Semiconductor pumps and exhaust management

Transcription

1 Semiconductor pumps and exhaust management FMX - service for the life of your fab - STP magnetically levitated turbomolecular pumps and accessories STP pumps and controllers -5 ccessories -8 Dry pumps and accessories ih, if, il, and L remote drypumps and accessories -5 IPX on-tool high vacuum pumps -63 EPX on-tool high vacuum pumps -68 iq dry pump systems and accessories -7 QM mechanical booster pumps -76 Interfaces and networks -8 Exhaust management Thermal processing -8 Gas reactor columns -9 Wet scrubbers -96 Pyrophoric conditioning system -98 Zenith integrated vacuum and exhaust management system -99 Temperature management system - Thermal management Temperature control units (chillers) -

2 INTEGRTED SOLUTIONS FOR THE SEMIONDUTOR INDUSTRY O Edwards has been involved with the semiconductor industry from the beginning of vacuum processes. In partnership with customers, O Edwards has developed products and services to meet their specific process requirements. This partnership is strengthening continually as O Edwards pursues its goal of supplying customers with truly integrated solutions to vacuum needs. O Edwards il6 dry pump Networks for intelligent monitoring and control in fabs O Edwards has pioneered the supply and use of facility wide networking of pumping systems to allow remote monitoring and system diagnostics. Multiple devices, including pumps and exhaust treatment systems can be monitored from one or more P workstations, using user friendly Microsoft Windows TM compatible software. Each network is individually designed to meet the unique fab requirements. O Edwards iq dry pumps in use at Plessey Roborough in Plymouth UK. (Photograph courtesy of Plessey). The iq, ih and il dry pumps ustomer-driven improvements have resulted in the development of our iq, ih and il pumps. Proven performance and high reliability in the most demanding applications Intelligent monitoring and control Patented rotor arrangement gives high volumetric efficiency with low power input Short, simple gas path maximizes internal conductance and minimizes dead space No intercoolers needed Low operating costs - consumables eliminated Safer gas handling lean vacuum - no backstreaming Designed for low maintenance Intrinsically non polluting These features make Drystar pumps ideal for: Semiconductor processing Sputtering lean applications in freeze drying, vacuum deposition and special R & D Load lock chambers Vacuum furnaces hemical processes Operator using the FabWorks Plant Monitor software

3 In pril, O Edwards acquired the turbomolecular pump business of Seiko Instruments, Inc. Distributed and supported globally by O Edwards for nearly twenty years Designed by continuous improvement on existing proven reliable technology dvanced materials and designs provide: - lass leading performance - Low vibration - Guaranteed reliability - Low cost of ownership The broad product range covers all potential turbo pump applications. Qualified by all major semiconductor OEM s Used in all major semiconductor fabrication plants Installed base of over 7 units, 85% in the semiconductor industry Exhaust gas management system design Key features Multi-axis magnetic bearing system High Throughput versions for high flow processes Low vibration characteristics dvanced controller technology Full interfacing capability Features & benefits Improved pumping performance - Optimized for semiconductor process pressures - Maximized gas throughput for each flange size - pplications specific models New generation controllers ompact (/ rack) controller - uto tune enabling mix and match pumps - Integrated TMS control - Improved diagnostics High power d.c. motor drive - Fast ramp-up time - Self regeneration upon power failure, eliminating the need for batteries TPU units on a VD application exhaust (Photograph courtesy of TI, Dallas, US) O Edwards are unique in offering the broadest range of exhaust management technologies, demonstrated in a series of products and systems designed to meet all customer requirements, from low-cost facility management to full environmental protection. The cartridge change cart for the Gas Reactor olumn range simplifies the routine maintenance of these state-of-the-art exhaust management units. 3SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

4 FMX - service for the life of your fab XPert O Edwards is one of the world's largest suppliers of gases, vacuum & exhaust management equipment and chemical management systems to the semiconductor device, flat panel display and process tool manufacturing industries. Our global network of manufacturing facilities and service support centers is dedicated to the delivery of the highest level of quality, safety and customer service. O Edwards continues strengthen our substantial infrastructure built over more than two decades of service to the semiconductor industry. We operate in every major semiconductor region in the world - ensuring you have local support wherever you are. uilding on our product and application expertise and our widening base of strategic alliances, we have developed the FMX support program. Equipment and component management Know how services Diagnostic and nalytical Training Web services SemiServe.com: EHS (environmental, health & safety) training and technical resources XpertFabServices.com- Design resources for gas, chemical and vacuum systems (See section 6 for contact information) Semiconductor chamber component cleaning O Edwards Kachina offers full service semiconductor chamber parts cleaning, surface enhancements and component management services. Selective chemical stripping capabilities With controlled chemistries and over 75 deposition-to-substrate recipes, stock loss is reduced, component life is extended, replacement costs reduced. Dedicated process lines, segregated copper strip, end-point detection and 3 mm capability. arbon dioxide cleaning ombined with aqueous techniques, significantly reduces mobile ions, outgassing levels, resulting in faster chamber requalification. Surface enhancement Five-axis, robotically controlled twin wire arc spray optimizes surface roughness, resulting in extended and predictable times between preventive maintenance. Full critical dimensional inspection and metrology capability omponent management services ssembled pre-conditioned chamber-ready component sets transported in our patented Quick Kit TM cleanroom compatible transport container. Increases tool uptime, reduces time to perform preventative maintenance, eliminates need for customer to manage spares inventory. Global capabilities There are three U.S. full service facilities (Phoenix, ustin, Hillsboro), and the newest full service facility in orbeil, France. We also offer in-fab operations in Israel, hina and the UK. Global network of facilities providing: Equipment and Systems Repair and Upgrade O Edwards Kachina process tool parts cleaning and management X Site rizona 395 E. Watkins Phoenix, Z 853 +() 6 3 Productivity support On-site management of critical materials and systems including ulk and special gases hemicals Vacuum Exhaust management Project and design Texas 7 ommercial enter Dr. ustin, TX 787 +() 5 6 Oregon 6 W. ornelius Pass Road Hillsboro, OR 97 +() Turnkey project management for gas, chemical, vacuum, abatement and other utility systems ISinc 3D design Process tool hook-up services France oulevard John Kennedy 95 orbeil Essonnes edex +(33) 688 7

5 STP MGNETILLY LEVITTED TUROMOLEULR PUMPS dvantage series The new dvantage series of magnetically levitated turbo pumps have been designed to provide the highest levels of throughput required by the next generation of semiconductor etch and VD processes. They have been developed, using continuous improvement techniques, from the ultra reliable, high performance H series of products. Their advanced rotor design combined with selection of the best materials has allowed the creation of the next generation of high throughput turbo pump inside the same footprint as many of the existing models. The range contains pumps with throughput speeds from 8 l s - to 35 l s -. STP features - amp/div O Edwards is a leader in clean and dry vacuum technology. The first STP pumps were sold in 983 and there are now over 7 installations worldwide. 85% are operating on semiconductor process tools where they demonstrate exceptional levels of reliability. STP pumps are the first choice for applications demanding high up-time, hydrocarbon-free pumping, minimal maintenance and low vibration. Proven reliability. lean oil-free high vacuum. omplete range from 3 to 35 l s -. pplication specific models. Very low noise and vibration. Low cost of ownership. Virtually maintenance free. Installation in any orientation. Full remote control interface. Supported globally by O Edwards Proven magnetic bearing technology The rotor is entirely suspended by magnetic bearings so all contact between the rotor and the remainder of the pump is eliminated. s well as giving very low vibration, the elimination of contact means no bearing wear and no requirement for consequent pump maintenance. STP range UHV series The Ultra High Vacuum series of magnetically levitated turbo molecular pumps are the products of choice for the semiconductor, surface science or high energy physics industries. They offer unrivalled reliability, performance, cleanliness and class leading low vibration levels. The pumps are all d.c. powered, eliminating the need for batteries, they use a half rack controller which features auto-tuning and advanced diagnostic features. The range contains pumps with speeds from 3 l s - to l s - all of which are available in ISO or F flange variants. High throughput series The high throughput series of magnetically levitated turbo pumps generate the high gas flows required by the current generation of semiconductor etch, ion implant and LD systems. ll the pumps feature a five active axis magnetic bearing system and a d.c. drive for increased robustness and stability. They use a Holweck stage to provide advanced throughput performance. They operate via a half rack controller with auto-tuning, advanced diagnostics and an integrated temperature management system. The range operates with throughput speeds from 3 l s - to 5 l s Oil free ll STP turbomolecular pumps are oil free. The use of magnetic bearings eliminates all hydrocarbon lubricants ensuring no contamination of the vacuum process from the turbomolecular pump. This feature is vital in the semiconductor industry (where device densities are constantly increasing) and in surface science or high energy physics applications (where even minute degrees of contamination disrupt measurements). Maintenance free Unlike conventional mechanical bearings, magnetic levitation means there is no frictional contact, eliminating sources of wear and vibration. This feature enables STP turbomolecular pumps to run for years with virtually no maintenance, reducing annual operating costs to a minimum and ensuring maximum up-time is achieved. This maintenance free feature can be particularly beneficial on processes producing chemical or radioactive contamination. Vibration free Magnetic levitation of the rotor results in an extremely low level of noise and vibration. Peak-to-peak vibration level is less than. µm. This amplitude remains constant throughout the life of the pump and is free from troublesome sub-harmonics. µm -3 5x Residual gas analysis 6 8 Hz Vibration analysis STP3 displacement/frequency utomatic balancing system (S) S is a unique patented development of 5-axis technology. If any rotor imbalance is introduced (by deposition of process by-products, for example), sensors in the pump detect changes in the rotor motion and compensate the magnetic bearing fields to allow the rotor to spin on its natural inertial axis. This minimizes the vibration transmitted to the inlet flange. S works at all pump rotational speeds. 5SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

6 Safety backup bearings STP pumps have dry lubricated axial and radial mechanical bearings as safety backup bearings. These support the rotor and protect the pump in the event of a total disruption of magnetic suspension or a massive air inrush which overcomes the magnetic bearing stiffness. These high precision ball bearings are dry lubricated and are not in contact with the rotor during normal operation. Optimized rotors The multistage pure bladed rotors in the UHV pumps provide the high vacuums required for clear beamlines on D SEM machines, mass spectrometers and ion implanters. They provide optimum pumping performance with excellent light gas compression ratios. ompound rotors The high throughput pumps incorporate a Holweck drag stage that increases the pumps throughput at low pressure. Scientific applications STP pumps are used extensively in the world s foremost research and development institutes. The pumps satisfy stringent performance criteria and reliability expectations. They are also used in the following applications: Scientific instruments: surface analysis, mass spectrometry, electron microscopy High energy physics: beam lines, accelerators Radioactive applications: fusion systems, cyclotrons 6 N O TMS dvanced series compound rotors The advanced series pumps have a redesigned compound rotor, the materials of manufacture have been improved to reduce the clearances within the pump, the rotors have an advanced 3D design and the Holweck stage has been redesigned to increase the throughput. orrosion resistant To ensure a high level of resistance to corrosion, the corrosion resistant () and high throughput (H-) pumps have nickel coated rotors/stators and pump internals suitable for ion implantation and plasma etching. Further enhanced levels of protection are available on request. Nitrogen purging The corrosion resistant () pumps and the high throughput (H-) pumps have a nitrogen purge facility, a constant flow of nitrogen through the pump dilutes corrosive gases minimizing their damage to the pumps motor and sensor coils. TMS system The O Edwards Temperature Management System is available on a wide range of turbo pumps. It is designed to optimize the temperature within the pump, dramatically reducing the particle condensation within. This will not only considerably enhance the performance of the pump under harsh process conditions, but also increase its operational life. PPLITIONS Semiconductor fabrication STP turbomolecular pumps are the number one choice for the world's leading semiconductor etch and implant manufacturers. The pumps are installed on the harshest applications (for example, metal etch) and demonstrate exceptional levels of reliability. Plasma etch (chlorine, fluorine and bromine chemistries) for metal (aluminum), tungsten and dielectric (oxide) and polysilicon Electron cyclotron resonance (ER) etch Film deposition VD, PEVD, ERVD, MOVD Sputtering Ion implantation source, beam line pumping end station ME Diffusion Photo resist stripping rystal/epitaxial growth Wafer inspection Load lock chambers

7 STP3/STP3 TUROMOLEULR PUMP Rated speed 8 rpm Starting time 3 min Maximum inlet flange temperature º Input voltage to V a.c. (±%) or to V a.c. (±%) Power consumption Start up.55 kv Weight Pump kg ontroller 7 kg O Edwards STP3 and corrosion resistant STP-3 are for use in electron microscopes and semiconductor applications. O Edwards rotor technology gives class-leading performance for maximum process flexibility. The STP3 has been approved for use by major equipment manufacturers in the scientific instrument, semiconductor and magnetic media industries. Features & benefits dvanced rotor technology Maximized process flexibility Oil free Low vibration High reliability Maintenance free dvanced controller design uto tuning Self diagnostic functions d.c. motor drive attery-free operation ompact design Small footprint Half rack controller TEHNIL DT Inlet flange ISO / DNF Outlet port KF5 Purge port KF ( version only) Pumping speed N 3 l s - H 3 l s - ompression ratio N > 8 H > x Ultimate pressure with bake out heating ISO inlet flange 6.5 x -6 (5 x -8 ) Pa (Torr) F inlet flange (not version) -8 order ( - order) Pa (Torr) F inlet flange ( version only) -7 order ( -9 order) Pa (Torr) Maximum allowable inlet pressure mbient cooled.66 (5 x - ) Pa (Torr) Maximum continuous outlet pressure mbient cooled 3 (.) Pa (Torr) 3 l s - N 3 l s - H 3 8 l s - He 8 x M8 x Ø6 Electrical connectors for control unit Purge port ( version only) Outlet flange 8 7SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

8 ontroller PRODUT DESRIPTION STP pump is supplied with an inlet screen. For a complete installation order an STP pump, a controller, a connection cable and power cable from the information below. STP3 ISO inlet 783 DNF inlet 783 STP3 ISO inlet 787 DNF inlet 788 ontroller - V 5/6 Hz PTZZ - V 5/6 Hz PTZZ onnection cables 3 m 77 5 m 77 m PTY8 Power cables Ring terminal 3 m 779 Ring terminal 5 m 77 European plug 3 m 556 UK plug 3 m 555 Options Water cooling coil Horizontal fitting R/ 7875 Vibration isolator ISO 586 DNF 783

9 STP3 TUROMOLEULR PUMP Maximum allowable inlet pressure mbient cooled.66 (5 x - ) Pa (Torr) Maximum continuous outlet pressure mbient cooled 3 (.) Pa (Torr) Rated speed 8 rpm Starting time 3 min Maximum inlet flange temperature º Input voltage - V or - V Power consumption Start up.55 kv Weight Pump kg ontroller 7 kg O Edwards corrosion resistant STP3 turbomolecular pump offers field proven reliability for use in the harshest of semiconductor applications. O Edwards rotor technology gives class-leading performance for maximum process flexibility. The STP3 has been approved for use by major equipment manufacturers in the semiconductor and magnetic media industries. Features & benefits dvanced rotor technology Maximized process flexibility Oil free Low vibration Low field High reliability Maintenance free Harsh process compatible Increased life dvanced controller design uto tuning Self diagnostic functions d.c. motor drive attery-free operation ompact design Small footprint Half rack controller TEHNIL DT Inlet flange ISO / DNF Outlet port KF or KF5 Purge port KF Pumping speed N 3 l s - H 3 l s - ompression ratio N > 8 H > x Ultimate pressure ISO inlet flange 6.5 x -6 (5 x -8 ) Pa (Torr) F inlet flange -7 ( -9 ) Pa (Torr) 3 l s - N 3 l s - H 3 8 l s - He Electrical connector D ooling water out (accessory) Outlet port E ooling water in (accessory Purge port 9SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

10 ontroller PRODUT DESRIPTION STP pump is supplied with an inlet screen. For a complete installation order an STP pump, a controller, a connection cable and power cable from the information below. STP3 ISO inlet KF5 outlet 787 ISO inlet KF outlet 787 DNF inlet KF5 outlet 788 DNF inlet KF outlet 788 ontroller - V 5/6 Hz PTZZ - V 5/6 Hz PTZZ onnection cables 3 m 77 5 m 77 m PTY8 Power cables Ring terminal 3 m 779 Ring terminal 5 m 77 European plug 3 m 556 UK plug 3 m 555 Options Water cooling coil Horizontal fitting R/ 7875 Vibration isolator ISO 586 DNF 783

11 STP5/STP5 TUROMOLEULR PUMP Rated speed 8 rpm Starting time 3 min Maximum inlet flange temperature º Input voltage to V a.c. (±%) or to V a.c. (±%) Power consumption Start up.55 kv Weight Pump kg ontroller 7 kg O Edwards STP-5 and corrosion resistant STP-5 are for use in electron microscopes, scientific instruments and semiconductor applications. O Edwards rotor technology gives class-leading performance for maximum process flexibility. The STP5 has been approved for use by major equipment manufacturers in the scientific instrument, semiconductor and magnetic media industries. Features & benefits dvanced rotor technology Maximized process flexibility Oil free Low vibration High reliability Maintenance free dvanced controller design uto tuning Self diagnostic functions d.c. motor drive attery-free operation ompact design Small footprint Half rack controller TEHNIL DT Inlet flange ISO6K / DN6F Outlet port KF5 Purge port KF ( version only) Pumping speed N 8 l s - H 6 l s - ompression ratio N > 8 H > x Ultimate pressure with bake out heating ISO inlet flange 6.5 x -6 (5 x -8 ) Pa (Torr) F inlet flange (not version) -8 order ( - order) Pa (Torr) F inlet flange ( version only) -7 order ( -9 order) Pa (Torr) Maximum allowable inlet pressure mbient cooled.66 (5 x - ) Pa (Torr) Maximum continuous outlet pressure mbient cooled 3 (.) Pa (Torr) 8 l s - N 6 l s - H 3 6 l s - He Electrical connector Purge port ( version only) Outlet port D ooling coil (ccessory) SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

12 ontroller PRODUT DESRIPTION STP pump is supplied with an inlet screen. For a complete installation order an STP pump, a controller, a connection cable and power cable from the information below. STP5 ISO6 inlet 783 DN6F inlet 78 STP5 ISO6 inlet 785 DN6F inlet 786 ontroller - V 5/6 Hz PTZZ - V 5/6 Hz PTZZ onnection cables 3 m 77 5 m 77 m PTY8 Power cables Ring terminal 3 m 779 Ring terminal 5 m 77 European plug 3 m 556 UK plug 3 m 555 Options Water cooling coil Horizontal fitting R/ 7875 Vibration isolator ISO6 589 DN6F 765

13 STP5 TUROMOLEULR PUMP Rated speed 8 rpm Starting time 3 min Maximum inlet flange temperature º Input voltage - V or - V Power consumption Start up 55 V Weight Pump kg ontroller 7 kg O Edwards corrosion resistant STP5 turbomolecular pumps offers field proven reliability for use in the harshest of semiconductor applications. O Edwards rotor technology gives class-leading performance for maximum process flexibility. The STP5 has been approved for use by major equipment manufacturers in the semiconductor and magnetic media industries. Features & benefits dvanced rotor technology Maximized process flexibility Oil free Low vibration Low field High reliability Maintenance free Harsh process compatible Increased life dvanced controller design uto tuning Self diagnostic functions d.c. motor drive attery-free operation ompact design Small footprint Half rack controller TEHNIL DT Inlet flange ISO6 / DN6F Outlet port KF or KF5 Purge port KF Pumping speed N 8 l s - H 6 l s - ompression ratio N > 8 H > x Ultimate pressure ISO inlet flange 6.5 x -6 (5 x -8 ) Pa (Torr) F inlet flange -7 order ( -9 order) Maximum allowable inlet pressure mbient cooled.66 (5 x - ) Pa (Torr) Maximum continuous outlet pressure mbient cooled 3 (.) Pa (Torr) 8 l s - N 6 l s - H 3 6 l s - He 68 D ISO6 3 E F 7 Ø Ø56 Ø8 Ø3 Ø8 x Ø8. Electrical connector D ooling water out (accessory) Outlet port E ooling water in (accessory) Purge port DN6F (F6) 68 3SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

