PS-A PRESSURE SENSOR PS-A (ADP5) (built-in amplification and temperature compensating circuit)
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- Rolf Owens
- 5 years ago
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1 PS-A (ADP) New <Low type> RoHS Directive compatibility information FEATURES. Contains built-in amplification and temperature compensation circuit. Circuit design and adjustment of are not required by users. sensor with built-in amplification and temperature compensation circuit. Low type ideal for water level detection applications added to lineup.. High-level precision and high reliability realized. Overall accuracy is ±.% FS (Standard type) Overall accuracy is ±% FS (Economy type) Overall accuracy is ±.% FS (Low type). Compact sensor unit that saves space. Same size and as previous PS sensor. Footprint 7. mm (W) x 7. mm (D). mm (W) x. mm (D) (Low type) Example of (ADP) Drive voltage: V DC rated voltage; ambient temperature: C 77 F Output voltage, V (gauge ), (kpa) PS-A PRESSURE SENSOR (built-in amplification and temperature compensating circuit) TYPICAL APPLICATIONS (Please evaluate under actual conditions before using.) Industrial use ( switches and pneumatic devices, etc.) Medical use (blood monitors, oxygen concentrators, air beds, etc.) Other pneumatically operated devices Low type. Water level detection for household appliances Washing machines and dishwashers.. Air control Clean rooms and separate rooms for smokers.. Medical applications Respiratory equipment monitoring, etc. ORDERING INFORMATION <Product name> PS-A sensor <Terminal profile> : DIP terminal ADP <Rated > : ± kpa : kpa : kpa : kpa : kpa : kpa 6: kpa 7:, kpa A: kpa B6: 6 kpa (Low type) < inlet hole> : length mm, diameter mm : length mm, diameter mm : length. mm, diameter. mm <Type> None: Standard type (with glass base) : Economy type (without glass base) Note: Some part numbers may not be available depending on the combination. Please refer to the Table of Product Types on the next page. /8
2 PRODUCT TYPES inlet hole length Terminal PS-A (ADP) Part No. Low type mm mm mm.mm DIP terminal DIP terminal DIP terminal DIP terminal Standard type (with glass base) SPECIFICATIONS. Standard type Type of Item Standard type (with glass base) Remarks Gauge medium Air Note* Rated Unit: kpa ±, Max. applied Drive voltage Twice the rated ±.V DC Temperature compensation range to C to F. times the rated Offset voltage.±..±.v Note* Rated output voltage Overall accuracy Current consumption Output impedance Source current Sink current ±kpa ADP ADP kpa ADP ADP kpa ADP ADP kpa ADP ADP kpa ADP ADP kpa ADP ADP kpa ADP6 ADP6,kPa ADP7 ADP7 Economy type (without glass base) kpa ADPA Low type 6kPa ADPB6 ADPB6.±. (when +kpa) ±.%FS Max. ma Approx. Ω Max..mA Max. ma.±.v Note* Notes). Please consult us for media other than air.. Indicates output when drive voltage is V. Although output fluctuates due to fluctuations in the drive voltage, this is not included.. Overall accuracy indicates the accuracy of the offset voltage and rated output voltage at temperatures between to C to F (Low type: to 7 C to 8 F). (FS=V). Overall accuracy indicates accuracy after adjusting auto offset to zero. Note* Note*. Economy type Type of Item Economy type (without glass base) Remarks Gauge medium Air Note* Rated Unit: kpa Max. applied Drive voltage Twice the rated ±.V DC Temperature compensation range to C to F Offset voltage.±.9v Note* Span voltage.±.v Note* Overall accuracy Current consumption Output impedance Source current Sink current Notes). Please consult us for media other than air.. Indicates output when drive voltage is V. Although output fluctuates due to fluctuations in the drive voltage, this is not included.. Overall accuracy indicates the accuracy of the offset voltage and rated output voltage at temperatures between to C to F (Low type: to 7 C to 8 F). (FS=V) ±%FS Max. ma Ω (typ.) Max..mA Max..mA Note* Note* /8
