2 FY17 Q3 FY16 Q3 vs Q2 Q3 vs Q3 YTD FY17 YTD FY16 YoY RM mil RM mil RM mil % % RM mil RM mil % Revenue % 12% 1, , % PAT % 19% % PATAMI % 11% % EPS (sen) % 11% % EBITDA % 28% 32% 28% 30% 28% Capex >100% 74% % Dividend Net Cash EDR 100 : : : : : 0 ROSF 5.0% 5.6% 4.5% 16.1% 13.8%

4 MPI GROUP NET DIVIDEND PER SHARE NET DIVIDEND PER SHARE (SEN) % Growth FY13 FY14 FY15 Fy16 FY17

5 MEGA CARSEM FAMILY DAY MEGA Carsem Family Day held on Saturday, 8th April 17 More than 7,300 Employees + Family Members Attended

6 MPI GROUP REVENUE BY GEOGRAPHICAL LOCATION OF CUSTOMERS EUROPE USA 24.0% YTD FY % YTD FY % YTD FY % YTD FY2016 ASIA 49.6% YTD FY % YTD FY2016

7 REVENUE BY END USER MARKET REVENUE BY END USER MARKET Q3 FY17 Other, 2% REVENUE BY END USER MARKET Q2 FY17 Other, 2% PC / Notebook, 11% Automotive, 25% PC / Notebook, 11% Automotive, 24% Consumer / Communicat ions, 40% Industrial, 22% Consumer / Communicat ions, 41% Industrial, 22%

8 USD Mil MPI GROUP REVENUE BY OPERATING UNITS REVENUE IN USD REVENUE BY OPERATING UNITS (%) % 90% 80% 70% 60% 50% 40% 30% Carsem Dynacraft 92% 92% 93% 94% 94% 82 20% 10% 8% 8% 7% 6% 6% 80 Q3 Q4 Q1 Q2 Q3 0% Q3 Q4 Q1 Q2 Q3 FY 2016 FY2017 FY 2016 FY2017

9 RM Mil RM Mil MPI GROUP CAPEX MPI EBITDA VS CAPEX MPI CAPEX EBITDA Capex Carsem Dynacraft Q3 Q4 Q1 Q2 Q Q3 Q4 Q1 Q2 Q3 FY2016 FY2017 FY 2016 FY2017

10 HEADING IN THE RIGHT DIRECTION Q3 SHORT / MID TERM MID / LONG TERM LONG TERM EXTERNAL CONSTRAINTS SALES PIPELINE QUALITY TECHNOLOGY EXTERNAL CHALLENGES EXPERIENCED IN Q3 PIPELINE IS STRENGTHENING STRONG FOCUS ON QUALITY STRONG FOCUS ON AUTOMATION Power outage experienced in Suzhou industrial park Temporary Wafer supply shortage experienced with top 3 customers in Q3 Carsem receiving increasing number of NPIs Increasing customer confidence in Carsem Quality Improving scorecard rankings Growing stronger in automotive Increasing CAPEX in automation

11 MPI GROUP - VISION GLOBALLY PREFERRED OSAT PARTNER FOR AUTOMOTIVE RESEARCH CENTRE FINLAND RESEARCH CENTRE GERMANY RESEARCH CENTRE CHINA CARSEM Dynacraft ACQUIRING CAPABILITIES UPSTREAM BUSINESSES MIS SIP/MCM CAPABLE WITH MIS EXISTING CAPABILITIES Basic MEMS testing Room Temp Strip Testing MIS (single & Multi Die) Thermal material (40mW/K) Cavity Package (Pre-molded) Automotive grade 0 capability ACQUIRING TECHNOLOGIES FO-WLP Module level assembly capable Thermal material (>100 W/mK) 2.5D & 3D Packaging capability Cavity Package (Film Insert mold) Tri-Temp Automotive Strip Test New Automotive requirement (AEQ & higher temp) CAPABILITY RESEARCH CENTERS IPOH CUSTOMERS GLOBALLY PREFERRED OSAT PARTNER FOR AUTOMOTIVE PEOPLE

12 CARSEM IN AUTOMOTIVE APPLICATION & SYSTEM INVOLVEMENT Power Switches Magnetic Sensors Infotainment Systems System Basis Chips (SBC s) Transmission Control Park Assist Systems Level Sensors Fuel Tank Sensor Inertial Sensors Gas Sensors Power Regulators Automatic Brake Systems Climate Control Pressure Sensors GPS Navigation Stability Control Systems Battery Management Engine Management Airbag Systems Position Sensors Current Sensors Tire Pressure Monitoring

13 CARSEM IN COMMUNICATION Accelerometer GPS Gyroscope WiFi Magnetometer Bluetooth Barometer GSM / CDMA Cell Proximity NFC: Near Field Temperature Humidity Sensor Light Sensor Camera Touch screen Audio Carsem Participates in these areas Devices that can be found in both Fan In & Fan Out WLP Devices that can be found in both Fan Out WLP & Flip Chip Devices that can be found in both WLP or Flip Chip

14 CARSEM SENSORS USED IN SERVER SYSTEMS / IT ROOMS Temperature Vibration Humidity Door contact Liquid Detection Smoke Detection Locks Alarm

15 SUMMARY Outlook in Q4 and beyond looks positive as wafer releases are picking-up Sales pipeline is strengthening Automotive segment is strengthening and we are seeing positive traction Increasing automation to drive higher quality Introducing new products in key segments Automotive & Servers Dynacraft QFN lead-frame business sustaining Targeting to outgrow the industry over 2 year plan