14 ontroller PRODUT DESRIPTION STP pump is supplied with an inlet screen. For a complete installation order an STP pump, a controller, a connection cable and power cable from the information below. STP5 ISO6 inlet KF5 outlet 785 ISO6 inlet KF outlet 785 DN6F inlet KF5 outlet 786 DN6F inlet KF outlet 786 ontroller - V 5/6 Hz PTZZ - V 5/6 Hz PTZZ onnection cables 3 m 77 5 m 77 m PTY8 Power cables Ring terminal 3 m 779 Ring terminal 5 m 77 European plug 3 m 556 UK plug 3 m 555 Options Water cooling coil Horizontal fitting R/ 7875 Vibration isolator ISO6 589 DN6F 765

15 STP-L3/STP-L3 TUROMOLEULR PUMP Input voltage Power consumption Start up Weight Pump ontroller to V a.c. (±%) or to V a.c. (±%).55 kv 3 kg 7 kg NEW ISO IF5 VG x Ø Ø3..5 Ø6 Ø8.5 6 x Ø Ø85 Ø5 VG O Edwards STP-L3() and corrosion resistant STP-L3() are for use in electron microscopes and semiconductor applications. O Edwards rotor technology gives class-leading performance for maximum process flexibility. The STP-L3() has been approved for use by major equipment manufacturers in the scientific instrument, semiconductor and magnetic media industries. Features & benefits dvanced rotor technology Maximized process flexibility Oil free Low vibration High reliability Maintenance free dvanced controller design uto tuning Self diagnostic functions d.c. motor drive attery-free operation ompact design Small footprint Half rack controller TEHNIL DT Inlet flange ISO / DNF Outlet port KF5 Purge port KF ( version only) Pumping speed N 6 l s - H 9 l s - ompression ratio N > 8 He 5 x 5 H x Ultimate pressure with bake out heating -6 order( -8 order) Pa (Torr) Maximum allowable inlet pressure mbient cooled 6.7 x - (5 x - ) Pa (Torr) Maximum continuous outlet pressure mbient cooled 3 (.) Pa (Torr) Rated speed 8 rpm Starting time 3 min Maximum inlet flange temperature º x M8 x 6 M x 55 onnector Outlet port Ø5 Ø Ø5 Ø3 Ø5 Ø8 Ø56 Ø8 Ø6 IF5 ISO SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

16 NEW 6 ontroller l s - N l s - H 3 l s - He PRODUT DESRIPTION STP pump is supplied with an inlet screen. For a complete installation order an STP pump, a controller, a connection cable and power cable from the information below. STP-L3 ISO inlet 7589 DNF inlet PT7Z STP-L3 ISO inlet 758 DNF inlet PT7Z3 ontroller - V 5/6 Hz PTZZ - V 5/6 Hz PTZZ onnection cables 3 m 77 5 m 77 m PTY8 Power cables Ring terminal 3 m 779 Ring terminal 5 m 77 European plug 3 m 556 UK plug 3 m 555 Options Water cooling coil Horizontal fitting R/ 7875 Vibration isolator ISO 586 DNF 783

17 STP-L5/STP-L5 TUROMOLEULR PUMP 3 l s - STP-L5() Pa ls - H 5 ls - N Torr The new O Edwards STP-L5() has been designed to meet the low vibration requirements of advanced spectroscopy and microscopy tools. It is based on O Edwards class leading STP5() model but provides the advantage of having the vibration isolation system built into the pump body. This revolutionary design provides an array of benefits to user. Features & benefits Low vibration uilt in vibration isolation system gives improved performance over STP5() and external isolator Increased pumping performance No external isolator so conductance losses are reduced giving true 5 l/s performance More compact design onsiderably smaller than STP5() and external isolator Easy installation One single pump component reduces installation time TEHNIL DT Inlet flange ISO6K / DN6F Outlet port KF 5 Purge port KF ( version only) Pumping speed N 5 l s - H l s - ompression ratio N > 8 H > x Ultimate pressure with bake out heating -6 order ( -8 order) Pa (Torr) Maximum allowable inlet pressure 6.7 x - (5 x - ) Pa (Torr) Maximum allowable backing pressure 3 (.) Pa (Torr) Rated speed 8 rpm Starting time 3 min Mounting position Vertical Recommended purge gas flow (.7 x - ) sccm Input voltage to V a.c. (±%) or to V a.c. (±%) Typical power consumption.55 kv Weight Pump kg ontroller 7 kg Electrical connector Outlet port Purge port ( version only) 7SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

18 ontroller PRODUT DESRIPTION STP pump is supplied with an inlet screen. For a complete installation order an STP pump, a controller, a connection cable and power cable from the information below. STP-L5 ISO6K 758 DN6F 758 STP-L5 ISO6K 758 DN6F PT7Z ontroller - V 5/6 Hz PTZZ - V 5/6 Hz PTZZ onnection cables 3 m 77 5 m 77 m PTY8 Power cables Ring terminal 3 m 779 Ring terminal 5 m 77 European plug 3 m 556 UK plug 3 m 555 Options Water cooling coil Horizontal fitting R/ 7875 Vibration isolator ISO6 589 DN6F 765

19 STP63/STP63 TUROMOLEULR PUMP Maximum inlet flange temperature º Input voltage to V a.c. (±%) or to V a.c. (±%) Power consumption (continuous).8 kv Weight Pump 3 kg ontroller 9 kg Water cooled O Edwards STP63 and corrosion resistant STP63 are new turbomolecular pumps for use in the most advanced semiconductor applications. O Edwards rotor technology gives class-leading performance for maximum process flexibility. oth pumps have been approved for use by major equipment manufacturers in the semiconductor and magnetic media industries. Features & benefits dvanced rotor technology Maximized process flexibility Oil free Low vibration High reliability Maintenance free Harsh process compatible ( version) Increased life dvanced controller design uto tuning Self diagnostic functions d.c. motor drive attery-free operation ompact design Small footprint Half rack controller TEHNIL DT Inlet flange ISO6F / DN6F Outlet port KF Purge port KF ( version only) Pumping speed N 65 l s - H 55 l s - ompression ratio N > 8 H > 5 Ultimate pressure with bake out heating ISO inlet flange -7 ( -9 ) order Pa (Torr) F inlet flange (not version) -8 ( - ) order Pa (Torr) F inlet flange ( version only) 6.5 x -6 (5 x -8 ) Pa (Torr) Maximum continuous outlet pressure 3 (.) Pa (Torr) Rated speed 35 rpm Starting time 6 min 65 l s - N 6 l s - He 3 55 l s - H Electrical connector Outlet port Purge port ( version only) 9SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

20 L type connector 9 Polarizing groove Outlet port Polarizing boss 8 7 PRODUT DESRIPTION STP pump is supplied with an inlet screen. For a complete installation order an STP pump, a controller, a connection cable and power cable from the information below. STP63 ISO6F 7 DN6F PT39Z5 STP63 ISO6F 7 DN6F PT39Z ontroller V- V/- V 5/6 Hz RS3 PT56ZZ onnection cables Straight connector 3 m m 753 m 7536 Power cables Ring terminal 5 m PT6Y Ring terminal m PT6Y Option Water cooling coil Horizontal fitting R/ 73 ontroller

21 STP3/STP3 TUROMOLEULR PUMP Maximum inlet flange temperature º Input voltage to V a.c. (±%) or to V a.c. (±%) Power consumption (continuous).8 kv Weight Pump 3 kg ontroller 9 kg Water cooled With cooling water, for bakeout O Edwards STP3 and corrosion resistant STP3 are new turbomolecular pumps for use in the most advanced of semiconductor applications. O Edwards rotor technology gives class-leading performance for maximum process flexibility. oth pumps have been approved for use by major equipment manufacturers in the semiconductor and magnetic media industries. Features & benefits dvanced rotor technology Maximized process flexibility Oil free Low vibration High reliability Maintenance free Harsh process compatible ( version) Increased life dvanced controller design uto tuning Self diagnostic functions d.c. motor drive attery-free operation ompact design Small footprint Half rack controller TEHNIL DT Inlet flange ISOF / DNF Outlet port KF Purge port KF ( version only) Pumping speed N l s - H 8 l s - ompression ratio N > 8 H > 5 Ultimate pressure with bake out heating ISO inlet flange -7 ( -9 ) order Pa (Torr) F inlet flange (not version) -8 ( - ) order Pa (Torr) F inlet flange ( version only) 6.5 x -6 (5 x -8 ) Pa (Torr) Maximum continuous outlet pressure 3 (.) Pa (Torr) Rated speed 35 rpm Starting time 6 min l s - N 9 l s - He 3 8 l s - H ISOF 3 Electrical connector Outlet port Purge port ( version only) Ø SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

22 L type connector ontroller 9 Polarizing groove Outlet port Polarizing boss 8 7 PRODUT DESRIPTION STP pump is supplied with an inlet screen. For a complete installation order an STP pump, a controller, a connection cable and power cable from the information below. STP3 ISOF PT39Z DNF 7 STP3 ISOF 73 DNF PT39Z3 ontroller V- V/- V 5/6 Hz RS3 PT56ZZ onnection cables Straight connector 3 m m 753 m 7536 Power cables Ring terminal 5 m PT6Y Ring terminal m PT6Y Options Water cooling coil Horizontal fitting R/ 73 Vibration Isolator ISO

23 STPH3 HIGH PERFORMNE TUROMOLEULR PUMP Ultimate pressure with bake out heating -7 ( -9 ) order Pa (Torr) Maximum continuous outlet pressure 66 (5) Pa (Torr) Maximum Nitrogen throughput 5 sccm Rated speed 8 rpm Starting time min Maximum inlet flange temperature º Input voltage to V a.c. (±%) or to V a.c. (±%) Power consumption.6 kv Weight Pump 5 kg ontroller 9 kg Water cooled O Edwards high performance STPH3 turbomolecular pump has been designed for use in the harshest of semiconductor applications. The pump's field proven reliability and class-leading performance give maximum process flexibility. The STPH3 has been approved for use by major equipment manufacturers in the semiconductor and magnetic media industries. Features & benefits dvanced rotor technology Higher gas throughput Maximized process flexibility Oil free Low vibration High reliability Maintenance free Harsh process compatible Increased life dvanced controller design uto tuning Self diagnostic functions d.c. motor drive attery-free operation ompact design Small footprint Half rack controller 5 axis magnetic suspension system Zero contamination Low maintenance ny orientation operation TEHNIL DT Inlet flange ISOK / DNF Outlet port KF Purge port KF Water cooling fitting PT/ Pumping speed N 3 l s - H l s - ompression ratio N > 8 H 3 r N 3 He H 55.5 D ISOK 7 5 E Ø3 Ø56 Ø8 Electrical connector D ooling water out Outlet port E ooling water in Purge port 35 3 Ø x M8 x 57 3SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

24 L type connector ontroller 9 Polarizing groove Outlet port Polarizing boss 8 7 PRODUT DESRIPTION STP pump is supplied with an inlet screen. For a complete installation order an STP pump, a controller, a connection cable and power cable from the information below. STPH3 ISOK inlet 79 DNF inlet PT3Z ontroller - V/- V 5/6 Hz RS3 PT56ZZ onnection cables Straight connector 3 m m 753 m 7536 Power cables Ring terminal 5 m PT6Y Ring terminal m PT6Y TMS system is available for this model. For a complete installation order an STP pump (TMS), a controller, a TMS connection cable kit, a connection cable, and power cable is required. STPH3V (TMS) ISOF PT36 DNF PT365 TMS connection cable kit 5 m PT33V m PT33V 5 m PT33V

25 STPH5 HIGH PERFORMNE TUROMOLEULR PUMP Ultimate pressure with bake out heating -7 ( -9 ) order Pa (Torr) Maximum continuous outlet pressure 66 (5) Pa (Torr) Maximum Nitrogen throughput 5 sccm Rated speed 8 rpm Starting time min Maximum inlet flange temperature º Input voltage to V a.c. (±%) or to V a.c. (±%) Power consumption.6 kv Weight Pump 5 kg ontroller 9 kg Water cooled ISO6K Ø8 O Edwards high performance STPH5 turbomolecular pump has been designed for use in the harshest of semiconductor applications. The pump's proven reliability and class-leading performance give maximum process flexibility. The STPH5 has been approved for use by major equipment manufacturers in the semiconductor and magnetic media industries. Features & benefits dvanced rotor technology Higher gas throughput Maximized process flexibility Oil free Low vibration High reliability Maintenance free Harsh process compatible Increased life dvanced controller design uto tuning Self diagnostic functions d.c. motor drive attery-free operation ompact design Small footprint Half rack controller 5 axis magnetic suspension system Zero contamination Low maintenance ny orientation operation TEHNIL DT Inlet flange ISO6K / DN6F Outlet port KF Purge port KF Water cooling fitting PT/ Pumping speed N 5 l s - H 3 l s - ompression ratio N > 8 H Ø56 Ø D 7 E Ø x M8 X Electrical connector D ooling water out Outlet port E ooling water in Purge port 5.7 5SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

26 6 r N 3 He H L type connector PRODUT DESRIPTION STP pump is supplied with an inlet screen. For a complete installation order an STP pump, a controller, a connection cable and power cable from the information below. STPH5 ISO6K inlet 79 DN6F inlet PT3Z5 ontroller - V/- V 5/6 Hz RS3 PT56ZZ onnection cables Straight connector 3 m m 753 m 7536 Power cables Ring terminal 5 m PT6Y Ring terminal m PT6Y TMS system is available for this model. For a complete installation order an STP pump (TMS), a controller, a TMS connection cable kit, a connection cable, and power cable is required. STPH5V (TMS) ISO6F PT367 DN6F PT366 TMS connection cable kit 5 m PT33V m PT33V 5 m PT33V Polarizing groove Outlet port Polarizing boss ontroller

27 STP83 DVNTGE TUROMOLEULR PUMP Power consumption (continuous) Weight Pump ontroller Water cooled.85 kv 39 kg 9 kg r N 3 H O Edwards STP83 is a new turbomolecular pump designed for use in semiconductor applications. O Edwards advanced rotor technology gives class-leading performance for maximum process flexibility. The STP83 has been approved for use by major equipment manufacturers in the semiconductor and magnetic media industries. Features & benefits dvanced rotor technology Maximized process flexibility Oil free Low vibration High reliability Maintenance free Harsh process compatible Increased life dvanced controller design uto tuning Self diagnostic functions d.c. motor drive attery-free operation ompact design Small footprint Half rack controller TEHNIL DT Inlet flange ISO6F / DN6F Outlet port KF Purge port KF Water cooling fitting PT/ Pumping speed N 8 l s - H 5 l s - ompression ratio N > 8 H 3 Ultimate pressure with bake out heating -7 ( -9 ) order Pa (Torr) Maximum continuous outlet pressure 7 () Pa (Torr) Maximum Nitrogen throughput 5 sccm Rated speed 35 rpm Starting time 7 min Maximum inlet flange temperature º Input voltage - V (±%) Electrical connector Outlet port Purge port 7SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

28 L type connector 8 ontroller 9 Polarizing groove Outlet port Polarizing boss 8 7 PRODUT DESRIPTION STP pump is supplied with an inlet screen. For a complete installation order an STP pump, a controller, a connection cable and power cable from the information below. STP83 ISO6F inlet 78 DN6F inlet 785 ontroller - V 5 Hz/6 Hz with RS3 PT56ZZ onnection cables Straight connector 3 m m 753 m 7536 Power cables Ring terminal 5 m PT6Y Ring terminal m PT6Y TMS system is available for this model. For a complete installation order an STP pump (TMS), a controller, a TMS connection cable kit, a connection cable, and power cable is required. STP83V (TMS) ISO6F PT366 DN6F PT3663 TMS connection cable kit 5 m PT33V m PT33V 5 m PT33V

29 STP33 DVNTGE TUROMOLEULR PUMP Input voltage - V a.c. (±%) Power consumption (continuous).85 kv Weight Pump 39 kg ontroller 9 kg Water cooled r N 3 H O Edwards STP33 is a new turbomolecular pump designed for use in semiconductor applications. dvanced rotor technology gives classleading performance for maximum process flexibility. The STP33 has been approved for use by major equipment manufacturers in the semiconductor and magnetic media industries. Features & benefits dvanced rotor technology Higher gas throughput Maximized process flexibility Oil free Low vibration High reliability Maintenance free Harsh process compatible Increased life dvanced controller design uto tuning Self diagnostic functions d.c. motor drive attery-free operation ompact design Small footprint Half rack controller TEHNIL DT Inlet flange ISOF / DNF Outlet port KF Purge port KF Water cooling fitting PT/ Pumping speed N 3 l s - H 8 l s - ompression ratio N > 8 H 3 Ultimate pressure with bake out heating -7 ( -9 ) order Pa (Torr) Maximum continuous outlet pressure 7 () Pa (Torr) Maximum Nitrogen throughput 5 sccm Rated speed 35 rpm Starting time 7 min Maximum inlet flange temperature º Electrical connector Outlet port Purge port 9SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

30 L type connector 3 ontroller 9 Polarizing groove Outlet port Polarizing boss 8 7 PRODUT DESRIPTION STP pump is supplied with an inlet screen. For a complete installation order an STP pump, a controller, a connection cable and power cable from the information below. STP33 ISOF inlet 78 DNF inlet 783 ontroller - V 5/6 Hz RS3 PT56ZZ onnection cables Straight connector 3 m m 753 m 7536 Power cable Ring terminal 5 m PT6Y Ring terminal m PT6Y TMS system is available for this model. For a complete installation order an STP pump (TMS), a controller, a TMS connection cable kit, a connection cable, and power cable is required. STP33V (TMS) ISOF PT3665 DNF PT366 TMS connection cable kit 5 m PT33V m PT33V 5 m PT33V

31 STP63 TUROMOLEULR PUMP Ultimate pressure with bake out heating -7 Pa Maximum allowable backing pressure 66 (.) Pa (Torr) Maximum nitrogen throughput 5 sccm Rated speed 365 rpm Starting time 7 min Mounting position ny Water cooling Flow l min - Temperature 5-5 º Pressure 3 kgf / cm - Recommended purge gas flow sccm Input voltage - V a.c. (±%) Typical power consumption.85 kv Weight Pump 35 kg ontroller 9 kg The small and powerful O Edwards STP63 turbo-molecular pump has been designed using O Edwards advanced rotor technology. This provides high throughput, maximum reliability and class leading performance which is demanded by the latest generation of semiconductor processes. Its half rack controller and compact design provide considerable space saving, whilst its advanced deposition reduction system gives improved reliability and performance. The STP63 has been qualified on the latest mm etch tools as well as on new generation 3 mm oxide etch processes. Features & benefits dvanced Rotor Design Increased performance Higher gas throughput High reliability Maintenance free Harsh process compatible 5 xis Magnetic Suspension System Zero contamination Low vibration orrosion Resistant Harsh process compatible Increased life ompact onstruction Small footprint Half rack controller dvanced ontroller Design Tuning free Self diagnostic functions d.c. motor drive attery-free operation TEHNIL DT Inlet flange ISOF / DNF Outlet port KF Purge port KF6 Water cooling fitting PT/ Pumping speed N 6 l s - H l s - ompression ratio N > 8 H >7 x 3 N r 3 He H û Ø85 Ø37 Ø7 Ø Electrical connector D ooling water out Outlet port E ooling water in Purge port D 35û 3 û E x Ø Ø6 ISOF x M x 3SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