3 PS-A (ADP). Low type Type of Item Low type Remarks Gauge medium Air Note* Rated Unit: kpa 6 Max. applied Drive voltage Twice the rated ±.V DC Temperature compensation range to 7 C to 8 F Offset voltage.v Note* Span voltage.v Note* Overall accuracy ±.%FS Notes*, * and * Current consumption Output impedance Source current Sink current Max. ma Approx. Ω Max..mA Max..mA Notes). Please consult us for media other than air.. Indicates output when drive voltage is V. Although output fluctuates due to fluctuations in the drive voltage, this is not included.. Overall accuracy indicates the accuracy of the offset voltage and span voltage at temperatures between to 7 C to 8 F (FS=V). Overall accuracy indicates accuracy after adjusting auto offset to zero. Rated voltage, V Voff (V) Vmout Viout Vmoff Vioff kpa Pmeas 6kPa Ideal line Voff = Vioff-Vmoff Vioff = Ideal offset voltage ( C) Vmoff = Measured offset voltage (± C). Where no particular temperature is indicated, the specification is for use at C 77 F. Auto offset zero: Measured output Vmout compensated to ideal output Viout. Viout = Vmout Voff Viout = ideal output voltage at Pmeas Vmoff = ideal output voltage at Pmeas DATA. Standard and Economy types.-() Output voltage ADP7 Drive voltage: V DC Temperature: C 77 F Applied : to +,kpa.-() Overall accuracy (Offset voltage) ADP7 Drive voltage: V DC Temperature: to C to F Applied : kpa.-() Overall accuracy (Rated output voltage) ADP7 Drive voltage: V DC Temperature: to C to F Applied : +,kpa Output voltage, V Accuracy, %FS Accuracy, %FS (kpa) Temperature, C Temperature, C.-() Output voltage ADP Drive voltage: V DC Temperature: C 77 F Applied : to +kpa.-() Overall accuracy (Offset voltage) ADP Drive voltage: V DC Temperature: to C to F Applied : kpa.-() Overall accuracy (Rated output voltage) ADP Drive voltage: V DC Temperature: to C to F Applied : +kpa Output voltage, V Accuracy, %FS Accuracy, %FS , kpa Temperature, C Temperature, C 6 /8
4 . Low type. Output voltage ADPB6 Drive voltage: V Temperature: C 77 F Applied : to 6kPa. THB (high temperature high humidity bias test) ADPB6 Within 8 C and 8% RH V applied between No. (Vdd) and No. (GND) Applied : kpa PS-A (ADP) Output voltage, V.. Offset voltage, V.6. Span voltage, V Applied, kpa. intial h h. intial h h. Ambient temperature Ambient temperature: C C C 6 C 7 C... Shock test ADPB6 Shock applied: 98 m/s times in x, y and z s Applied : kpa Offset voltage, V.6. Span voltage, V..9 Offset voltage, V Temperature, C. 6 7 Temperature, C. intial after test. Vibration test ADPB6 Vibration applied: to Hz, amplitude:.mm, x, y and z s, hrs each Applied : kpa Span voltage, V..9 Offset voltage, V.6. Span voltage, V intial after test. intial after test. intial after test 6. Temperature/humidity cycle test ADPB6 Exposed to cycles in the temperature and humidity conditions given below. Applied : kpa Temp. 6 C C Time 9% RH cycle (h) 6 C C % RH C.h h.h.h h.h.h.h h Offset voltage, V Span voltage, V intial cyc. intial cyc /8 7
5 PS-A (ADP). Evaluation test Classification Tested item Tested condition Result Environmental Endurance Mechanical Soldering Resistance Storage at high temperature Temperature: Left in a 8 C 8 F constant temperature bath; Time: hrs. Storage at low temperature Temperature: Left in a C F constant temperature bath; Time: hrs. Humidity Temperature/humidity: Left at C F, 9% RH; Time: hrs. Temperature cycle Temperature: C to 8 C F to 8 F; cycle: min.; Times of cycle: High temperature/high humidity operation Vibration resistance Temperature/humidity: C F, 9% RH; Operation times: 6, rated voltage applied Double amplitude:. mm.9 inch; Vibration: to Hz; Applied vibration : X, Y, Z s; Times: hrs each Dropping resistance Dropping height: 7 cm 9.8 inch; Times: times Terminal strength Pulling strength: 9.8 N { kgf}, sec.; Bending strength:.9 N {. kgf}, left and right 9 time Soldered in DIP soldering bath Temperature: C 6 F; Time: sec. Temperature (DIP) Temperature: 6 C F; Time: sec. DIMENSIONS mm inch General tolerance: ±. ±.. DIP terminal ( inlet hole: mm) ADP Recommended PC board