32 L type connector 3 ontroller 9 Polarizing groove Outlet port Polarizing boss 8 7 PRODUT DESRIPTION STP pump is supplied with an inlet screen. For a complete installation order an STP pump, a controller, a connection cable and power cable from the information below. STP63 ISOF 75 DNF 75 ontroller - V 5/6 Hz RS3 PT56ZZ onnection cables Straight connector 3 m m 753 m 7536 Power cable Ring terminal 5 m PT6Y Ring terminal m PT6Y TMS system is available for this model. For a complete installation order an STP pump (TMS), a controller, a TMS connection cable kit, a connection cable, and power cable is required. STP63V (TMS) ISOF PT66 DNF PT665 TMS connection cable kit 5 m PT6V m PT6V 5 m PT6V

33 STP3 DVNTGE TUROMOLEULR PUMP Rated speed 7 rpm Starting time 7 min Mounting position ny Water cooling Flow l min - Temperature 5-5 º Pressure.9 x 5 Pa 3 kgf/cm Recommended purge gas flow (3. x - ) sccm Input voltage - V a.c. (±%) Typical power consumption.5 kv Weight Pump 6 kg ontroller kg O Edwards STP3 is a new turbomolecular pump designed for use in semiconductor applications. It has advanced rotor technology that gives class-leading performance for maximum process flexibility. new half rack controller gives additional space savings and incorporates d.c. drive technology for battery-free operation. The STP3 has been approved for use by major etch, ion implant and deposition equipment manufacturers in the semiconductor and magnetic media industries. Features & benefits dvanced rotor technology Higher gas throughput Maximized process flexibility 5 axis magnetic suspension system Zero contamination Low maintenance orrosion resistant Harsh process compatible Increased life ompact construction Small footprint Half rack controller dvanced controller design Tuning free Self diagnostic functions d.c. motor drive attery-free operation TEHNIL DT Inlet flange ISO5F / IF35 Outlet port KF Purge port KF Water cooling fitting PT/ Pumping speed N l s - H 7 l s - ompression ratio N > 8 H.5 x Ultimate pressure -6 ( -8 ) order Pa (Torr) Maximum allowable backing pressure (3) Pa (Torr) Maximum nitrogen throughput 5 sccm Electrical connector D ooling water out Outlet port E ooling water in Purge port F Temperature sensor connector 33SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

34 3 r N 3 He H L type connector PRODUT DESRIPTION STP pump is supplied with an inlet screen. For a complete installation order an STP pump, a controller, a connection cable and power cable from the information below. STP3 ISO5F PTVZ DN5F PTVZ3 ontroller - V 5/6 Hz RS3 PTZZ onnection cables Straight connector 3 m m 753 m 753 Power cables Ring terminal 5 m 753 Ring terminal m PT35Y TMS system is available for this model. For a complete installation order an STP pump (TMS), a controller, a TMS connection cable kit, a connection cable, and power cable is required. STP3V (TMS) ISO5F PTV66 DN5F PTV66 TMS connection cable kit 5 m PT35V m PT35V 5 m PT35V Polarizing groove Outlet port Polarizing boss ontroller

35 STP53 TURO PUMP Maximum nitrogen throughput 8 sccm Rated speed 7 rpm Starting time 9 min Mounting position ny Water cooling Flow l min - Temperature 5-5 º Pressure.9 x 5 Pa 3 kgf/cm - Recommended purge gas flow sccm Input voltage - V a.c. (±%) Typical power consumption.5 kv Weight Pump 7 kg ontroller kg The new O Edwards STP53 turbo pump has been designed to accommodate the high gas flows required by the next generation of semiconductor and thin film etch processes. The enhanced rotor design, half rack controller and battery free d.c. drive operation provide considerable space saving and class leading performance. The STP53 has been qualified on major 3 mm metal and poly etch processes. Features & benefits dvanced Rotor Design Increased performance Higher gas throughput High reliability Maintenance free Harsh process compatible 5 xis Magnetic Suspension System Zero contamination Low vibration orrosion Resistant Harsh process compatible Increased life ompact onstruction Small footprint Half rack controller dvanced ontroller Design Tuning free Self diagnostic functions d.c. motor drive attery-free operation TEHNIL DT Inlet flange ISO5F / DN5F Outlet port KF Purge port KF Water cooling fitting PT/ Pumping speed N 5 l s - H 6 l s - ompression ratio N > 8 H 6 x 3 Ultimate pressure -6 Pa Maximum allowable backing pressure 333 (.5) Pa (Torr) r N 3 H E D Ø3 7.5 Ø335 Ø333 Ø35 Ø6 Ø Ø8 35 x Ø Electrical connector D ooling water out Outlet port E ooling water in Purge port 7 38 ISO5F x M6 x 87 35SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

36 x Ø ontroller 3 Ø Ø335 ISO5F.5 5 Ø Ø L type connector 8 Ø7 8 x M6 x Ø D Ø8 7.5 Electrical connector Purge port Outlet port D ooling water port 7 87 PRODUT DESRIPTION STP pump is supplied with an inlet screen. For a complete installation order an STP pump, a controller, a connection cable and power cable from the information below. STP53 ISO5F inlet PT3GZ DN5F inlet PT3GZ ontroller - V 5/6 Hz RS3 PT3ZZ onnection cables Straight connector 3 m m 753 m 753 Power cables Ring terminal 5 m 753 Ring terminal m PT35Y TMS system is available for this model. For a complete installation order an STP pump (TMS), a controller, a TMS connection cable kit, a connection cable, and power cable is required. STP53V (TMS) ISO5F PT3963 DN5F PT396 TMS connection cable kit 5 m PT35V m PT35V 5 m PT35V Polarizing groove Outlet port Polarizing boss

37 STP33 TURO PUMP Maximum nitrogen throughput 8 sccm Rated speed 7 rpm Starting time 9 min Mounting position ny Water cooling Flow l min - Temperature 5-5 º Pressure.9 x 5 Pa 3 kgf/cm - Recommended purge gas flow sccm Input voltage - V a.c. (±%) Typical power consumption.5 kv Weight Pump 7 kg ontroller kg The new O Edwards STP33 turbo pump has been designed to accommodate the high gas flows required by the next generation of semiconductor and thin film etch processes. The enhanced rotor design, half rack controller and battery free d.c. drive operation provide considerable space saving and class leading performance. The STP33 has been qualified on major 3 mm metal and poly etch processes Features & benefits dvanced Rotor Design Increased performance Higher gas throughput High reliability Maintenance free Harsh process compatible 5 xis Magnetic Suspension System Zero contamination Low vibration orrosion Resistant Harsh process compatible Increased life ompact onstruction Small footprint Half rack controller dvanced ontroller Design Tuning free Self diagnostic functions d.c. motor drive attery-free operation TEHNIL DT Inlet flange ISO3F / DN3F Outlet port KF Purge port KF Water cooling fitting PT/ Pumping speed N 3 l s - H 8 l s - ompression ratio N > 8 H 6 x 3 Ultimate pressure with bake out heating -6 Pa Maximum allowable backing pressure 333 (.5) Pa (Torr) r N 3 He H 7 5 ISO3F E D 85 Electrical connector D ooling water out Outlet port E ooling water in Purge port 5 6 Ø395 Ø5 Ø333 Ø35 Ø6 Ø 7.5 Ø8 35 x Ø x M6 x 37SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

38 x Ø ontroller 3 Ø ISO3F Ø Ø333 Ø L type connector 8 Ø7 8 x M6 x Ø D Ø8 7.5 Electrical connector D ooling water out Outlet port E ooling water in Purge port 7 87 PRODUT DESRIPTION STP pump is supplied with an inlet screen. For a complete installation order an STP pump, a controller, a connection cable and power cable from the information below. STP33 ISO3F inlet 75 DN3F inlet PT3GZ3 ontroller - V 5/6 Hz with RS3 PT3ZZ onnection cables Straight connector 3 m m 753 m 753 Power cables Ring terminal 5 m 753 Ring terminal m PT35Y TMS system is available for this model. For a complete installation order an STP pump (TMS), a controller, a TMS connection cable kit, a connection cable, and power cable is required. STP33V (TMS) ISO3F PT396 DN3F PT396 TMS connection cable kit 5 m PT35V m PT35V 5 m PT35V Polarizing groove Outlet port Polarizing boss

39 STP353 TURO PUMP Maximum nitrogen throughput sccm Rated speed 55 rpm Starting time min Mounting position ny Water cooling Flow l min - Temperature 5-5 º Pressure.9 x 5 Pa 3 kgf/cm - Recommended purge gas flow 5 sccm Input voltage - V a.c. (±%) Typical power consumption.5 kv Weight Pump 79 kg ontroller kg NEW The new O Edwards STP353 turbo pump has been designed to accommodate the high gas flows required by the next generation of semiconductor and thin film etch processes. The enhanced rotor design, half rack controller and battery free d.c. drive operation provide considerable space saving and class leading performance. The STP353 has been qualified on major 3 mm metal and poly etch processes Features & benefits dvanced Rotor Design Increased performance Higher gas throughput High reliability Maintenance free Harsh process compatible 5 xis Magnetic Suspension System Zero contamination Low vibration orrosion Resistant Harsh process compatible Increased life ompact onstruction Small footprint Half rack controller dvanced ontroller Design Tuning free Self diagnostic functions d.c. motor drive attery-free operation TEHNIL DT Inlet flange ISO3F / DN3F Outlet port KF Purge port KF Water cooling fitting PT/ Pumping speed N 35 l s - H 6 l s - ompression ratio N > 8 H 3 x 3 Ultimate pressure with bake out heating -6 Pa Maximum allowable backing pressure 66 () Pa (Torr) r N 3 H x Ø Ø395 Ø5 Ø367.5 Ø39 Ø Ø5 ooling water port Outlet port STP cable connector D Purge port ISO3F x M6 x 8 x M6 x 3 D SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

40 NEW L type connector ontroller 9 Polarizing groove Outlet port Polarizing boss 8 7 PRODUT DESRIPTION STP pump is supplied with an inlet screen. For a complete installation order an STP pump, a controller, a connection cable and power cable from the information below. STP353 ISO3F inlet PT8Z3 DN3F inlet PT8Z ontroller - V 5Hz/6Hz with RS3 756 onnection cables Straight connector 3 m m 753 m 753 Power cables Ring terminal 5 m 753 Ring terminal m PT35Y TMS system is available for this model. For a complete installation order an STP pump (TMS), a controller, a TMS connection cable kit, a connection cable, and power cable is required. STP353V (TMS) ISO3F PT866 TMS connection cable kit 5 m PT35V m PT35V 5 m PT35V

41 STPF3 TURO PUMP Maximum nitrogen throughput 6 sccm Rated speed 7 rpm Starting time 7 min Mounting position ny Water cooling Flow l min - Temperature 5-5 º Pressure.9 x 5 Pa 3 kgf/cm - Recommended purge gas flow sccm Input voltage - V a.c. (±%) Typical power consumption.5 kv Weight Pump 6 kg ontroller kg NEW The new O Edwards STPF3 turbo pump has been designed to accommodate the high gas flows required by the next generation of semiconductor and thin film etch processes. The enhanced rotor design, half rack controller and battery free d.c. drive operation provide considerable space saving and class leading performance. The STPF3 has been qualified on major 3 mm dielectric processes Features & benefits dvanced Rotor Design Increased performance Higher gas throughput High reliability Maintenance free Harsh process compatible 5 xis Magnetic Suspension System Zero contamination Low vibration orrosion Resistant Harsh process compatible Increased life ompact onstruction Small footprint Half rack controller dvanced ontroller Design Tuning free Self diagnostic functions d.c. motor drive attery-free operation TEHNIL DT Inlet flange VG5 / ISO5F / DN5F Outlet port KF Purge port KF Water cooling fitting PT/ Pumping speed N l s - H l s - ompression ratio N > 8 H > 3 Ultimate pressure with bake out heating -6 Pa Maximum allowable backing pressure 5 () Pa (Torr) r N 3 H STP cable connector Outlet port Purge port Ø3 Ø96 Ø Ø35 x Ø SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

42 NEW L type connector PRODUT DESRIPTION STP pump is supplied with an inlet screen. For a complete installation order an STP pump, a controller, a connection cable and power cable from the information below. STPF3 VG5 inlet PT5-Z- ISO5F inlet all DN5F inlet all ontroller - V 5Hz/6Hz with RS3 PT5ZZ onnection cables Straight connector 3 m m 753 m 753 Power cables Ring terminal 5 m 753 Ring terminal m PT35Y Polarizing groove Outlet port Polarizing boss ontroller

43 NEW STPXH63 TURO PUMP The new O Edwards STPXH63 turbo pump has been designed specially for the applications that require light gas pumping performance. It achieved 5% better performance of H pumping speed and gas flow rate compare to the same size pumps. Its outstanding performance is best suitable for front line processed such as HDP VD or Low k Etch. The STPXH63 has been qualified on major HDP VD process. Features & benefits dvanced Rotor Design Increased performance Higher gas throughput High reliability Maintenance free Harsh process compatible 5 xis Magnetic Suspension System Zero contamination Low vibration orrosion Resistant Harsh process compatible Increased life ompact onstruction Small footprint Half rack controller dvanced ontroller Design Tuning free Self diagnostic functions d.c. motor drive attery-free operation TEHNIL DT Inlet flange ISO5F Outlet port KF Purge port KF Water cooling fitting PT/ Pumping speed N 3 l s - H 6 l s - ompression ratio N > 8 H 3 x Ultimate pressure with bake out heating -7 Pa Maximum allowable backing pressure 333 (.5) Pa (Torr) Maximum nitrogen throughput 8 sccm Rated speed 8 rpm Starting time 9 min Mounting position ny Water cooling Flow l min - Temperature 5-5 º Pressure.9 x 5 Pa 3 kgf/cm - Recommended purge gas flow sccm Input voltage - V a.c. (±%) Typical power consumption.5 kv Weight Pump 75 kg ontroller kg r N 3 H INLET PORT FLNGE Ø 8 x M6 x D Ø35 TMS heater cover D Outlet port TMS heater E Purge port TMS sensor F ooling water port Ø Ø87 Ø35 Ø36 VG E ISO5F F x M6 x SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

44 NEW L type connector PRODUT DESRIPTION STP pump is supplied with an inlet screen. For a complete installation order an STP pump, a controller, a connection cable and power cable from the information below. STPXH63 ISO5F inlet PT6Z ontroller - V 5Hz/6Hz with RS3 PT6ZZ onnection cables Straight connector 3 m m 753 m 753 Power cables Ring terminal 5 m 753 Ring terminal m PT35Y Polarizing groove Outlet port Polarizing boss ontroller

45 NEW STPXH33 TURO PUMP The new O Edwards STPXH33 turbo pump has been designed specially for the applications that require light gas pumping performance. It achieved 5% better performance of H pumping speed and gas flow rate compare to the same size pumps. Its outstanding performance is best suitable for front line processed such as HDP VD or Low k Etch. The STPXH33 has been qualified on major HDP VD process. Features & benefits dvanced Rotor Design Increased performance Higher gas throughput High reliability Maintenance free Harsh process compatible 5 xis Magnetic Suspension System Zero contamination Low vibration orrosion Resistant Harsh process compatible Increased life ompact onstruction Small footprint Half rack controller dvanced ontroller Design Tuning free Self diagnostic functions d.c. motor drive attery-free operation TEHNIL DT Inlet flange ISO3F Outlet port KF Purge port KF Water cooling fitting PT/ Pumping speed N 35 l s - H 9 l s - ompression ratio N > 8 H 3 x Ultimate pressure with bake out heating -7 Pa Maximum allowable backing pressure 333 (.5) Pa (Torr) Maximum nitrogen throughput 8 sccm Rated speed 8 rpm Starting time 9 min Mounting position ny Water cooling Flow l min - Temperature 5-5 º Pressure.9 x 5 Pa 3 kgf/cm - Recommended purge gas flow sccm Input voltage - V a.c. (±%) Typical power consumption.5 kv Weight Pump 85 kg ontroller kg r N 3 H * *D 5 *E *F 87 INLET PORT FLNGE VG3 Ø 8 x M6 x D Ø35 TMS heater cover D Outlet port TMS heater E Purge port TMS sensor F ooling water port Ø Ø35 Ø E ISO3F * 8 * 5 *D *E *F 76 8 *G 8 3 *H 335 *I *.5 *G F *H.5 *I x M6 x33 5SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

46 NEW L type connector PRODUT DESRIPTION STP pump is supplied with an inlet screen. For a complete installation order an STP pump, a controller, a connection cable and power cable from the information below. STPXH33 ISO3F inlet PT6Z3 ontroller - V 5Hz/6Hz with RS3 PT6ZZ onnection cables Straight connector 3 m m 753 m 753 Power cables Ring terminal 5 m 753 Ring terminal m PT35Y Polarizing groove Outlet port Polarizing boss ontroller

47 NEW SU75 ONTROL UNIT The O Edwards SU75 new turbo pump control unit is a fully digital controller, and has perfect compatibility for middle sized pumps. New VR (uto vibration reduction) technology achieves a further reduction in vibration levels, and the advanced pre-maintenance call function provides advanced notice of precise maintenance time. The reliability focused design, enhanced communication function, and perfect compatibility bring significant back up units savings and contributes to a reduction in total O. Features & benefits Universal ontroller Single controller is used for middle sized pumps. No requirement for different controllers for each pump type Service back up stocks will be reduced dvanced Pre-maintenance Function VR (uto Vibration Reduction) minimizes the rotate system vibration during acceleration. S (uto alancing System) Highest Reliability onforms to international safety standards E/UL/SEMI S ommunication Port Standardized RS3/RS85 communication ports are fitted as standard Dual communication ports enable simultaneous connection to remote control interface and O Edwards fabworks monitoring system pplicable Models STP63/3 series STPH3/H5 series STPH83/H33 series STP83/33 series STP63 series TEHNIL DT Magnetic bearing control system Digital control Input voltage - ± % V a.c. - ± % V a.c. Power onsumption Without TMS Max 85 V With TMS Max V Input frequency Hz 5/6± Hz Leak current Max 3.5 m Main reaker rated current Motor driving system Three phase D brush less motor driver llowable ambient temperature - Storage temperature Mass 8.5 kg TMS control unit uilt in Serial communication function RS3 Standard RS85 Standard Panel display LD ( characters, lines) PRODUT DESRIPTION STP63/3 series, STPH3/H5 series, STP83/33 series, and STP63 series. SU75 - V/- V RS3 PT56ZZ x Ø3.6 7SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

48 ESSORIES INLET VIRTION ISOLTOR 8 an be fitted for those applications where a vibration level less than. µm peak-to-peak is required. PRODUT DESRIPTION Inlet vibration isolator (match to inlet flange size) vailable models are STP3 series, STP5 series, STP63 series, STP3 series. ISO 586 DNF 6 inch F 783 ISO6 589 DN6F 8 inch F 765 ISO 586

49 SHIPPING KITS Shipping kits are available to protect pumps removed from process chambers for maintenance or servicing. These enable the pump to be purged and sealed in accordance with the manufacturer s recommendations and protect the pump during storage and transportation. These kits are available for the full range of O Edwards turbomolecular pumps. INLET FLNGE OUTLET FLNGE PURGE PORT SUITLE FOR USE WITH PUMPS ISOK NW5 N/ STP, STP3, STP3H, STP3, STPH 765 ISOF NW5 N/ STP, STP3, STP3, STPH 765 DNF NW5 N/ STP, STP3, STP3, STPH 765 VG NW5 N/ STP, STP3, STP3, STPH 7653 ISOK NW5 NW STP3, STP3, STPH 765 ISOF NW5 NW STP3, STP3, STP 7655 DNF NW5 NW STP3, STP3, STPH 7656 VG NW5 NW STP3, STP3, STPH 7657 ISOK NW NW STP3V, STP3V3, STPH ISOF NW NW STP3V, STP3V3, STPH DNF NW NW STP3V, STP3V3, STPH3 765 VG NW NW STP3V, STP3V3, STPH3 765 ISO6K NW5 N/ STPH3, STP, STP5 765 ISO6F NW5 N/ STPH3, STP, STP DN6F NW5 N/ STPH3, STP, STP5 765 VG6 NW5 N/ STPH3, STP, STP ISO6K NW5 NW STPH3, STP, STP ISO6F NW5 NW STPH3, STP, STP DN6F NW5 NW STPH3, STP, STP VG6 NW5 NW STPH3, STP, STP ISO6K NW NW STPH5, STP6, STP63, STPH6, STPH83, STP ISO6F NW NW STPH5, STP6, STP63, STPH6, STPH83, STP DN6F NW NW STPH5, STP6, STP63, STPH6, STPH83, STP VG6 NW NW STPH5, STP6, STP63, STPH6, STPH83, STP ISOK NW N/ STP, STP3 765 ISOF NW N/ STP, STP S 6 NW N/ STP, STP DNF NW N/ STP, STP VG NW N/ STP, STP ISOK NW NW STP, STP3, STPH 7659 ISOF NW NW STP, STP3, STPH, STPH75E, STPH3L()(), STPH33, STPH33V, STP S 6 NW NW STPH 7653 DNF NW NW STP, STP3, STPH 7653 VG NW NW STP, STP3, STPH, STPH33, STP ISO5F NW NW STP, STPH, STPH, STP, STPH, STPH, STP, STP3V 7653 ISO5F NW STP3PV VG5 NW NW STP, STPHO, STP, STPH, STPH, STP, STP SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

50 ih, if, il, L, IPX ND EPX DRY PUMPS ND ESSORIES These are a new range of dry pumps for the semiconductor industry. ih DRY PUMPS if8 DRY PUMP The if8 is the optimal solution for the demanding load lock pump down requirements of flat panel display process tools. uilding on the proven quality and reliability of O Edwards products, the if8 delivers improved pumping performance, the capability to achieve shorter load lock cycle times and increased tool throughput. Features & benefits Rapid loadlock pump down saves vital seconds High reliability on high frequency cycling applications Interfaces available for all process tools 5 The ih pumps provide high reliability coupled with low cost of ownership for difficult processes such as etch, PEVD and LPVD used for silicon wafer and flat panel display manufacturing. Features & benefits Robust, heavy duty pump mechanism optimized for particulate and by-product High operating temperature prevents condensation ompact, efficient design with small footprint and high pumping speed Low cost of ownership omply with E, SEMI S and UL ih8 and ih6 The ih8 and ih6 have been added to the range of ih Dry Pumps to meet the high flow rate pumping requirements of 3 mm Semiconductor and Flat Panel Display processes, offering peak pumping speeds of 8 m 3 h - and 6 m 3 h - respectively. s with other ih pumps in the product range, these new additions offer proven high reliability and low cost of ownership for difficult processes such as etch, PEVD and LPVD where particulate, condensable and corrosive by-products are present. il DRY PUMPS The il is specifically designed for clean processes to give very low cost of ownership and exceptional reliability, requiring zero periodic maintenance between rebuilds. With their quiet operation, small footprint and high pump speeds, they are ideally suited to loadlock, transfer chamber, PVD, SEM and similar duties. The iln variants include shaft seal nitrogen purging and are designed for light duty applications such as dielectric etch. Features & benefits Low cost of ownership, with no nitrogen (il), low power and low consumption of cooling water ompact, efficient design, with small footprint and high pumping speeds High reliability, resulting in low service costs omply with E, SEMI S, and UL

51 L7 DRY PUMP The L7 is a simple low cost dry pump specifically designed for clean loadlocks and similar applications. Features & benefits Low cost of ownership, with no nitrogen, low power and low consumption of cooling water Simple control omplementary to the ih range of pumps is the new il range of pumps specifically engineered for lowest cost of ownership on clean, light duties. The il pumps share many of the design features of the ih range (specifically long service life) coupled with a design which optimizes clean performance with minimized utility consumption. novel seal and shaft design allows operation without nitrogen for these duties. Refer to the information in this table to select either the ih or the il pumps for your application. The table also shows recommendations for the exhaust management options to use. ih ND il PUMPS: PPLITIONS INFORMTION The above shows the Zenith integrated pump and abatement system featuring two ih pumps. The new range of O Edwards ih dry pumps are specifically designed for the harshest of semiconductor processes. For these applications, pumps like the ih that operate at high temperature are an advantage. In addition, the ih pumps have specially enhanced particulate handling capability. ih pumps are designed for long service life and highly efficient use of utilities like cooling water, nitrogen and power. With very small footprint and pumping speeds enhanced for the latest processes, they form the optimum choice for low cost of ownership in demanding service. PROESS ih iln il EXHUST MNGEMENT LPVD nitride Water ooled Trap and TMS and GR LPVD others GR or TPU PEVD nitride TMS, and GR or TPU PEVD Others TMS, and GR or TPU Etchers Metal TMS and GR Other GR Ion implant Strippers and ashers Transfer chambers (dirty) Transfer chambers (clean) Load lock PVD Sputtering SEM First choice Second choice TMS = Temperature Management System GR = Gas Reactor olumn TPU = Thermal Processing Unit 5SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

52 ih8 ND ih6 DRY PUMPS 3 m 3 h ih6 3 mbar Pa 6 Hz ih6 5 Hz ih6 3 5 TEHNIL DT 3 - ft min Peak speed m 3 h - 86 ft 3 min - 5 Ultimate vacuum mbar Torr Typical shaft-seal nitrogen flow (slm) Typical cooling-water flow l h - With shaft-seal purge only t 5 psi pressure drop ih8 ih6 5 Hz 6 Hz 5 Hz 6 Hz x - x - x -3 7 x -.3 x x -3.5 x x - l min - Power input at vacuum (kw) Rated motor power (kw) Oil capacity (l) Inlet connection ISO63 ISO Outlet connection NW NW Weight (kg) 5 m 3 h Torr 3 6 Hz ih6 5 Hz ih6 6 Hz ih8 5 Hz ih8 ih6 ih mbar Pa ft min Torr 6 Hz ih8 5 Hz ih8 ih8

53 ih6 (8.7) 663 (6.) 63 (.8) The ih dry pumps consist of: fully enclosed 5 stage dry pump with water-cooled motor, electrics and sensor control, gas system, facility for communication and control links for accessories and process tools, and pump display terminal. In addition, the ih6 has a direct-drive mechanical booster pump. ih8 8 (3.8) 59 (.83) 39 (5.35) (5.35) 68 (.68) (.68) 93 (3.66) 95 (7.68) 66 (6.) 79 (3.8) 95 (36.) 3 (.36) Inlet Outlet 3 ir-extraction port 95 (7.68) (5.55) 3 3 (5.8) Inlet Outlet 3 ir-extraction port 3 73 (8.7) 8 66 (6.) (3.3) 78 (3.75) 96 (36.6) 3 (.) 3 (.) 95 (3.7) 8 (.89) 839 (33.3) 56 (.7) PRODUT DESRIPTION For information about ih accessories, see page -6. ih8 dry pump /8 V 5/6 Hz V 6 Hz /5 V 5 Hz V 6 Hz ih6 dry pump /8 V 5/6 Hz V 6 Hz /5 V 5 Hz V 6 Hz SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

54 ih DRY PUMP 3 min 3 ft Hz 5 Hz ih 3 Torr 663 (6.) 63 (.8) 5 TEHNIL DT 599 (3.58) (8.7) 5 (8.7) Typical shaft-seal nitrogen flow slm Inlet connection ISO Outlet connection NW Typical cooling-water flow l h - l min - Oil capacity.65 l Weight kg Peak speed m 3 h - 95 ft 3 min - 56 Ultimate vacuum mbar. x -3 Torr t 5 psi pressure drop With shaft-seal purge only 5 Hz 6 Hz x x -. x -3 Power input at vacuum (kw) Rated motor power (kw) (3.8) 68 (.68) 39 (5.35) 95 (7.68) (6.) (3.66) 79 (3.8) 95 (36.) 3 3 (.36) 3 (.) 8 (.89) 839 (33.3) 99 (39.6) m 3 h Hz 5 Hz ih mbar Pa Inlet Outlet 3 ir-extraction port Inverter The ih dry pump consists of: fully enclosed 5 stage dry pump with water-cooled motor, direct-drive mechanical booster pump, electrics and sensor control, gas system, facility for communication and control links for accessories and process tools, and pump display terminal. PRODUT DESRIPTION For information about ih accessories, see page -6. ih dry pump /8 V 5/6 Hz V 6 Hz /5 V 5 Hz V 6 Hz

55 ih8, ih8htx ND ih6 DRY PUMP 3 3 min - ft ih8 & ih8htx, 6Hz Torr 65 (5.75) 67 (6.5) 3 (3.39) 6 (5.) 385 (5.6) 5 The ih8 has been designed specifically for high throughput applications in the 3 mm and flat panel display markets. This pump combines quality and reliability based on years dry pumping experience. The ih8 provides low power consumption minimizing environmental impact and running costs. Features & benefits Low power consumption Small footprint Proven reliability from years of experience onforms to international standards TEHNIL DT ih8, ih6 ih8htx Typical shaft-seal nitrogen flow slm slm Inlet connection ISO6 ISO63 bolted Outlet connection NW NW Typical cooling-water flow l h - l min - Oil capacity.6 l.85 l Weight 5 kg 5 kg Peak speed m 3 h ft 3 min l min Ultimate vacuum mbar x -3 - Torr 7.5 x - - Power input at vacuum (kw). 3. Rated motor power (kw) With shaft-seal purge only - 3 m h 3 kw (3.57) 7 (8.5) 35 (9.5) 3 (.5) 5 (5.9) Inlet Outlet 3 lternative outlet ir-extraction port 5 Inverter (6.) 67 (.) 5 33 (3.5) ih6 885 (3.8) (8.3) 3 mbar 55SEMIONDUTOR PUMPS ND EXHUST MNGEMENT Pa ih8 & ih8htx, 5Hz 3 mbar Pa

56 3-3 m h ih mbar Pa 5 (5.7) 73 (8.6) (.83) 58 (.39) 6 (.5) 3 3 (.) 78 (3.7) 3.7 (.87) 66.3 (6.) 785 (3.9) 9 (36.) Ø5 Ø5 Ø (5.35) 95 (7.68) 5 (.3) 95(3.7) 5 (7.76) 77 (8.78) 39 (7.8) 3 (5.8) 5 (5.9) Inlet Inverter 3 Outlet ir-extraction port PRODUT DESRIPTION For details of ih6 please contact O Edwards. ih8 dry pump /8 V, 5/6 Hz V, 6 Hz /5, 5/6 Hz V, 6 Hz ih8htx dry pump /8 V, 5/6 Hz V, 6 Hz /5, 5/6 Hz V, 6 Hz 53398

57 if8 DRY PUMP 3 3 m h - if mbar Pa 6 Hz 5 Hz 3 - ft min 3 The if8 is the optimal solution for the demanding load lock pump down requirements of flat panel display process tools. uilding on the proven quality and reliability of O Edwards products, the if8 delivers improved pumping performance, the capability to achieve shorter load lock cycle times and increased tool throughput. Features & benefits Rapid loadlock pump down saves vital seconds High reliability on high frequency cycling applications Interfaces available for all process tools TEHNIL DT Typical gas ballast flow 59 slm Inlet connection ISO6 Outlet connection NW Typical cooling-water flow 36 l h - / 6 l min - Weight 585 kg Peak speed m 3 h - ft 3 min - l min - Ultimate vacuum mbar Torr t psi pressure drop With shaft-seal purge only 5 Hz 6 Hz x - 8 x - 6 x x - Power input at ultimate (kw) (35.55) (3.57) 7 (8.5) 6 Hz 5 Hz (3.5) (9.5) 3 6 (.7) 87 (9.7) 3 3 Inlet Outlet 3 lternative outlet ir-extraction port 73 (6.8) 93 (36.69) 9 (35.87) 37 (5.6) if Torr (3.5) 889 (35.) 57SEMIONDUTOR PUMPS ND EXHUST MNGEMENT PRODUT DESRIPTION if8 dry pump /8 V 5/6 Hz V 6 Hz

58 L7 DRY PUMP 3 - ft min Hz 5 Hz L7 3 Torr 7 73 (8.7) (.85) 58 TEHNIL DT Peak speed m 3 h - 7 ft 3 min - Ultimate vacuum mbar Torr 5 Hz 6 Hz x - 3 x x -.3 x - Typical shaft-seal nitrogen flow slm Inlet connection ISO63 ISO63 Outlet connection NW NW Typical cooling water flow at 3 psi pressure drop l min -.5 l h Power input at ultimate (kw).3.5 Rated motor power (kw).8. Oil capacity (l) Weight (kg) 55 (.69) 377 (.8) 5 (7.7) 89 (7.) (.83) 69 (.76) 67 (6.) 3 65 (6.5) Inlet Outlet 3 Extractor Fan Port 36 (9.9) m 3 h - 3 The L7 system includes as standard: optimally designed 5 stage dry pump for clean applications with enclosed, water cooled motors. PRODUT DESRIPTION L7 dry pump /3V, 5/6 Hz L7 3 mbar Hz 5 Hz Pa

59 il7, il7n, il6, il6n DRY PUMPS 3 3 min - ft - il7/il7n Torr 6 Hz il7/il7n 5 Hz il7/il7n 3 TEHNIL DT Peak speed m 3 h - 7 ft 3 min - Ultimate vacuum mbar Torr With shaft-seal purge only t 5 psi pressure drop il7/il7n il6/il6n 5 Hz 6 Hz 5 Hz 6 Hz Hz il7/il7n 5 Hz il7/il7n x - 3 x - 3 x -3 x x -.3 x -.3 x -3.5 x -3 Typical shaft seal nitrogen flow (slm) / / Typical cooling-water flow l h - l min Power input at vacuum (kw) Rated motor power (kw) Oil capacity (l).75.5 Inlet connection ISO63 ISO Outlet connection NW NW Weight (kg) 3 5 m 3 h il7/il7n 3 mbar Pa m 3 h - ft 3 min il7/7n Hz il6/il6n 5 Hz il6/il6n 6 Hz il6/il6n 5 Hz il6/il6n il6/il6n mbar il6/il6n Torr (.83) 68 (.68) (5.55) 3 73 (8.7) 8 66 (6.) (3.3) 78 (3.75) Pa 59SEMIONDUTOR PUMPS ND EXHUST MNGEMENT 39 (5.35) 95 (7.68) 95 (3.7) 96 (36.6) 3 (.) 56 (.7) 3 (5.8) Inlet Outlet 3 ir-extraction port

60 il6/6n 95 (36.) 663 (6.) (8.6) 63 (.8) 839 (33.3) 8 (3.38) 3 (.) 6 39 (5.35) 93 (3.66) 95 (7.68) 66 (6.) 79 (3.8) 3 Inlet Outlet 3 ir-extraction port The il dry pumps consist of: fully enclosed 5 stage dry pump with water-cooled motor, electrics and sensor control, gas system, facility for communication and control links for accessories and process tools. In addition, the il6 has a direct-drive mechanical booster pump. PRODUT DESRIPTION For information about il accessories, see page -6. il7 dry pump /8 V 5/6 Hz V 6 Hz /5 V 5 Hz V 6 Hz il7n dry pump /8 V 5/6 Hz V 6 Hz /5 V 5 Hz V 6 Hz il6 dry pump /8 V 5/6 Hz V 6 Hz /5 V 5 Hz V 6 Hz il6n dry pump /8 V 5/6 Hz V 6 Hz /5 V 5 Hz V 6 Hz

61 ih ND il ESSORIES ih TIVE GUGE KIT il PUMP DISPLY TERMINL Use the Pump Display Terminal to operate the il system manually and to display the status of the il system llows the ih system to monitor the pump inlet pressure with a O Edwards ctive gauge. ctive gauge and cables not included, see page -3. PRODUT DESRIPTION Pump Display Terminal D3778 PRODUT DESRIPTION ih ctive gauge kit D37 ih/il OMMUNITIONS MODULE llows your process tool or P-based software to control and monitor the ih or il system through a serial or parallel port. PRODUT DESRIPTION ih/il communications module Serial communication only Serial and parallel communications/control Parallel control only TOOL INTERFE MODULE The Tool Interface Module allows enhanced control of the ih or il system through your OEM process tool. PRODUT DESRIPTION FWORKS D373 D3735 D3736 We have a range of tool interface modules available. Please contact O Edwards for more information. Extension cable m D m D m D37759 EMO 3 m D m D m D m D m D3776 llows you to network together all the intelligent dry pumps and exhaust gas management systems in your installation. Each FabWorks central monitoring system is specified and built for your particular installation. Please contact O Edwards for more information. 6SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

62 IPX DRYPUMPS The IPX series of drypumps were specifically designed to meet the demanding requirements placed on advanced semiconductor process tool vacuum systems. In times when space is at a premium, the IPX range of drypumps replaces conventional multiple pump systems with a single pump that can be mounted on the tool to minimize footprint. 6 Features & benefits Unique pumping mechanism - the IPX can pump down from atmosphere to TMP base pressure and can operate continuously at all inlet pressures. lean bearing system - conventional high vacuum bearings use grease lubrication which can be a source of contamination in process tools. IPX pumps have no high vacuum bearings and present no other source of contamination. Extremely reliable - field proven reliability with MTFp = 3 years (SEMI E) with service periods of around 5 years. Flexible mounting options - the IPX range can be integrated into the tool which saves space or they can be installed remotely wherever is most convenient. Network compatible - all IPX pumps can be ordered with net which enables them to be connected to a Fab-Wide network.