pattern (TOP VIEW :) Vcc NC Vout inlet hole. dia..87 dia. 7. max..76 max. 7. max..8 max dia. 6-. dia Atmospheric inlet hole. dia..8 dia GND NC NC GND NC NC JAPAN Vcc NC Vout R.7 -R.8 R. R Terminal connection diagram Vcc (V DC) Vout C GND Terminal No. Name Vcc (Power supply [+]) NC (No connection) Vout (Output) NC (No connection) NC (No connection) 6 GND (Ground). DIP terminal ( inlet hole: mm) ADP /ADPA inlet hole. dia..87 dia.. dia..8 dia Vcc NC Vout GND NC NC 7. max..76 max. -R.7 -R.8 R. R max..8 max. Recommended PC board pattern (TOP VIEW :) Terminal connection diagram Vcc (V DC) C 6-.9 dia. 6-. dia GND Vout Atmospheric inlet hole..98 GND NC NC JAPAN Vcc NC Vout Terminal No. Name Vcc (Power supply [+]) NC (No connection) Vout (Output) NC (No connection) NC (No connection) 6 GND (Ground) 8 /8
6 . Low type ( inlet hole length: mm) ADPB6 P. =7.6 P. =... PS-A (ADP) mm inch General tolerance: ±. ±. Recommended PC board pattern P. =7.6 P. =. inlet hole dia dia..97. P/N,Lot.. B6 7 JAPAN.7. R. R...9. dia..8 dia Terminal connection diagram NC VccGnd Vout.76. Atmospheric inlet hole. µf. µf NC NC NC NC Terminal No. Name NC Vcc (Power supply [+]) GND (Ground) Vout (Output) NC 6 NC 7 NC 8 NC. Low type ( inlet hole length:.mm) ADPB6 Recommended PC board pattern inlet hole....9 P. =7.6 P. =. 8-. dia dia. P. =7.6 P. = R. R...9. dia.. dia. Terminal connection diagram P/N,Lot C. R. (.6) (.) B6 7 JAPAN µf. µf NC VccGnd Vout Atmospheric inlet hole NC NC NC NC Terminal No. NC Name Vcc (Power supply [+]) GND (Ground) Vout (Output) NC 6 NC 7 NC 8 NC /8 9
7 PS-A (ADP) NOTES. Mounting Use lands on the printed-circuit boards to which the sensor can be securely fixed.. Soldering Due to its small size, the thermal capacity of the sensor DIP type is low. Therefore, take steps to minimize the effects of external heat. Damage and changes to may occur due to heat deformation. Use a non-corrosive resin type of flux. Since the sensor DIP type is exposed to the atmosphere, do not allow flux to enter inside. ) Manual soldering Set the soldering tip from 6 to C to 7 F (W), and solder for no more than seconds. Please note that output may change if the is applied on the terminals when the soldering. Thoroughly clean the soldering iron. ) DIP soldering (DIP terminal type) Please keep the DIP solder bath temperature no higher than 6 C F. When soldering, heat should be applied no longer than five seconds. When mounting onto a PCB of low thermal capacity, please avoid DIP soldering as this may cause heat deformity. ) Solder reworking Finish reworking in one operation. For reworking of the solder bridge, use a soldering iron with a flat tip. Please do not add more flux when reworking. Please use a soldering iron that is below the temperature given in the specifications in order to maintain the correct temperature at the tip of the soldering iron. ) Too much force on the terminals will cause deformation and loss in effectiveness of the solder. Therefore, please avoid dropping and careless handling of the product. ) Please control warping of the PCB within. mm of the sensor width. 6) When cut folding the PCB after mounting the sensor, take measures to prevent stress to the soldered parts. 7) The sensor terminals are designed to be exposed, so contact of the terminals with metal shards and the like will cause output errors. Therefore, please be careful and prevent things such as metal shards and hands from contacting the terminals. 8) To prevent degradation of the PCB insulation after soldering, please be careful not to get chemicals on the sensor when coating. 9) Please consult us regarding the use of lead-free solder.. Connections ) Please perform connections correctly in accordance with the terminal connection diagram. In particular, be careful not to reverse wire the power supply as this will cause damage or degrade to the product. ) Do not connect terminals that are not used. This can cause malfunction of the sensor.. Cleaning ) Since the sensor chip is exposed to the atmosphere, do not allow cleaning fluid to enter inside. ) Avoid ultrasonic cleaning since this may cause breaks or disconnections in the wiring.. Environment ) Please avoid using or storing the sensor chip in a place exposed to corrosive gases (such as the gases given off by organic solvents, sulfurous acid gas, hydrogen sulfides, etc.) which will adversely affect the performance of the sensor chip. ) To ensure resistance to power supply superimposed noise, you must provide a capacitor at the power supply input terminal of the sensor in order to stabilize the power supply voltage. We recommend to provide. µf and, pf capacitor in parallel. Please confirm the noise resistance with the actual equipment and choose adequate capacitor. ) Since the internal circuitry may be destroyed if an external surge voltages is supplied, provide an element which will absorb the surges. ) Malfunctioning may occur if the product is in the vicinity of electrical noise such as that from static electricity, lightning, a broadcasting station, an amateur radio, or a mobile phone. ) Since this sensor chip does not have a water-proof construction, please do not use the sensor in a location where it may be sprayed with water, etc. 6) Avoid using the sensors chip in an environment where condensation may form. Furthermore, its output may fluctuate if any moisture adhering to it freezes. 7) The sensor chip is constructed in such a way that its output will fluctuate when it is exposed to light. Especially when is to be applied by means of a transparent tube, take steps to prevent the sensor chip from being exposed to light. 8) Avoid using the sensor chip where it will be susceptible to ultrasonic or other high-frequency vibration. 6. Quality check under actual loading conditions To assure reliability, check the sensor under actual loading conditions. Avoid any situation that may adversely affect its performance. 7. Other handling precautions ) That using the wrong range or mounting method may result in accidents. ) The only direct medium you can use is dry air. The use of other media, in particular, corrosive gases (organic solvent based gases, sulfurous acid based gases, and hydrogen sulfide based gases, etc.) and media that contains moisture or foreign substances will cause malfunction and damage. Please do not use them. ) The sensor chip is positioned inside the inlet. Never poke wires or other foreign matter through the inlet since they may damage the chip or block the inlet. Avoid use when the atmospheric inlet is blocked. ) Use an operating which is within the rated range. Using a beyond this range may cause damage. ) Since static charge can damage the sensor chip, bear in mind the following handling precautions. When storing the sensor chips, use a conductive material to short the pins or wrap the entire chip in aluminum foil. Plastic containers should not be used to store or transport the chips since they readily become charged. When using the sensor chips, all the charged articles on the bench surface and the work personnel should be grounded so that any ambient static will be safely discharged. 6) Based on the involved, give due consideration to the securing of the sensor DIP type and to the securing and selection of the inlet tube. Consult us if you have any queries. /8
8 ULTRA SMALL HIGHLY SEMICONDUCTOR PRESSURE SENSOR PS (ADP) PS PRESSURE SENSOR Silicon <Cross-section of Sensor Chip> Piezo resistance strain gauge Glass base Anode junction Highly reliable wire bonding technology Ultra-small miniature High reliability die bonding technology Very strong, heat resistant body RoHS Directive compatibility information ORDERING INFORMATION FEATURES. Ultra-miniature size: much more compact than the PF sensors offered in the past Base area: 7.(W) x 7.