63 IPX DRY PUMP Power at ultimate (kw). Rated motor power (kw) 3.3 Oil capacity (l).3 Weight (kg) 55 Gas module available on request 3 3 m h IPX - 3 mbar IPX is an innovative concept in next generation pumping. s the first point of use pump to be integrated onto process tool platforms, it has established a proven track record for extremely high performance and reliability. It is in widespread use for pumping load locks on the advanced 3 mm process tools offering rapid pump down from atmosphere to less than x -3 Torr. Features & benefits Innovative pumping mechanism Robust design Extremely clean vacuum No high vacuum bearings Low noise and vibration ompact construction leanroom compatible Lightweight Small footprint Low cost of ownership Sub-fab space saving No vacuum foreline No nitrogen Low power and cooling water High reliability MTFp = 3 years (SEMI E) Zero periodic maintenance Low service costs TEHNIL DT IPX Peak speed m 3 h - ft 3 min - 59 Ultimate vacuum mbar Torr <5 x -3 <3.7 x -3 Typical shaft seal nitrogen flow (slm) Inlet connection NW Outlet connection NW5 Noise d() <59 Typical cooling-water l h - ( l min - ) Pa 36.5 (.3) 75 (6.89) (8.66) 3 Pump inlet ooling water outlet 3 ooling water inlet Pump outlet 5 Fixing hole: 8 x Ø. (.) PRODUT DESRIPTION 6 (8.5) 6 38 (.3) 8 (.8) 73 (6.8) (5.59) (.33) IPX /8 V, 5/6 Hz 9977 V, 5/6 Hz (3.66) 5 (.55) (7.87) 63SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

64 IPX DRY PUMP Power at ultimate (kw). Rated motor power (kw) 3.3 Oil capacity (l).3 Weight (kg) 55 Gas module available on request 3 3 m h IPX - 3 mbar 6 IPX is an innovative concept in next generation pumping. Integrated onto process tool platforms, it has established a proven track record for extremely high performance and reliability. It is in widespread use for pumping load locks on the advanced 3 mm process tools offering rapid pump down from atmosphere to less than x -3 Torr. IPX differs from IPX in the orientation of the electrical boxes. Features & benefits Innovative pumping mechanism Robust design Extremely clean vacuum No high vacuum bearings Low noise and vibration ompact construction leanroom compatible Lightweight Small footprint Low cost of ownership Sub-fab space saving No vacuum foreline No nitrogen Low power and cooling water High reliability MTFp = 3 years (SEMI E) Zero periodic maintenance Low service costs TEHNIL DT IPX Peak speed m 3 h - ft 3 min - 59 Ultimate vacuum mbar Torr <5 x -3 < x -3 Typical shaft seal nitrogen flow (slm) Inlet connection NW Outlet connection NW5 Noise d() 56 Typical cooling-water l h - ( l min-) Pa 3 (.33) (.33) Pump inlet ooling water outlet 3 ooling water inlet Pump outlet 5 Fixing hole: 8 x Ø. (.) PRODUT DESRIPTION 5 (.97) 5 (.3) (8.3) 38 (.3) IPX /8 V, 5/6 Hz 9977 V, 5/6 Hz (.85) 8 (.8) (5.59) 75 (6.89) (5.67) 5 (.3) 37 (3.66) 36.5 (.3) 5 (7.87) 5 (.55)

65 IPX8 DRY PUMP Power at ultimate (kw). Rated motor power (kw) 3.3 Oil capacity (l).3 Weight (kg) 55 Gas module available on request 8 6 IPX8-3 m h mbar Pa -3-3 IPX8 is a new vacuum pump designed for use on low pressure load lock and transfer chamber applications. Its innovative pumping mechanism is unique in pumping from atmospheric pressure and achieve inlet pressures of less than 7.5 x -5 Torr. The pump can operate continuously at any inlet pressure and exhausts to atmospheric pressure. leanroom compatibility means the pump can be located close to the process tool. Features & benefits Innovative pumping mechanism Robust design Extremely clean vacuum No high vacuum bearings Low noise and vibration ompact construction leanroom compatible Lightweight Small footprint Low cost of ownership Sub-fab space saving No vacuum foreline No nitrogen Low power and cooling water High reliability MTFp = 3 years (SEMI E) Zero periodic maintenance Low service costs TEHNIL DT IPX8 Peak speed m 3 h - 8 ft 3 min - 6 Ultimate vacuum mbar Torr < x - <7.5 x -5 Typical shaft seal nitrogen flow (slm) Inlet connection ISO63 Outlet connection NW5 Noise d() 56 Typical cooling-water l h - ( l min - ) 3 5 (.33) (.33) Pump inlet ooling water outlet 3 ooling water inlet Pump outlet 5 Fixing hole: 8 x Ø. (.) PRODUT DESRIPTION (.97) 5 (.3) (8.3) 38 (.3) IPX8 /8 V, 5/6 Hz 9977 V, 5/6 Hz (.85) 8 (.8) (5.59) 75 (6.89) (5.67) 5 (.3) 37 (3.66) 36.5 (.3) 5 (7.87) 5 (.55) 65SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

66 IPX5 DRY PUMP Noise d() 56 Typical cooling-water l h - ( l min - ) Power at ultimate (kw). Rated motor power (kw) 3.3 Oil capacity (l).3 Weight (kg) 58 Gas module available on request 66 IPX5 is a new vacuum pump designed for use on low pressure load lock, transfer and light process chamber applications. IPX5 provides the same performance as a small turbomolecular and backing pump combination in a single package. Its innovative pumping mechanism is unique in pumping from atmospheric pressure and achieve inlet pressures of less than 7 x -7 Torr. The pump can operate continuously at any inlet pressure and exhausts to atmospheric pressure. leanroom compatibility means the pump can be located close to the process tool. Features & benefits Innovative pumping mechanism Robust design Extremely clean vacuum No high vacuum bearings Low noise and vibration ompact construction leanroom compatible Lightweight Small footprint Low cost of ownership Eliminates secondary pumps Sub-fab space saving No vacuum foreline No nitrogen Low power and cooling water High reliability MTFp = 3 years (SEMI E) Zero periodic maintenance Low service costs TEHNIL DT IPX5 Peak speed m 3 h - 5 ft 3 min - 95 Ultimate vacuum mbar Torr < x -6 <7.5 x -7 Typical shaft seal nitrogen flow (slm) Inlet connection ISO6 Outlet connection NW5-3 m h Pump inlet ooling water outlet 3 ooling water inlet Pump outlet 5 Fixing hole: 8 x Ø. (.) PRODUT DESRIPTION IPX mbar (.33) (.33) (.97) 5 (.3) (8.3) 38 (.3) 5 Pa IPX5 /8 V, 5/6 Hz 9977 V, 5/6 Hz (.85) 8 (.8) (5.59) 75 (6.89) (5.67) 5 (.3) 37 (3.66) 36.5 (.3) 5 (7.87) 5 (.55)

67 EPX HIGH VUUM DRYPUMPS The new compact EPX8 high vacuum drypump offers enhanced performance with reduced cost of ownership. Using a unique patent protected mechanism the EPX8 is capable of pumping from atmosphere to ultimate pressures of <7 x -5 Torr. ased on the successful award winning IPX range, the modular EPX8 offers outstanding performance in a package that is % lighter, 3% smaller and requires % less power than the IPX. EPX PPLITIONS SUMMRY The EPX series covers a broad range of applications from wafer handling through to medium duty processes. The EPX L Series has been designed for use in clean applications in which a non-corrosive and non-particulate forming environment is used. The EPX N Series include a gas module that provides Nitrogen purge extending the application range to medium processes in which low levels of corrosive vapors and particulates are expected. summary of the recommended process range of EPX is shown below. IPX is also shown for reference. Features & benefits ompact footprint - as one of the smallest on-tool pumps available, the EPX offers outstanding savings in footprint. EPX can be mounted directly onto the tool saving foreline and installations costs or remotely if preferred. Low cost of ownership - EPX requires only. kw of power and incorporating idle mode to maximize power efficiency. Unique patent protected pumping mechanism - the EPX can pump down from atmosphere to turbomolecular base pressure and can operate continuously at all inlet pressures. Ultra clean mechanism - conventional high vacuum bearings under grease use grease lubrication which can be a source of contamination in process tools. EPX pumps have no high vacuum bearings under grease and present no other source of potential contamination. Extremely reliable - based on field proven IPX technology, the EPX has a MTFp = 3 years (SEMI E) with service periods of around every 5 years to maximize the life of the pump. Network compatible - available with End User ontrol the EPX series can be connected to a fab-wide network for diagnostic monitoring and control. If the process you are interested in is not shown on the above summary please contact your nearest O Edwards sales office for further information. 67SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

68 EPX8L HIGH VUUM DRYPUMP EPX5L HIGH VUUM DRYPUMP 68 The EPX8L is designed for clean duty load lock and transfer applications. Features & benefits Patent protected mechanism Low ultimate pressure Low vibration High reliability Low service costs Zero periodic maintenance hoice of L and N versions EPX8L for clean duty EPX8N for light duty Low cost of ownership Low power only. kw Sub fab space savings Idle mode ompact unit Point of use or remote installation Lightweight Small footprint TEHNIL DT The EPX5L is designed for clean duty load lock and transfer applications. Features & benefits Patent protected mechanism Low ultimate pressure Low vibration High reliability Low service costs Zero periodic maintenance hoice of L and N versions EPX5L for clean duty EPX5N for light duty Low cost of ownership Low power only. kw Sub fab space savings Idle mode ompact unit Point of use or remote installation Lightweight Small footprint TEHNIL DT Peak speed m 3 h - ft 3 min - l min - Ultimate vacuum mbar Torr Pa EPX8L < x - <7.5 x -5 < x - Typical shaft seal nitrogen flow (slm) Inlet connection ISO63 Outlet connection NW5 Noise d() <59 Typical cooling-water l h - 3 (5 l min - ) Power at ultimate (kw). Rated motor power (kw) 3. Weight (kg) 3.5 For EPX8L - Use EPX5N for light to medium duty applications. See Page -67 for summary. PRODUT DESRIPTION For information about how to order a EPX8L High Vacuum Drypump, see page -69. Peak speed m 3 h - ft 3 min - l min - Ultimate vacuum mbar Torr Pa EPX5L < x -6 <7.5 x -7 < x - Typical shaft seal nitrogen flow (slm) Inlet connection ISO6 Outlet connection NW5 Noise d() <59 Typical cooling-water l h - 3 (5 l min - ) Power at ultimate (kw). Rated motor power (kw) 3. Weight (kg) 5. For EPX5L - Use EPX N series for light to medium duty applications. See page -67 for summary. PRODUT DESRIPTION For information about how to order a EPX5L High Vacuum Drypump, see page -69.

69 EPX HIGH VUUM DRYPUMPS ORDER MTRIX EPX is a configured product. Use the matrix below to choose the correct part number for the configuration you require. Speed pplication L N 3 LE TIM None 3 SPI 3 E73 TEL 5 LM 6 Hitachi 7 MM Water None 3/8" Quick /" Quick 3 9/6" JI Voltage 8 V V 9 If you are unsure of the correct configuration of EPX you require for your application, please contact your nearest O Edwards sales office for help. 69SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

70 iqdp ND iqdp8 DRY PUMPS 7 TEHNIL DT Maximum continuous inlet pressure Typical shaft-seal nitrogen flow Warm-up time Outlet connection Oil capacity Peak speed m 3 h - ft 3 min - 6 Displacement m 3 h - 5 ft 3 min Ultimate vacuum mbar Torr Inlet connection x 3 mbar 7 slm 5 min NW. l With shaft-seal purge only For lower exhaust gas temperatures, increased flow is required. 3 Exhaust gas temperature 5 º Exhaust gas temperature 5 º iqdp iqdp8 5 Hz 6 Hz 5 Hz 6 Hz x - 3 x - 3 x - x x -.3 x -.3 x x -3 ISO bolted Typical cooling-water flow l h US gal min -.6 ISO63 bolted 5.55 Power input at vacuum (kw) Rated motor power (kw).. Weight (kg) (3.5) 39 (5.35) 95 9 (7.68) (.35) D E F iqdp iqdp The pumps listed below are standard configurations, recommended for the types of applications listed. To order other pump configurations, use the iq ordering matrix: see page -79. PRODUT DESRIPTION 57 (.75) 39 (.7) iq 8H for semiconductor processes 8 V 6 Hz iq 5 V 5 Hz iq7 iq for clean processes 8 V 6 Hz iq3 5 V 5 Hz iq37 iq 8 for clean processes 8 V 6 Hz iq3 5 V 5 Hz iq37 iq 8H is recommended for semiconductor processes like VD and etch. The configuration consists of: iqdp8, 3-ph, harsh duty gas module and pump display module. iq and iq8 are recommended for clean processes like load lock, transfer chambers and PVD. The configuration consists of: iqdp or iqdp8 pump, 3-ph, clean duty gas module and pump display module. E D F m 3 h - iqdp, 5Hz mbar Pa 3 5 Pump speed with shaft-seal purge only. 5 Hz iqdp8 5 Hz iqdp iqdp8 ft 3 min - iqdp iqdp, 6Hz Torr

71 iqdp/iqm5f ND iqdp8/iqm5f DRY PUMP SYSTEMS TEHNIL DT 3 iqdp8/iqm5 Maximum continuous inlet pressure Typical shaft-seal nitrogen flow Warm-up time Inlet connection Outlet connection Oil capacity iqdp pump iqm5f, coupling cover iqm5f, shaft-seal reservoir mbar 7 slm 5 min ISO63 bolted NW. l.5 l.3 l ft 3 min - -3 iqdp/iqm5 - - iqm5, 6Hz 3 Torr Peak speed m 3 h - 35 ft 3 min - 39 Displacement m 3 h - 3 ft 3 min - 8 Ultimate vacuum mbar Torr Typical cooling-water flow l h - 5 US gal min -.99 Power input at vacuum (kw) iqdp pump iqm5f Rated motor power (kw) iqdp pump iqm5f Weight (kg) Direct mounted Frame mounted iqdp/iqm5f iqdp8/iqm5f 5 Hz 6 Hz 5 Hz 6 Hz With shaft-seal purge only Exhaust gas temperature 5. For lower exhaust gas temperatures, increased flow is required. m 3 h Pump speed with shaft-seal purge only. 5 Hz iqdp8/iqm5 5 Hz iqdp/iqm x -3 x -3 x -3 7 x -.9 x -3.5 x -3.5 x x iqm5, 5Hz Pa 3 mbar Direct mounted 95 (7.68) D E iqdp/iqm5f iqdp8/iqm5f Electrics module mounted horizontally. With the electrics module mounted vertically, this height is 78 mm. Frame mounted (.57) (9.9) 6 6 (.) (.) (.3) (5.39) 99 (38.98) 3 (.36) D D E F iqdp/iqm5f iqdp8/iqm5f E E F D 967 (38.7) 7SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

72 The systems listed below are standard configurations, recommended for the types of applications listed. To order other systems, use the iq ordering matrix: see page -79. PRODUT DESRIPTION iq 5H for semiconductor processes 8 V 6 Hz iq55 5 V 5 Hz iq557 iq 5 for clean processes 8 V 6 Hz iq535 5 V 5 Hz iq5357 iq 5H is recommended for semiconductor processes like VD and etch. The system consists of: iqdp8 and iqm5f pumps, 3-ph, fully enclosed, harsh duty gas module and pump display module. iq 5 is recommended for clean processes like load lock, transfer chambers and PVD. The system consists of: iqdp8 and iqm5f pumps, 3-ph, fully enclosed, clean duty gas module and pump display module. 7

73 iqdp/iqm5f ND iqdp8/iqm5f DRY PUMP SYSTEMS 3 TEHNIL DT Maximum continuous inlet pressure Typical shaft-seal nitrogen flow Warm-up time Inlet connection Outlet connection Oil capacity iqdp pump iqm5f, coupling cover iqm5f, shaft-seal reservoir mbar 7 slm 5 min ISO bolted NW. l.5 l.3 l ft min iqdp/iqm5f iqdp8/iqm5f iqm5f, 6Hz 3 Tor Peak speed m 3 h - 35 ft 3 min - 7 Displacement m 3 h - 55 ft 3 min - 99 Ultimate vacuum mbar Torr Typical cooling-water flow l h - 5 US gal min -.99 Power input at vacuum (kw) iqdp pump iqm5f Rated motor power (kw) iqdp pump iqm5f Weight (kg) Direct mounted Frame mounted iqdp/iqm5f iqdp8/iqm5f 5 Hz 6 Hz 5 Hz 6 Hz With shaft-seal purge only Exhaust gas temperature 5 º. For lower exhaust gas temperatures, increased flow is required. m 3 h Pump speed with shaft-seal purge only. 5 Hz iqdp8/iqm5f 5 Hz iqdp/iqm x -3 x -3 x -3 7 x -.9 x -3.5 x -3.5 x x iqm5f, 5Hz mbar Pa Direct mounted 95 (7.68) D iqdp/iqm5f iqdp8/iqm5f For this pump combination, the center of the check-valve extends 7 mm beyond the end of the iqm pump-motor. Frame mounted (.57) (9.9) 6 6 (.) (.) 8.5 D 79 (.3) (7.5) 99 (38.98) 3 (.36) D E iqdp/iqm5f * iqdp8/iqm5f For this pump combination, the center of the check-valve extends 6.5 mm beyond the end of the iqm pump-motor. D 89 (35.) E 98 (37.3) 73SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

74 The systems listed below are standard configurations, recommended for the types of applications listed. To order other systems, use the iq ordering matrix: see page -79. PRODUT DESRIPTION iq 5H for semiconductor processes 8 V 6 Hz iq65 5 V 5 Hz iq657 iq 5 for clean processes 8 V 6 Hz iq635 5 V 5 Hz iq6357 iq 5H is recommended for semiconductor processes like VD and etch. The system consists of: iqdp8 and iqm5f pumps, 3-ph, fully enclosed, harsh duty gas module and pump display module. iq 5 is recommended for clean processes like load lock, transfer chambers and PVD. The system consists of: iqdp8 and iqm5f pumps, 3-ph, fully enclosed, clean duty gas module and pump display module. 7

75 iqdp8/iqmf DRY PUMP SYSTEM TEHNIL DT Maximum continuous inlet pressure mbar Typical shaft-seal nitrogen flow 7 slm Warm-up time 5 min Inlet connection ISO6 bolted Outlet connection NW Oil capacity iqdp pump. l iqmf, coupling cover. l iqmf, shaft-seal reservoir.3 l iqmf, gear case.5 l Typical cooling-water flow l h -,.9 US gal min - Rated motor power iqdp pump. kw iqmf. kw Weight 5 kg Peak speed m 3 h - 85 ft 3 min - 8 Displacement m 3 h - 95 ft 3 min - 7 Ultimate vacuum mbar Torr Power input at vacuum (kw) iqdp pump iqmf With shaft-seal purge only Exhaust gas temperature 5. For lower exhaust gas temperatures, increased flow is required. m 3 h - ft 3 min Pump speed with shaft-seal purge only. 5 Hz IQDP8/IQMF 5 Hz 6 Hz x -3 7 x -.5 x x iqmf, 5Hz iqdp8/iqmf mbar Pa (3.93) 38.5 (.57) (9.9) (.5) 6 6 (.) (.) The center of the check valve is 69.5mm inside the end of the iqm booster frame. The systems listed below are standard configurations, recommended for the types of applications listed. To order other systems, use the iq ordering matrix: see page -79. PRODUT DESRIPTION 5 (.3) 3 (.36) (.3) iq H for semiconductor processes 8 V 6 Hz iq75 5 V 5 Hz iq757 iq H is recommended for semiconductor processes like VD and etch. The system consists of iqdp8 and iqmf pumps, 3-ph, fully enclosed, harsh duty gas module and pump display module. 8 (8.58) 8 (.8) -69.5* (3.3) (.7) 75SEMIONDUTOR PUMPS ND EXHUST MNGEMENT iqmf, 6Hz Torr

76 QM5F MEHNIL OOSTER PUMP 3 m 3 h - iqm5, 5Hz mbar Pa 5 Hz iqdp8/iqm5 iqdp/iqm5 76 TEHNIL DT Displacement (swept volume) 5 Hz supply 3 m 3 h -, 85 ft 3 min - 6 Hz supply 375 m 3 h -, ft 3 min - Effective pumping speed at 5 Hz iqdp 35 m 3 h -, 38 ft 3 min - iqdp8 6 m 3 h -, 53 ft 3 min - Rotational speed 5 Hz supply - 9 rpm 6 Hz supply - 35 rpm Ultimate pressure with iqdp backing pump and shaft seals purge only 7 x - mbar ontinuous inlet pressure range (with suitable backing pump) - mbar Maximum outlet pressure mbar Pressure differential across pump 3-8 mbar Recommended backing pumps iqdp, iqdp8 Inlet connection ISO63 Outlet connection ISO Electrical supply voltage, 3-phase 5Hz - 8 V, 38-5 V 6 Hz - 3 V, 6 V Motor power. kw mbient temperature range 5 - º Maximum operating humidity 9% RH Minimum cooling water flow (with inlet pressure mbar and 3 º) 75 l h - ooling water connections Inlet Hansen quick connect /8 inch SP male Outlet Hansen quick connect /8 inch SP male Recommended oil Fomblin YV!^/6 or Krytox 5 Oil capacity oupling cover.5 l Shaft seal reservoir.3 l Weight 65 kg Effective pumping speed for air at.3 mbar with 5 Hz supply. Effective pumping speed with 6 Hz supply will be at least % higher than operation with 5 Hz supply. Depends on pressure. 3 Determined by the hydrokinetic drive. Exact cooling water requirements depend on required gas temperature, TV setting and inlet pressure. Pump is shown with inlet and outlet blanking flanges fitted. Dimensions are to the top surface of the pump flange. PRODUT DESRIPTION QM5F 5 Hz Hz Supplied with one o-seal and one trapped O ring. ESSORIES 3 x M x 5 (.59) iqm5 and 5 motor ancillaries kit Use this kit to convert a QM5 to an iqm5. SPRES lean and overhaul kit Module kit Shim kit 7 (7.56) ISO (7.38) 38 (5.3) ISO 98 (3.86) (5.5) 5 (.9) 9 (.5) 3 (9.) 7 (.63) Krytox is a registered trademark of Dupont Dow Elastomers

77 QM5F MEHNIL OOSTER PUMP 788 (3.) TEHNIL DT Displacement (swept volume) 5 Hz supply 55 m 3 h -, 3 ft 3 min - 6 Hz supply 65 m 3 h -, 355 ft 3 min - Effective pumping speed at 5 Hz QDP 35 m 3 h -, 6 ft 3 min - QDP8 39 m 3 h -, 3 ft 3 min - Rotational speed 5 Hz supply - 9 rpm 6 Hz supply - 35 rpm Ultimate pressure with iqdp backing pump and shaft seals purge only 7 x - mbar ontinuous inlet pressure range (with suitable backing pump) - mbar Maximum outlet pressure mbar Pressure differential across pump 3 - mbar Recommended backing pumps QDP / iqdp QDP8 / iqdp8 Inlet connection ISO Outlet connection ISO63 Electrical supply voltage, 3-phase 5 Hz - 8 V, 38-5 V 6 Hz - 3 V, 6 V Motor power. kw mbient temperature range 5 - º Maximum operating humidity 9% RH Minimum cooling water flow (with inlet pressure mbar and 3 º) 75 l h - ooling water connections Inlet Hansen quick connect /8 inch SP male Outlet Hansen quick connect /8 inch SP male Recommended oil Fomblin YV 6/6 or Krytox 5 Oil capacity oupling cover.5 l Shaft seal reservoir.3 l Weight 78 kg Effective pumping speed for air at.3 mbar with 5 Hz supply. Effective pumping speed with 6 Hz supply will be at least % higher than operation with 5 Hz supply. Depends on pressure. 3 Determined by the hydrokinetic drive. Exact cooling water requirements depend on required gas temperature, TV setting and inlet pressure. m 3 h iqm5f, 5Hz 3 mbar Pump is shown with inlet and outlet blanking flanges fitted. Dimensions are to the top surface of the pump flange. PRODUT DESRIPTION QM5F 5 Hz Hz Supplied with two trapped O rings. ESSORIES iqm5 and 5 motor ancillaries kit Use this kit to convert a QM5 to an iqm5. SPRES M x 5 (.59) lean and overhaul kit Module kit Shim kit ISO ISO63 (8.7) 79 (7.5) 98 (3.86) 96 (7.7) 5 (.53) 6 (.7) 9 (.5) (8.35) x M8 x 6 5 (9.88) SEMIONDUTOR PUMPS ND EXHUST MNGEMENT Pa 5 Hz iqdp8/iqm5f 5 Hz iqdp/iqm5

78 QMF MEHNIL OOSTER PUMP 958 (37.7) 78 TEHNIL DT Displacement (swept volume) 5 Hz supply 95 m 3 h -, 75 ft 3 min - 6 Hz supply 35 m 3 h -, 85 ft 3 min - Effective pumping speed (iqdp8) at 5 Hz 85 m 3 h -, 98 ft 3 min - Rotational speed 5 Hz supply - 9 rpm 6 Hz supply - 35 rpm Ultimate pressure with iqdp backing pump and shaft seals purge only 7 x - mbar ontinuous inlet pressure range (with suitable backing pump) - mbar Maximum outlet pressure mbar Pressure differential across pump 3-9 mbar Recommended backing pumps QDP8 / iqdp8 Inlet connection Outlet connection Electrical supply voltage, 3-phase 5Hz 6 Hz Motor power mbient temperature range Maximum operating humidity ISO6 ISO - 8 V / 38-5 V - 3 V / 6 V kw 5 - º 9% RH Minimum cooling water flow (with inlet pressure mbar and 3 º) 75 l h - ooling water connections Inlet Hansen quick connect /8 inch SP male Outlet Hansen quick connect /8 inch SP female Recommended oil Fomblin YV 6/6 or Krytox 5 Oil capacity Gear capacity.5 l oupling cover. l Shaft seal reservoir.3 l Weight 57 kg Effective pumping speed for air at.3 mbar with 5 Hz supply. Effective pumping speed with 6 Hz supply will be at least % higher than operation with 5 Hz supply. Depends on pressure. 3 Determined by the hydrokinetic drive. Exact cooling water requirements depend on required gas temperature, TV setting and inlet pressure. Pump is shown with inlet and outlet blanking flanges fitted. Dimensions are to the top surface of the pump flange. PRODUT DESRIPTION QMF 5 Hz Hz Supplied with one o-seal and one trapped O ring. ESSORIES iqm motor ancillaries kit Use this kit to convert a QM to an iqm. SPRES M x 5 lean and overhaul kit Module kit Shim kit ISO6 x Ø8 (.7) (.33) 3 (9.6) (8.66) 77 (.9) ISO 6 (.) 8 (.89) 8 (7.9) m 3 h - 38 (.96) 36 (.) 368 (.9) iqmf, 5Hz mbar Pa

79 iq PUMPING SYSTEM ORDER MTRIX Refer to the table below for information about which gas module to select for your application. For more information, contact O Edwards or your local supplier. iq GS MODULE PPLITION LIGHT DUTY MEDIUM DUTY HRSH DUTY Load lock shers, strippers Sputterers, evaporators Ion implanters Plasma etch Metal Poly/ oxide Others PEVD MOVD LPVD Oxide Nitride PSG, PSG Tungsten, silicides Others For beam line and target only. LTO, HTO, TEOS, Nitrox. To order your iq dry pumping system, choose from the options listed below: Pumps iqdp iqdp8 3 iqdp and iqm5f (vertical mount electrics box) iqdp and iqm5f 5 iqdp8 and iqm5f 6 iqdp8 and iqm5f 7 iqdp8 and iqmf 8 iqdp/iqm5f (horizontal mount electrics box) Gas module Harsh process Medium process 3 lean process iqm booster mounting and enclosures iqdp with no enclosures iqdp with enclosure iqm direct mounted to iqdp, no enclosures (not available for iqm) 3 iqm direct mounted to iqdp, iqdp enclosure (not available for iqm) iqm frame mounted to iqdp, no enclosures 5 iqm frame mounted to iqdp, iqdp and iqm enclosed ontrol No Pump Display Module Pump Display Module iq Optional sensors None Oil level monitor(s) Water flow switch Exhaust gas temperature 3 sensor Electrical supply V 5Hz 3-phase V 6Hz 3-phase 8V 5Hz 3-phase 3 8V 6Hz 3-phase 3V 6Hz 3-phase 5 38V 5Hz 3-phase 6 5V 6Hz 3-phase 7 6V 6Hz 3-phase 8 Example: iq5536 is an enclosed iqdp8 with a frame mounted iqm55f (38V, 5Hz, 3-phase), a medium process gas module, a pump display module and an exhaust gas temperature sensor. 79SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

80 INTERFES ND NETWORKS O Edwards can provide a range of interface and network options for its semiconductor dry pump and exhaust management products. ommunication with individual pump systems is achieved through parallel and serial interfaces or through a P interface and our special software. Systems of more than one item of vacuum equipment can be connected into a network and monitored with the O Edwards FabWorks software. Interfaces and networks are tailored to suit each application and are manufactured to order. ontact O Edwards or your local supplier to discuss your specific requirements. INTERFES ND OMMUNITIONS FWORKS3 VUUM ND TEMENT NETWORKING The FabWorks3 system allows multiple vacuum and abatement systems to be viewed remotely via a P screen. Features & benefits Real time monitoring of pump and abatement systems, increasing efficiency of servicing and maintenance activities lert notification and alert status monitoring, for rapid response Serial number tracking omprehensive data logging and historical trend production, for equipment optimization Remote alert notification via pager, mobile phone or , again optimizing response time to issues Flexible viewing via server, Local rea Network (LN) or Internet 8 Network design The O Edwards network uses the reliable LON Works protocol and communicates through special isolated screen twisted pair cable, which provides excellent noise immunity over long distances at high communication rates. The core database now uses a SQL server database for improved data manipulation and handling. The network is made up of segments that are 'daisy chained' together. Network segments of up to m long can be linked together through simple routers to form a single large network of equipment. Up to devices per network can be monitored and several networks can be linked into one server, providing opportunities for 3+ device networks! Viewing the network The FabWorks3 system is a true web server. The network server links to the LON network and to the LN as shown. OEM interfaces Working closely with OEMs, O Edwards has developed the Tool Interface Module to connect semiconductor dry pump systems to all existing and new semiconductor tools. dvantages of the Tool Interface Module (TIM) include: pplication specific configuration checks. When a pump system is switched on or changed, a configuration check is made to ensure that the pump(s), gas module and sensors are connected, as specified for the process. Record of pump change and service history. This facility can be used to analyze how pumps operate on particular processes, and allows electronic tracking of pumps throughout a semiconductor fab. utomatic download of settings. The sensor settings for each process tool are automatically downloaded to the pump when it is switched on. This allows easy pump change, without reconfiguration or the need for manual set-up. Interfacing to other vacuum components. n auxiliary circuit card can be added to operate other vacuum system equipment, such as a gate valve in the foreline. ommunications interfaces Multiple communications interfaces can be added to O Edwards semiconductor dry pump systems, allowing them to communicate through RS3, RS85 and optical fiber communication systems. In addition, various sensorbus interfaces are also available. rowser Lan/Dedicated Ethernet 3 Server LON 5 Interface Module ny client terminal connected to the LN using Microsoft Internet Explorer 5.5 browser or better can therefore view the network. In addition, FabWorks3 has the capability to be viewed securely across the Internet, in provision for true E-Diagnostic remote monitoring. dded functionality modules In addition to the standard software extra FabSuite modules are available. ontact O Edwards or your supplier for information about ordering networks and components.

81 FWORKS FabWorks also supports the standard industrial OP standard allowing the FabWorks data base to be shared with other monitoring systems. Monitoring systems ontact O Edwards or your supplier for information about ordering networks and components. 8SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

82 8 EXHUST MNGEMENT FOR SEMIONDUTOR PROESSES omprehensive range O Edwards is unique in offering the broadest range of exhaust management technologies, demonstrated in a series of products and systems designed to meet all customer requirements - from low-cost facility management to full environmental protection. We are committed to supplying exhaust management systems that match customer specific application requirements. We strive to minimize cost of ownership while introducing innovative designs to achieve greater reliability, longer service intervals, reduced space and utilities requirements and lower waste emissions. Many of our products are OEM process qualified. Product selection ustomers have the opportunity to decide which O Edwards point-ofuse abatement equipment is most suitable for their particular application on the basis of their exhaust gas management goals. O Edwards will provide their experience and expertise to determine the correct exhaust management product for a particular application. There are numerous criteria by which this decision may be made. Leading-edge Manufacturing Our primary manufacturing facility is located at levedon in the UK. The site comprises a factory with flexible production lines, assembly feed cells, just-in-time manufacturing techniques and one of the largest exhaust management research centers in the world. dditional manufacturing sites located at hunan (Korea) and Ina (Japan) complement the global production capability. Underpinning our whole operation is a commitment to quality and world class manufacturing standards. n ISO 9 and ISO management system, supported by TQM and Kaizen methodologies, is at the core of the operation. Product certification to the relevant international standard is conducted by ITS, the independent external test house. Thermal Processing Effective exhaust management of VD processes must be able to handle the deposition gases and the associated powders. The fluoride wastes from cleaning gases also require suitable treatment along with the global warming gases. batement systems must be able to comply with these requirements in one complete unit. The TPU (Thermal Processing Unit) is the industry standard abatement system for VD. One model is suitable for all VD and many etch applications. Each inlet can be configured for high level abatement of all Global Warming PF gases, F or IF 3. The TPU can accommodate total input flows up to 8 slpm. Where PFs are not used, the TS (Thermal onditioning System) provides a cost-effective means of handling both hazardous fluoride waste and deposition gases. The Helios is an advanced solution for the abatement of high hydrogen flows using the inward fired combustion common to the TPU and TS product ranges. It was designed to handle both toxic and carrier gases from Low Pressure Epitaxy and MOVD processes. The Kronis is the latest addition to the inward fired combustor range. The Kronis provides effective treatment for low k VD process exhausts. The HOx (Hot Oxidation System) offers a significant advance in the performance of non-fuel oxidation technology. With an innovative electrical heated oxidation unit and the proven three-stage wet scrubber of the combustor product line, it combines superior performance for the abatement of VD processes in facilities which do not have the ability to use fuel gas. GR technology has been used to abate the exhaust gas streams on a wide range of semiconductor applications. (Photograph courtesy of TI, Dallas, US.) Gas Reactor olumns O Edwards offers a range of low-cost, point-of-use dry abatement systems for semiconductor processing. Each system uses the unique hot bed reactor technology developed for the GR (Gas Reactor olumn) range. The Inline 5 is the highest performance of any dry abatement technology for etch exhausts. It provides treatment by chemical reaction to stable inert salts and treats the widest range of gases from halogens and acids to IF 3, NF 3, SF 6 and other halide etch compounds. The D5 Dual GR provides dual-cartridge operation thus minimizing the cost of ownership with % uptime. The M5 Single GR is a compact dry gas treatment system for removing hazardous etch and VD emissions at the source, converting them into harmless solids within an easily changed and disposable cartridge. Wet Scrubbers O Edwards new range of wet scrubbers provide exhaust management at minimal cost for preservation of assets and regulatory compliance. Tempest is a point of use wet scrubber suitable for the treatment of semiconductor process tool exhausts containing water-soluble and water-reactive gases such as Hl, l and NH 3. Pyrophoric onditioning For the removal of silane and pyrophoric gases to below lower explosion level (LEL) the PS (Pyrophoric onditioning System) offers an advanced solution. Specifically designed for the safe handling of silane, the PS incorporates a unique particle handling system to keep ducts free from powders. Integrated Vacuum and Exhaust Management Systems Vacuum equipment and exhaust management devices are traditionally installed side-by-side, beneath the process tool. The Zenith range now offers a series of process-specific, fully integrated vacuum pump and exhaust management systems designed to safely handle the process exhausts from a wide range of applications. Enhanced safety, process tool compatibility, minimum footprint and reduced cost of ownership are key benefits derived from our unique approach, resulting in improved uptime, process efficiency and profitability.

83 TMS Temperature Management System O Edwards offers TMS (Temperature Management System) for processes involving condensable byproducts. TMS ensures that these compounds remain volatile until they enter the abatement device. The TMS is designed to heat both forelines and pump exhaust lines to the inlet of the abatement device. Moulded high surface area heaters maximize contact with pipes and are designed to maintain the temperature of the pipe between 9 and 5. TMS monitoring is available as an option to provide both local and remote verification that the line is at a sufficient temperature. TMS has been successfully used in conjunction with the entire range of O Edwards exhaust management equipment to alleviate the problems historically associated with solid deposition and corrosion. Process recommendations Your choice of exhaust management system depends on two key factors: the generic process used and the degree of exhaust management required. Other variables will then shape your choice, such as company policy, cost of operation and local emissions legislation. Our pplication Guide is designed to help you select the appropriate product type according to specific semiconductor manufacturing processes. GENERI PROESS ETH Dielectric onductive - poly silicon onductive - metal PEVD Silane based oxide/ nitride/ HDP GENERI GSES HF 3 /NF 3 /F / F 6 / F 8 /SF 6 / F 6 / 5 F 8 /H 3 F SYSTEM ONFIGURTIONS Integrated Stand alone PUMP HOIE ih/il or EPX series FULL ESH MNGEMENT NON-FUEL FUEL SOLUTION SOLUTION TPU series Zenith etch series HS + PITL SSET PROTETION i5 or tempest TMS PIPELINE PROTETION Integrated Zenith etch series Included l /Hr/ SF 6 /F / ih/il or EPX HF 3 Stand alone TPU series i5 or tempest Recommended series l /l 3 /F / Integrated Zenith etch series Included HF 3 Stand alone ih series TPU series i5 or tempest Essential SiH /NH 3 /N O/ PH 3 /SiF Integrated Zenith VD series lean step PF, NF 3 Stand alone ih series TPU series HOx series Included for nitride Recommended for nitride TEOS based oxide/psg TEOS/TE/TEP Integrated Zenith VD series Included lean step PF, NF 3 Stand alone ih series TPU series HOx series Essential low k VD 3MS/MS/TMTS Integrated Zenith VD series Included lean step NF 3 Stand alone ih series Low k series Included Metalization tungsten SiH /WF 6 /H Integrated Zenith VD series lean step PF, NF 3, IF 3 Stand alone ih series TPU series or Helios HOx series Essential Metalization Til /NH 3 Integrated Zenith VD Included titanium lf 3 /I Stand alone ih series TPU series HOx series Tempest Essential Metalization high k High k precursors TPU series GR series Recommended Low pressure EPI H /DS/PH 3 / SiH / sh 3 / H 6 / GeH Integrated Stand alone ih or iq series Zenith EPI Helios Recommended LPVD Polysilicon SiH /PH 3 /sh 3 Integrated Zenith VD lean step None TPU series HOx series PS Stand alone ih series F /HF, IF 3 TPU series HOx series LPVD Nitride HD/DS/NH 3 Integrated Zenith VD Included lean step None TPU series Tempest WT(+M5) Essential Stand alone ih series F /HF TPU series HOx series Essential IMPLNT Stand alone iq series M5i MOVD GaS, phosphide H, SiH, PH 3, sh 3, *Metalorganics Stand alone ik5 / GV - EH6 Helios Essential GaN H, NH 3, *Metalorganics Stand alone ik5 / GV- EH6 Helios GaNcat Essential 83SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

84 8 THERML PROESSING UNITS Exhaust management in VD processes Hydride gases are easily removed by combustion, but perfluorinated etch and clean gases (like F 6, NF 3, SF 6 ) present a more significant problem for exhaust management. Destruction at high efficiency can only be achieved by sustained high temperature oxidation. n effective treatment unit must have two elements. First, a combustion unit capable of converting the PF gases. Second, a high efficiency scrubber to remove the combustion by-products (HF and SiO ). The O Edwards TPU/TS/Helios/Kronis thermal processors combine patented porous wall combustors from lzeta orporation with a specially designed 3-stage compact scrubbing unit to deliver these features. The HOx employs non-fuel oxidation technology. Thermal processing components Head unit () etween one and four independent inlets pass separately through the head unit, directly into the reaction zone of the combustor immediately below. There is no premixing of gases, so potentially incompatible gases from different chambers can be treated simultaneously. Inward fired porous wall combustor () The lzeta patented combustor provides an adiabatic, isothermal high temperature reaction zone inside the porous tube. The inner surface of the walls are continuously flushed with incoming fuel and air, so reaction materials are held away from the walls. This prevents corrosion and the build-up of solids. High efficiency conversion of PF gases is achieved with natural gas (H ). Natural gas provides additional cost and safety advantages over burners which require hydrogen. The HOx employs non-fuel oxidation technology. Flux force condensation scrubber () Here, the hot gases are rapidly cooled to 9 º and become saturated in water vapor. This part of the TPU is also known as the quench' unit. The walls of this section are continuously flushed with water, resulting in rapid condensation of the vapor and entrainment of oxide particles. yclone scrubber (D) The cooled gas stream now enters a cyclone scrubber. Fine particulates which were not captured in the condensation stage will be spun-out here into the liquid phase and pass to the drain. Packed tower scrubber (E) Here, the remaining component in the processed gas mixture, the undissolved fraction of HF, is removed by using a highly efficient counter current tower fitted with the latest design of high conductance, high surface area packing. Porous wall radiant combustors (TPU/TS/Helios/ Kronis) The lzeta combustion units guarantee high efficiency combustion. Fuel and air pass through a porous ceramic matrix, where combustion occurs on the surface. t the surface, where the fuel, air and process gas mix intimately, the gas mixture temperature can reach 9 º. There is no visible flame, but the surface of the matrix is incandescent. Sustained exposure of the exhaust gas to high temperature ensures high reaction efficiency. D E Fuel and air PFs in pump exhausts Radiation exchange D nnular supply plenum D Service Module The installation of the Thermal Processors is made easier by the use of the optional Service Modules. The Service Module contains all the components required to regulate the flow rates and pressures of the services that the thermal unit requires. The electrical supply for the Service Module comes directly from the Thermal Processor. Three stage high efficiency scrubber Multi-stage scrubbing is essential to remove the high levels of HF and oxide powders from the combustor. The three stage scrubber of the TPU is described in detail below. Note that the HF dissolution rate into water is three times slower than for HI, so simple water sprays are not effective. WRU Water Recirculation Unit Where conservation of water is a primary concern, a Water Recirculation Unit (WRU) can be integrated into the Thermal Processor to reduce water consumption.

85 TPU THERML PROESSING UNIT The Thermal Processing Unit (TPU) is an industry standard abatement system for VD. The proprietary inward-fired combustor, coupled with a high efficiency wet scrubber, has been independently tested to give the highest DRE for PF gases of any system. Each inlet can be configured for high level abatement of all Global Warming PF gases, F or lf 3. The TPU can accommodate total input flows up to 8 slpm. It also abates all hydrides and gives below TLV removal of corrosives, while minimizing NOx, Products of Incomplete ombustion (PIs) and Hazardous ir Pollutants (HPs). The TPU is suitable for all VD and many etch applications. dditional benefits include low cost of ownership, unrivalled abatement performance, robust field performance, excellent powder handling capabilities and SEMI S-73 certification. 83 F E D TEHNIL DT onnections Purge nitrogen supply Pneumatics nitrogen supply Oxygen supply Fuel gas supply ooling water supply Make-up water supply cid water drain Process gas Exhaust gas ypass outlet abinet extraction Services required Electrical supply Purge nitrogen supply Pneumatics nitrogen supply Oxygen supply Fuel gas supply ooling water supply Make-up water supply cid water drain Exhaust gas abinet extraction m 3 h - ORDERING OPTIONS Voltage Model Fuel gas Installation / inch Swagelok brass / inch Swagelok brass / inch Swagelok brass 3/ inch Swagelok brass 3/ inch upv pipe 3/ inch upv pipe 3/ inch upv pipe NW stainless steel 75 mm polypropylene NW stainless steel 5 mm mild steel, painted 3 V, -phase, 5 Hz V, -phase, 6 Hz V, -phase, 5/6 Hz to 8 bar gauge 6 to 8 bar gauge.7 to 3. bar gauge Methane/Propane/LPG. to.7 bar gauge. to 6.9 bar gauge.5 to bar gauge Non-pressurized outlet l min - / to -5 inch wg See technical data Services module WRU Methane Propane, or inlets TMS Remote bypass module ypass nitrogen dilution High F abatement Secondary containment PRODUT DESRIPTION Please contact O Edwards for information on which options best suit your application. 85SEMIONDUTOR PUMPS ND EXHUST MNGEMENT 3 G abinet extraction outlet: 6Ø ypass outlets Process gas inlets D Exhaust gas outlet: Ø E cid waste water outlet F Space required for Servicing ccess (with no service WRU module fixed) G Service Module (optional)

86 TS THERML ONDITIONING SYSTEM TEHNIL DT 86 onnections Purge nitrogen supply Pneumatics nitrogen supply Fuel gas supply ooling water supply Make-up water supply cid water drain Process gas Exhaust gas ypass outlet abinet extraction Services required Electrical supply Purge nitrogen supply Pneumatics nitrogen supply Fuel gas supply ooling water supply Make-up water supply cid water drain Exhaust gas abinet extraction m 3 h - / inch Swagelok brass / inch Swagelok brass 3/ inch Swagelok brass 3/ inch upv pipe 3/ inch upv pipe 3/ inch upv pipe NW stainless steel 75 mm polypropylene NW stainless steel 5 mm mild steel, painted 3 V, -phase, 5 Hz V, -phase, 6 Hz V, -phase, 5/6 Hz to 8 bar gauge 6 to 8 bar gauge Methane/Propane/LPG. to.7 bar gauge. to 6.9 bar gauge.5 to bar gauge Non-pressurized outlet l min - / to -5 inch wg ORDERING OPTIONS The Thermal onditioning System (TS) provides reliable, high performance, low cost abatement of flammable and acid gases from VD exhausts. The TS incorporates the unique inward fired radiant combustor and the high efficiency three stage water scrubber developed for the Thermal Processing range. It is ideally suited for remote plasma NF 3 and high flows of F. F D Voltage Model Fuel gas Installation See technical data Services module WRU Methane Propane, or inlets TMS Remote bypass module ypass nitrogen dilution Secondary containment Internal bypass valves PRODUT DESRIPTION Please contact O Edwards for information on which options best suit your application E 3 G abinet extraction outlet: 6Ø ypass outlets Process gas inlets D Exhaust gas outlet: Ø E cid waste water outlet F Space required for Servicing ccess (with no service WRU module fixed) G Service Module (optional)

87 HELIOS During periods of low or zero hydrogen flow, a small orifice restricts the flow of excess air to the combustor. This still ensures that should high flows unexpectedly occur there is still sufficient air to remove the H to below LEL. (See Image ). Image Image Helios is an advanced solution for the abatement of high hydrogen flows using proven inward-fired combustion. It has been designed to handle both toxic and carrier gases from low pressure or atmospheric epitaxy and MOVD applications. Helios safely eliminates the explosive hazards associated with Hydrogen and destroys hydride gases such as sh 3 and PH 3 at the point of use. Exhaust management challenges lternating high flows of hydrogen with additional toxic and pyrophoric gases followed by acid vapors presents a new challenge for exhaust treatment in basic burners. The variation in flows of hydrogen can severely limit both the efficiency and cleanliness of combustion. Helios is a new generation of O Edwards' inward fired combustors that is capable of high performance with these processes, combined with a clean combustion process. lean combustion In order to cleanly combust high flows of hydrogen, an excess of air must be supplied to the combustor. If not, then high levels of O, unburnt hydrocarbons or even unburnt hydrogen may be emitted from the combustor. It must be supplied in a manner that ensures that the hydrogen process gas will not cause flashbacks. The Helios achieves this by adding air via an annulus to the nozzles; hence the air only mixes with the hydrogen during combustion. This can be seen in the diagram on the right where the arrows entering from the side represent the air added via the nozzle annulus and mixing with the process gas (arrows from the top) only in the combustor. However, during periods when high flows of hydrogen are not flowing, the excess air must be stopped in order not to extinguish the combustor. The unique control mechanism (right) ensures that efficiency is not compromised either with or without hydrogen flowing F 8 3 D 3 76 E G abinet extraction outlet: 6Ø ypass outlets Process gas inlets D Exhaust gas outlet: Ø E cid waste water outlet F Space required for Servicing ccess (with no service WRU module fixed) G Service Module (optional) 87SEMIONDUTOR PUMPS ND EXHUST MNGEMENT Intelligent operation During periods of high flow of hydrogen, interfacing with the tool ensures that the flow of excess air via the open orifice area is sufficient to ensure complete clean combustion of up to Ipm of hydrogen. (See Image ).

88 TEHNIL DT 88 onnections Purge nitrogen supply Pneumatics nitrogen supply Fuel gas supply ooling water supply Make-up water supply cid water drain Process gas Exhaust gas ypass outlet abinet extraction Services required Electrical supply Purge nitrogen supply Pneumatics nitrogen supply Fuel gas supply ooling water supply Make-up water supply cid water drain Exhaust gas abinet extraction 35 m 3 h - / inch Swagelok brass / inch Swagelok brass 3/ inch Swagelok brass 3/ inch upv pipe 3/ inch upv pipe 3/ inch upv pipe NW stainless steel 75 mm polypropylene NW stainless steel 5 mm mild steel, painted 3 V, -phase, 5 Hz V, -phase, 6 Hz V, -phase, 5/6 Hz 6 to 8 bar gauge to 8 bar gauge Methane/Propane/LPG. to.7 bar gauge. to 6.9 bar gauge.5 to bar gauge Non-pressurized outlet 8 l min - / -3 to -5 inch wg ORDERING OPTIONS Voltage Model Fuel gas Installation See technical data Services module WRU Methane Propane, or inlets TMS Secondary containment PRODUT DESRIPTION Please contact O Edwards for information on which options best suit your application.

89 KRONIS The Kronis is the latest addition to O Edwards range of inward-fired combustors, designed especially for the effective treatment of process exhausts from newly emerging low k VD processes. chieving clean combustion of low k organosilane precursors is challenging, and failure to do so results in unacceptable by-products and blockages in downstream systems. O Edwards has gained an in-depth understanding of low k VD process issues by working with OEMs and materials suppliers during process development. The Kronis has been designed to overcome the issues associated with this most demanding of VD processes. 83 F G E D TEHNIL DT onnections Purge nitrogen supply Pneumatics nitrogen supply Oxygen supply Fuel gas supply ooling water supply Make-up water supply cid water drain Process gas Exhaust gas ypass outlet abinet extraction Services required Electrical supply Purge nitrogen supply Pneumatics nitrogen supply Oxygen supply Fuel gas supply ooling water supply Make-up water supply cid water drain Exhaust gas abinet extraction m 3 h - ORDERING OPTIONS Voltage Model Fuel gas Installation / inch Swagelok brass / inch Swagelok brass / inch Swagelok brass 3/ inch Swagelok brass 3/ inch upv pipe 3/ inch upv pipe 3/ inch upv pipe NW stainless steel 75 mm polypropylene NW stainless steel 5 mm mild steel, painted 3 V, -phase, 5 Hz V, -phase, 6 Hz V, -phase, 5/6 Hz to 8 bar gauge 6 to 8 bar gauge.7 to 3. bar gauge Methane/Propane/LPG. to.7 bar gauge. to 6.9 bar gauge.5 to bar gauge Non-pressurized outlet l min - / to -5 inch wg See technical data Services module WRU Methane Propane, or inlets Remote bypass module ypass nitrogen dilution Secondary containment kit PRODUT DESRIPTION Please contact O Edwards for information on which options best suit your application. 89SEMIONDUTOR PUMPS ND EXHUST MNGEMENT abinet extraction outlet: 6Ø ypass outlets Process gas inlets D Exhaust gas outlet: Ø E cid waste water outlet F Space required for Servicing ccess (with no service WRU module fixed) G Service Module (optional)

90 HOx HOT OXIDTION SYSTEM TEHNIL DT 9 onnections Purge / pneumatics nitrogen supply ooling water supply Make-up water supply cid water drain Process gas Exhaust gas ypass outlet abinet extraction Services required Electrical supply ORDERING OPTIONS / inch Swagelok brass 3/ inch upv pipe 3/ inch upv pipe 3/ inch upv pipe NW stainless steel 75 mm polypropylene NW stainless steel 5 mm mild steel, painted V, 3-phase, 5 Hz 8 V, 3-phase, 6 Hz V, 3-phase, 5/6 Hz 6 to 8 bar gauge Purge / pneumatics nitrogen supply ooling water supply. to 6.9 bar gauge Make-up water supply.5 to bar gauge cid water drain Non-pressurized outlet Exhaust gas l min - / to -5 inch wg abinet extraction m 3 h - The Hot Oxidation System (HOx) offers a significant advance in the performance of non-fuel oxidation technology. ombining an innovative electrical heated oxidation unit with the proven three stage wet scrubber from the inward fire product range, the HOx offers superior performance to competing systems with significant improvement in powder handling capability. The system is designed to ensure safe removal of pyrophoric gases below flammable limits and effective treatment of acidic by-products to protect exhaust systems from damage. The Hot Oxidation System (HOx) offers point of use treatment of hazardous exhaust gases from semiconductor applications, particularly from the deposition and chamber clean stages of VD applications. Voltage Model Installation See technical data Internal water recirculation WRU, or inlets TMS Online cleaning udible alarm Interface module Remote bypass valves ypass valve module PRODUT DESRIPTION Please contact O Edwards for information on which options best suit your application. D F E 3 G abinet extraction outlet: 6Ø ypass outlets Process gas inlets D Exhaust gas outlet: Ø E cid waste water outlet F Space required for Servicing ccess (with no service WRU module fixed) G Service Module (optional)

91 GR GS RETOR OLUMNS The GR process In the Gas Reactor olumn (GR), a proprietary mixture of inorganic granules is held inside a stainless steel cartridge. The cartridge is maintained at an elevated temperature by tubular heaters surrounding it. Hazardous exhaust gases passing into the cartridge are chemically reacted to completion and converted into inert stable inorganic salts. GR process applications The GR is suitable for treatment of hazardous exhaust gases generated in many processes including metal etch, poly etch, trench etch, oxide etch, many VD processes and gas cabinet purge lines. The GR effectively processes most compounds containing chlorine, bromine and fluorine, as well as hydrides such as silane, phosphine, diborane, and germane. Economic cartridge system Unlike some treatment systems, GR reactants are only used when process gas is flowing. The disposable cartridges are not consumed by nitrogen pump purge gas and provide high capacity and long life, dependent only on the amount of process gas used. Environmental The GR provides the ultimate protection. Gases are removed at the source and not discharged. They are reacted into safe, inert solids. No toxic liquids or solids are produced for disposal. Rapid cartridge change artridge changing is fast, simple and safe. With the integral bypass, pumping operations are not affected. For minimum exchange time, the used cartridge can either be removed hot (use of the hot change cart is recommended) or the optional preheat station can be used. Preheat station With this option, change-out time of exhausted cartridges is reduced to approximately minutes. The unit comprises a standard heater section plus a simplified control unit. It allows a fresh cartridge to be brought up to operating temperature prior to change-out. On exhaustion of the cartridge in the on-line system the two complete heater units are simply exchanged. 9SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

92 INLINE 5 TEHNIL DT 9 The Inline 5 is a low-cost, point of use, dry abatement system for the semiconductor industry. High temperature treatment gives permanent gas destruction and removal of halogens, acids and other halide etch compounds. The Inline 5 safely treats toxic organochloride by-products and maximizes use of cartridges and minimizes cost of ownership. Features & benefits: 5 mm cartridges increase cartridge capacity by 3% Optimized operation of the cartridges in series ensures maximum use of material Safest treatment by chemical reaction to stable inert salts Widest range of gases treated, from halogens and acids to lf 3, NF 3, F 8, SF 6 and other halide etch compounds No desorption risks, unique to high temperature systems No toxic wastes % uptime with auto changeover ontinuous abatement even in power failure Integral heated inlet piping (option) Low energy, low utility requirements onnections Purge / pneumatics nitrogen supply Process gas Exhaust gas ypass outlet abinet extraction Services required Electrical supply Purge / pneumatics nitrogen supply abinet extraction m 3 h - ORDERING OPTIONS Voltage Installation Inline system operation / inch Swagelok brass NW stainless steel NW stainless steel NW stainless steel 5 mm mild steel, painted V, 3-phase, 5 Hz 8 V, 3-phase, 6 Hz V, 3-phase, 5/6 Hz to 5 bar gauge See technical data TMS udible alarm Inlet pressure display PRODUT DESRIPTION Please contact O Edwards for information on which options best suit your application. Image Image abinet extraction options Outlet options Inlet options Image From start up (Image ), exhaust gas is treated in left hand column. t initial breakthrough on left hand, a significant percentage of the column reactant remains unused. Left hand column continues to be used, with right hand column ensuring any residual gas is removed, until left hand column is fully consumed. The unit then switches to right hand (Image ) while left hand column is changed, and then operates in the reverse direction. Right hand column continues to be used (Image ), with left hand ensuring any residual gas is removed, until right hand column is fully consumed.

93 D5 DUL GS RETOR OLUMN The D5 is a dual canister GR designed for automatic change-over from the primary cartridge to the back-up cartridge. TEHNIL DT onnections Purge / pneumatics nitrogen supply Process gas ompressed air Exhaust gas ypass outlet abinet extraction Services required Electrical supply / inch Swagelok brass NW stainless steel / inch Swagelok NW stainless steel NW stainless steel 5 mm mild steel, painted V, 3-phase, 5 Hz 8 V, 3-phase, 6 Hz V, 3-phase, 5/6 Hz.5 to bar gauge Purge / pneumatics nitrogen supply ompressed air to 5 bar gauge abinet extraction m 3 h (95).87 (53) D.7 (85) (8) (99) 7.67 (795) 3.3 (77) abinet extraction, 3 alternative positions Inlet, alternative positions Outlet, alternative positions D Space required for cartridge change ORDERING OPTIONS Voltage Installation PRODUT DESRIPTION See technical data TMS ir Tuyere Manual or automatic dilution at output End point detector udible alarm Inlet pressure display Remote display entral P monitor Please contact O Edwards for information on which options best suit your application. 93SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

94 M5 SINGLE GS RETOR OLUMN TEHNIL DT onnections Purge / pneumatics nitrogen supply Process gas ompressed air Exhaust gas ypass outlet abinet extraction Services required Electrical supply ORDERING OPTIONS / inch Swagelok brass NW stainless steel / inch Swagelok NW stainless steel NW stainless steel (option) 5 mm mild steel, painted V, 3-phase, 5 Hz 8 V, 3-phase, 6 Hz V, 3-phase, 5/6 Hz.5 to bar gauge Purge / pneumatics nitrogen supply ompressed air to 5 bar gauge abinet extraction m 3 h - 9 Voltage Installation See technical data TMS ir Tuyere End point detector udible alarm Inlet pressure sensor Leak test Earth leakage trip The M5 Gas Reactor olumn is a compact technology developed for the semiconductor industry. This revolutionary dry gas treatment system removes hazardous etch and VD emissions at source, converting them into harmless solids within an easily changed and disposable cartridge. PRODUT DESRIPTION Please contact O Edwards for information on which options best suit your application. D 7.7 (5).6 (5) 7.87 (8) (97). (6) D 9.53 (75) ir extraction flange position M5 outlet M5 inlet Space required for cartridge change

95 NEW GNT TEHNIL DT The GaNcat is an electrically heated cartridge-based solution for treating the high ammonia exhaust gas flows from GaN-based MOVD processes. It incorporates the same generic features as the GR on which it is based, and by combining multiple cartridges in parallel it is possible to treat even the highest process gas flows. The unique cartridge design has two stages, the first to decompose the metalorganic vapors (such as TMG, TMI and TM), which would otherwise poison the second stage, where ammonia is decomposed into nitrogen and hydrogen. ecause the chemistry is primarily catalytic in nature, the GaNcat is a cost-effective solution for this application and does not generate NOx or waste-water. n optional backup cartridge allows for cartridge swap-out without having taken the GaNcat off-line, optimizing productive uptime. 97 (77.7) 65 (3.8) 75 (9.53) GR 97 (38.9) GR GR (3.7) GR 95 (36.) 9 (9.37) (6.69) onnections Purge / pneumatics nitrogen supply Process gas ompressed air Exhaust gas ypass outlet abinet extraction Services required Electrical supply ORDERING OPTIONS / inch Swagelok brass NW stainless steel / inch Swagelok NW stainless steel NW stainless steel (option) 5 mm mild steel, painted 3 V, -phase, 5 Hz V, -phase, 6 Hz V, -phase, 5/6 Hz.5 to bar gauge Purge / pneumatics nitrogen supply ompressed air to 5 bar gauge abinet extraction m 3 h - Voltage Installation See technical data -9 cartridge modules TMS Leak test Earth leakage trip mmonia gas detection module PRODUT DESRIPTION Please contact O Edwards for information on which options best suit your application. 95SEMIONDUTOR PUMPS ND EXHUST MNGEMENT 335 (9.93) 385 (5.6) Operational zone for heater trolley Operator interface area Electrical service access area

96 WET SRUERS O Edwards Tempest range of wet scrubbers offers exhaust management at minimal cost for preservation of assets and regulatory compliance. They are suitable for treatment of exhaust streams containing water-soluble and water reactive gases. Segmented chamber Segmented chambers are available as an option. They prevent potentially adverse reactions of incompatible gases. Gases remain separated in lower half of packed tower. TMS Temperature Management System (TMS) maintains the inlet duct and inlet at up to 5 to prevent the accumulation of condensable by-product. Mechanical clean This optional inlet for the Tempest provides periodic removal of any condensed reaction by-products allowing operation for extended periods without intrusive maintenance. Mechanical clean is suitable for Metal Etch, and LPVD Nitride applications. 96 O Edwards wet scrubber range includes the Tempest The Tempest is a counter-current flow, packed bed absorption/reaction unit. It is suitable for conductive etch, dielectric etch, LPVD Nitride and RTP applications, and contains a single stage cold water packed bed absorption unit. The wet scrubber range provides high efficiency gas absorption through a counter current flow tower design. The Integrated sieve tray ensures uniform water distribution and removes the possibility of gas channelling. Features & benefits Robust design, high reliability Lower ost-of-ownership Multiple inlet design Effective treatment of incompatible gases through chamber segmentation Single-side service access PL control Fabworks compatible SEMI S-33 ertified oaxial gas inlet The process gas enters the packed bed enclosure of the Tempest through a coaxial gas inlet(s). This inlet nozzle design permits reactive gases and condensable reaction by-products to enter the scrubber without precipitating or reacting at the scrubber inlet. nitrogen curtain slows reaction of the incoming process gas with the scrubbing liquid. Inlet servicing is infrequent due to this design, however when required, the removable inlet sleeve can be easily serviced or replaced in less than two minutes.

97 NEW TEMPEST TEHNIL DT Tempest, the new point of use wet scrubber, offers exhaust management at minimal cost for preservation of assets and regulatory compliance. Tempest is suitable for the treatment of semiconductor process tool exhausts containing water-soluble and water-reactive gases such as Hl, l and NH 3. Typical process applications include Metal Etch, Poly Etch, LPVD Nitride, PEVD Nitride and RTP. lthough based on a simple rainstorm in a box principle, Tempest includes many innovative design features that deliver real benefits to the customer. These include the prevention of inlet blockages through the use of a co-axial gas inlets and utilities consumption reduction through PL control 98 (78.) 83 (7.) D (39.76) 8 (3.5) 6 (3.6) E 785 (7.8) TYP onnections Purge / pneumatics nitrogen supply Make-up water supply cid water drain Process gas Exhaust gas abinet extraction Services required Electrical supply ORDERING OPTIONS / inch Swagelok stainless steel 3/ inch polypropylene 3/ inch polypropylene NW stainless steel NW polypropylene 5 mm mild steel, painted V, 3-phase, 5 Hz 8 V, 3-phase, 6 Hz V, 3-phase, 5/6 Hz 6 to 8 bar gauge Purge / pneumatics nitrogen supply Make-up water supply.5 to bar gauge cid water drain Non-pressurized outlet Exhaust gas 6 l min - / - to -5 inch wg abinet extraction 3 m 3 h - Voltage Installation See technical data - inlets Segmented chamber High temperature inlets Mechanical clean Remote bypass valves ypass valve module ypass valve module with TMS PRODUT DESRIPTION Please contact O Edwards for information on which options best suit your application. 97SEMIONDUTOR PUMPS ND EXHUST MNGEMENT Nitrogen supply Electrical supply Exhaust gas outlet D Process gas inlets E abinet extraction Ø5 mm

98 PYROPHORI ONDITIONING SYSTEM Features & benefits ctive air input Positive fan driven air supply for reaction/dilution air. No reliance on duct flows. Self cleaning inlets Fitted with well proven self cleaning inlet system used in the high performance TPU/TS product ranges. yclonic reaction chamber. Unique design of the reaction chamber. Oxidation occurs within a cyclonic swirl of air. Designed to remove 9% of particles > micron. Full monitoring interface Essential for a safe installation. Positive air flow/system pressure, and outlet temperature, continuously monitored via PL control. 98 The Pyrophoric onditioning System (PS) sets a new standard for self oxidation systems using the pyrophoric properties of gases for exhaust control. The "burn box" or "self-oxidation" concept The self oxidation concept is a low cost approach for the silane exhausts used in many fabs worldwide. The PS makes exhaust flows of silane with excess air and uses the natural pyrophoric properties of the gas to ensure oxidation. The PS incorporates design features to alleviate blockage associated with oxidation of high silane flows. In laboratory tests on simulated process flows, silane oxidation observations show that, at concentrations of silane in nitrogen >.6% self oxidation occurs on mixing with air. t concentrations below this, oxidation does not occur and the silane, once diluted on mixing with air to <.5%, is stable and safe. TEHNIL DT onnections Purge / pneumatics nitrogen supply Make-up water supply Process gas Exhaust gas ypass outlet abinet extraction Services required Electrical supply Purge / pneumatics nitrogen supply Make-up water supply Exhaust gas abinet extraction ORDERING OPTIONS Voltage Enclosure Installation / inch Swagelok brass inch upv pipe NW stainless steel NW stainless steel with PF coating NW stainless steel 7 mm mild steel, painted 3 V, -phase, 5 Hz V, -phase, 6 Hz V, -phase, 5/6 Hz to 6 bar gauge to 5 bar gauge l min - / to -5 inch wg m 3 h - (option) See technical data No enclosure yclone enclosure or inlets Status display Online cleaning Inlet pressure monitoring PRODUT DESRIPTION Please contact O Edwards for information on which options best suit your application

99 ZENITH ZENITH PRODUT RNGE Zenith Etch Zenith Etch is a range of fully integrated vacuum and exhaust management solutions for etch processes. The Zenith Etch range incorporates technologies that best suit your requirements. The Zenith range is a ground breaking series of fully integrated vacuum and exhaust management systems, providing enhanced safety, process tool compatibility, minimum footprint and reduced cost of ownership. O Edwards application expertise is applied to Zenith systems to ensure the most appropriate hardware and software for the specific application. Use of the latest generation vacuum pump and suitable exhaust management along with any detailed packages that ensure smoother more reliable operation can be fully incorporated. Features & benefits: Safety - Risk minimization / transfer - SEMI certification - NRTL safety certification available before installation - Faster onsite installation, commissioning and city permitting - Easier repeat municipal permitting Installation cost savings - Space saving - Reduced time, cost and ease of installation Operational benefits - ommon control strategy provides wafer security - Increased wafer throughput and wafer survival as smart interface manages predictive maintenance versus tool utilization - Reduced cost of ownership - Fewer components and commonality provide a reduced service requirement Process centric - To match customer and OEM specific applications, each Zenith is designed with the process in mind, enabling the correct choice of vacuum pumps and complete exhaust management to be made. Zenith Etch Plasma omprises atmospheric plasma, integral wet scrubber and specially process hardened pumps. Zenith Etch Plasma is a fuel-less exhaust management solution with a low cost of ownership (versus other technologies), very low energy consumption and minimal consumables. Zenith Etch TPU-M omprises the latest generation dry pumps with exhaust management from the established thermal processor range. The TPU-M abatement system comprises a small inward-fired combustor with a compact -stage wet scrubber. It has a lower utility cost than the standard TPU, while still providing excellent abatement performance. Zenith VD Zenith VD incorporates the latest generation dry pumps, exhaust management best suited to your specific requirements and integrated pipeline heating (TMS). It is the proven highest performance system for VD handling both high flows of deposition and chamber clean gases. 99SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

100 TEMPERTURE MNGEMENT SYSTEM (TMS) Many semiconductor processes, notably metal etch and LPVD nitride, generate vapors which, at room temperature, condense into solids in exhaust lines, forelines and pump silencers. These solids may build up until they block the pipelines, causing back-pressure and eventual pump failure. To keep the byproducts in gaseous form until they reach the exhaust gas treatment system, the gas must be kept hot and dry. The O Edwards Temperature Management System (TMS) has been very successful in preventing deposition of solids and corrosive liquids in pipelines. TMS is available to fit four pipeline diameters, mm and 5 mm, suitable for fitting to exhaust lines, 8 mm and mm, suitable for foreline heating. The TMS system can be used to effectively heat even complex shapes, like valves. Main system components The TMS system has three main components: the control unit, pipe heaters and pipe insulation. The control unit powers up to W of pipe heaters. Heaters are available in a variety of lengths and are simply linked together using daisy chain connectors. Pipeline insulation is provided using silicone foam with silicone cloth outer covering. TMS monitoring system TMS monitoring is available as an option. It provides the additional benefit of automatically signalling a potential problem cold spot where deposition could occur. Specially designed monitors are secured over each heater. Indicator lights provide a visual indication on the pipeline. warning signal is also provided at the power supply unit and there is the option of integration into the building management or O Edwards FabWorks monitoring system. pplications Metal etch Nitride etch Tungsten PEVD with F 6 / O clean LPVD nitride PRODUT DESRIPTION Heaters -5 mm (.5-") x 5 mm (.") 3.5 W Y5-5 mm (.5-") x 8 mm (3.") 3.5 W Y8-5 mm (.5-") x mm (.") 3.5 W Y -5 mm (.5-") x mm (7.9") W Y -5 mm (.5-") x 3 mm (.8") 36 W Y3-5 mm (.5-") x 5 mm (9.7") 6 W Y5 8 mm (3") x 5 mm (.") 3.5 W Y35 8 mm (3") x 8 mm (3.") 3.5 W Y38 8 mm (3") x mm (.") 3.5 W Y3 8 mm (3") x mm (7.9") W Y3 8 mm (3") x 3 mm (.8") 36 W Y33 8 mm (3") x 5 mm (9.7") 6 W Y35 mm (") x 5 mm (") 8 W Y5 mm (") x 8 mm (3.").8 W Y8 mm (") x mm (.") 5 W Y mm (") x mm (7.9") 3 W Y mm (") x 3 mm (.8") 8 W Y3 mm (") x 5 mm (9.7") 8 W Y5 Insulation mm (.5") Joining Strap Y mm (.5") Meter Length Y mm (.5") Elbow Y mm (.5") T-Piece Y3 mm (.5") lamp Y 5 mm (") Joining Strap Y 5 mm (") Meter Length Y 5 mm (") Elbow Y 5 mm (") T-Piece Y3 5 mm (3") lamp Y 8 mm (3") Joining Strap Y3 8 mm (3") Meter Length Y3 8 mm (3") Elbow Y3 8 mm (3") T-Piece Y33 8 mm (3") lamp Y3 mm (") Joining Strap Y mm (") Meter Length Y mm (") Elbow Y mm (") T-Piece Y3 mm (") lamp Y 63 MM (.5") Meter Length Y5 Power Supplies E Version 3 V, 5 Hz single phase Y S Version V, 6 Hz single phase Y J Version V, 5/6 Hz -phase Y3 Extension Leads 3 mm Y5 m Y5 Monitors 3 mm Y33 5 mm Y35 7 mm Y37

101 MODEL 5 WTER OOLED EXHUST TRP (7) (9) 7.7 (5) Pump QDP, pump outlet 68 mm 35 mm QDP, exhaust silencer outlet 8 mm 55 mm 8.9 (8).5. (57) (8) Water cooled trap ontrolled collection of exhaust solids Prevents expensive blockages Easy operation and disposal LPVD nitride processes using dichlorosilane (SiH l ) and ammonia (NH 3 ) generate ammonium chloride (NH l). On cooling at atmospheric pressure, NH l rapidly condenses out as a solid in exhaust pipes. The Model 5 water cooled trap provides a cost effective solution for controlled deposition of these solid by-products. oth the trap chamber and the liner are water-cooled, so NH l is deposited on the liner. The liner has a large capacity, and is easy and quick to change. Typically, the lifetime of a liner is six months. The Model 5 removes solids only. For applications where you need to both remove solids and treat residual ammonia, use the water cooled trap in conjunction with a downstream GR that is fitted with 5 (ammonia) cartridges. For more information about abatement of exhaust gases, refer to the application summary: see page -83. TEHNIL DT onnections ooling water supply Process gas Exhaust gas Services required ooling water supply 3/8 inch SP male quick connect NW NW 7 bar gauge PRODUT DESRIPTION Model 5 water cooled exhaust trap ESSORIES 53 Water cooled exhaust trap connection and TMS kit, for system with 5/5 mechanical booster pump 536 mechanical booster pump 5365 ONSUMLE SPRES Replacement trap liners for model SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

102 TU /8 HILLER The TU /8 Temperature ontrol Unit (chiller) is a single channel temperature control unit which supplies perfluorocarbon coolant in a closed loop for temperature control of semiconductor process chambers and wafers during etch and other processes. The TU /8 is designed for reliability, up-time performance and ease of maintenance, providing continuous and trouble free cooling across a wide temperature range. Use the TU for cooling electrostatic chucks, quartz windows, and chamber domes and walls. Features & benefits Magnetically driven, leak-free coolant pump with perfluorocarbon coolant Wide control temperature range, from - to 8 Temperature control in. increments, with typical stability ±.5. djustable coolant flow, from 3.8 to.7 l min - (-6 gal min - ) Stainless steel pressurized coolant system Fast temperature ramp up and down MTF of 5 hours Minimized pipe lengths and number of joints and all brazed refrigeration system Refrigerant and coolant lines are helium leak checked The semiconductor industry demands equipment with maximum up-time when operated continuously 365 days a year. Meeting these needs was paramount in the design of the TU, resulting in a leak-free, highly reliable and environmentally friendly temperature controller. The F free controller is SEMI S-93 qualified, E marked (complies with the EU low voltage directive), is UL listed, and is manufactured in a factory certified to ISO9. The TU has a closed loop perfluorocarbon coolant system. The use of a non-conductive coolant instead of deionized water means that the TU can be used in systems with large plasma and magnetic fields. Use of perfluorocarbon coolant also removes the need to monitor coolant resistivity and maintain coolant filters. The TU/8 can either be rack mounted or stacked. The front and side panels are easy to remove for routine maintenance. s with all O Edwards products, the TU /8 is backed by our worlwide technical and product service and support. TEHNIL DT ontrol temperature range - to 8 ontrol temperature set point. ontrol temperature stability ±. ooling capacity (at TU output, cooling water 5 ) t - 35 W t - to +8 W Heating capacity 8 W Temperature ramp (no load) 5 to 8 <5 min 5 to -3 < min Perfluorocarbon coolant system oolant type Pump type 3M F77, 3M F383, F87 or usimont Galden HT or 3M HFE 75 Magnetic drive gear pump 3/ HP motor Factory set pump flow rate (,. bar / 6 psi). l min - (3 gal min - ) Maximum coolant supply pressure psi djustable coolant flowrate l min - (-6 gal min - ) oolant connections ½ inch Swagelok union connector (supplied) Refrigeration system Refrigerant HF R ompressor.8 kw, 3-ph, hermetically sealed Heat exchanger High efficiency stainless steel cross flow plate ooling water requirements Flow rate. -.8 l min - (3-6 gal min - ) Temperature 6 Pressure. 6.9 bar ( psi) ooling water connections ½ inch brass compression fitting and ½ inch brass hose barb adaptors (supplied) Electrical supply Voltage -8 V, 3-ph 5/6 Hz, balanced delta onnection type 3 fused, NEM L-3R Phase rotation and low voltage monitor uilt-in Electrical cable 3.5 m ( ft), with L-3P 5 pin twist lock plug Typical power consumption.75 rated capacity Main circuit breaker 5 ontrols Power on, Start / Stop, Reset / Ready, Start / Stop and Emergency off (EMO) 3 Indicators udible alarm d() at metre Pressure gauge - psig, analog Hour meter hours, digital larms 3-phase rotation / low voltage, cooling water low flow, circuit breaker, reservoir coolant level and temperature, coolant flow, compressor overload, remote RTD** operation Weight kg (5 lbs) MTF 75 h (9% confidence) Green button and lamp Use to reset the latched alarms 3 Red, mm mushroom switch, with shroud annot be reset - alarm active when remote RTD operation is in use.

103 Process temperature vs cooling load*** *** at chiller output, cooling water (3.) 96.5 (3.8) TU / TU / (39.) W 5 Hz 6 Hz Process temperature vs time min min TU /8-6 min oolant pump flow rate vs differential pressure l min TU / bar 5 Hz 6 Hz PRODUT DESRIPTION TU /8 temperature control unit W95 Supplied with funnel, instruction manual, all connection fittings, shut-off valves and secondary containment receptacle. ommunications options such as RS-3 and RS-85 are available upon request: contact O Edwards or your local supplier for more information. SPRES Instruction manual Preventive maintenance kit Funnel Secondary containment receptacle ESSORIES 89 (35.) 76 (3.) 559 (.) TU /8 W959 P6535 P6 P357 usimont Galden HT perfluorocarbon coolant 6.5 kg P kg P53899 Tie-bolt kit for stacked units P65 Stabilization kit (earthquake restraint) P656 Leveler kit P65 Rack mount frame P655 Pneumatic dolly and lift P656 Host interface connector kit P653 Remote RTD assembly 3.6 m cable P m cable P653 oolant connector kit P65 ontact O Edwards for information about other coolants. 3 SEMIONDUTOR PUMPS ND EXHUST MNGEMENT

104 TU /8 PLUS HILLER High reliability and up-time performance The TU /8 Plus is designed to meet the stringent semiconductor requirements for the cooling of wafers during etch or other semiconductor processes. The TU /8 Plus is designed for reliability, up-time performance and ease of maintenance, providing continuous trouble-free operation across wide temperature extremes. This, combined with O Edwards worldwide service hubs and on-site service support, makes the TU /8 Plus the new industry standard. Features & benefits Magnetically driven coolant pump for leak free, reliable operation Wide operating temperature - to +8 Temperature set at. increments Typical stability +/- djustable coolant flow rate -6 gpm SEMI S-93 qualified E marked; low voltage directive compliant Perfluorocarbon coolant for ion free operation Remote temperature sensing capability Stainless steel pressurized coolant system MTF of 5+ hours Refrigerant & coolant lines are helium leak checked O Edwards worldwide service PPLITIONS The TU /8 Plus Temperature ontrol Unit is a single channel temperature control unit which supplies perfluorocarbon coolant in a closed loop for temperature control of semiconductor process chambers and wafers during etch and other processes. The TU /8 Plus is designed for reliability, up-time performance and ease of maintenance, providing continuous and trouble-free cooling across a wide temperature range. Use the TU Plus for cooling electrostatic chucks, quartz windows, chamber domes and walls. The semiconductor industry demands equipment with maximum up-time when operated continuously 365 days a year. Meeting these needs was paramount in the design of the TU /8 Plus, resulting in a leak-free, highly reliable and environmentally friendly temperature controller. The F free temperature controller is SEMI S-93 qualified, E marked (complies with the EU low voltage directive), and manufactured in a factory certified to ISO9. The TU /8 Plus has a closed loop perfluorocarbon coolant system. The use of a non-conductive coolant instead of deionized water means that the TU /8 Plus can be used in systems with large plasma and magnetic fields. Use of perfluorocarbon coolant also removes the need to monitor coolant resistivity and maintain coolant filters. The TU /8 Plus can either be rack mounted or stacked. The front and side panels are easy to remove for routine maintenance. s with all O Edwards products, the TU /8 Plus is backed by our worldwide technical product support and service. The O Edwards temperature control product line provides a full range of semiconductor process compatible designs for any process type. Models are available with digital communications, special temperature ranges, customized heat loads and multi-chamber operations. TEHNIL DT ontrol temperature range - to 8 ontrol temperature set point. ontrol temperature stability ±. ooling capacity (at TU output, cooling water 5 ) t - 75 W t - to +8 W Heating capacity at 8 V 8 W Temperature ramp (no load) 5 to 8 <5 min 5 to -3 <5 min Perfluorocarbon coolant system oolant type Pump type 3M F77, 3M F383, F87, usimont Galden HT, or 3M HFE 75 Magnetic drive gear pump 3/ HP motor Factory set pump flow rate (,. bar / 6 psi). l min - (3 gal min - ) Maximum coolant supply pressure psi djustable coolant flowrate l min - (-6 gal min - ) Pump motor power oolant connections ½ inch Swagelok union connector (supplied) Refrigeration system Refrigerant HF R ompressor.8 kw, 3-ph, hermetically sealed Heat exchanger High efficiency stainless steel cross flow plate ooling water requirements Flow rate. -.8 l min - (3-6 gal min - ) Temperature 6 Pressure. 6.9 bar ( psi) ooling water connections ½ inch brass compression fitting and ½ inch brass hose barb adapters (supplied) Electrical supply Voltage -8 V, 3-ph 5/6 Hz, balanced delta onnection type 3 fused, NEM L-3R Phase rotation and low voltage monitor uilt-in Electrical cable 3.5 m ( ft), with 5 pin twist (L-3P) lock plug