(D) mm.8(w) x.8(d) inch Only 6% in mounting area and 9% in overall height of previous models (PF) PS Existing products High-level precision and linearity A high degree of precision and linear detector response have been achieved by applying the semiconductor strain gauge system. Highly reproducible based on repeated.. Impressive line-up of models Taking their place alongside the standard kω bridge resistance models are those with a.kω resistance which is optimally suited to V drive circuits. Economy model (no glass base) gives outstanding value for consumer appliances kpa (. kgf/cm ) and 9 kpa (. kgf/ cm ) units are also available.. Improved ease of DIP pin insertion into printed circuit boards The ends of the DIP pins are chamfered to ensure easy insertion into printed circuit boards. Example of (ADP) Drive current:. ma rated current; ambient temperature: C 77 F Output voltage, mv (gauge ), (kpa) TYPICAL APPLICATIONS Medical equipment: Electronic hemodynamometer Home appliance: Vacuum cleaner Gas equipment: Microprocessor gas meter, gas leakage detector Industrial equipment: Absorption device, etc. Ex. ADP Part No. ADP: PS sensor Terminal profile and : DIP terminal: : DIP terminal: Direction opposite the inlet inlet Rated :.9 kpa :.7 kpa :. kpa : 9. kpa : 98. kpa : 96. kpa 6:. kpa 7: 9. kpa 8: 8.6 kpa 9: 98.7 kpa A:. kpa Type : Standard type (With glass base) : Economy type (Without glass base) Note: Some part numbers may not be available depending on the combination. Please refer to the Table of Product Types, below. Bridge resistance :.kω :.kω /8
9 PS (ADP) PRODUCT TYPES. DIP terminal Standard type (with glass base) Economy type (without glass base) SPECIFICATIONS Type Standard type (With glass base) Economy type (Without glass base) Type of Gauge medium Air (For other medium, please consult us.) Rated Unit: kpa Max. applied Twice the rated. times the rated Twice the rated Bridge resistance ± Ω ±7 Ω Ambient temperature Storage temperature to C to F (no freezing or condensation) to C to 8 F (no freezing or condensation) Notes). Unless otherwise specified, measurements were taken with a drive current of ±. ma and humidity ranging from % to 8%.. Please consult us if a medium other than air is to be used.. This is the regulation which applies within the compensation temperature range.. Please consult us if the intended use involves a negative.. times the rated Twice the rated ±6 Ω to + C + to + F to +7 C to +8 F Standard temperature C 77 F C 86 F C 77 F Temperature compensation range Drive current (constant current) Output span voltage Terminal ± mv DIP terminal: Direction opposite the inlet.kω DIP terminal: inlet to C to F DIP terminal: Direction opposite the inlet to 6 C to F to C to F. ma DC. ma DC. ma DC ± mv 6± mv.±. mv ± Ω to + C to + F to + C to +8 F Offset voltage ± mv ± mv ± mv Linearity ±.7%FS ±.%FS ±.%FS ±.%FS ±.6%FS ±.%FS ±.%FS hysteresis ±.6%FS ±.%FS ±.%FS ±.%FS ±.%FS ±.7%FS Offset voltage-temperature ±%FS ±.%FS ±.%FS ±%FS ±8%FS ( to C to F) Sensitivity-temperature ( to C to F) ±%FS ±.%FS ±.%FS ±.%FS.kΩ DIP terminal: inlet.9kpa ADP ADP.7kPa ADP ADP.kPa ADP ADP 9.kPa ADP ADP 98.kPa ADP ADP ADP ADP 96.kPa ADP ADP.kPa ADP6 ADP6 9.kPa ADP7 ADP7 8.6kPa ADP8 ADP8 98.7kPa ADP9 ADP9 ADP9 ADP9.kPa ADPA ADPA 9.kPa ADP ADP to C to F 8± mv /8
10 DATA. Characteristics data -() Output ADP9 Drive current:. ma; temperature: C 86 F Output voltage (mv) / 98.7 (kpa) -() Offset voltage temperature ADP9 Drive current:. ma; rating ±.%FS Offset voltage temperature (%FS) Temperature ( C F) PS (ADP) -() Sensitivity temperature (%FS) ADP9 Drive current:. ma; rating ±.%FS Sensitivity temperature (%FS) Temperature ( C F). cycle range ( to rated ) Tested sample: ADP9, temperature: C F, No. of cycle: 6 -() Offset voltage range -() Output span voltage range Offset voltage range (%FS) Output span voltage range (%FS) Even after testing for million times, the variations in the offset voltage and output span voltage are minimal. 6 6 cycle (cycle) cycle (cycle). Evaluation test Environmental Endurance Mechanical Soldering Resistance Tested item Tested condition Result Storage at high temperature Storage at low temperature Humidity Temperature cycle High temperature/high humidity operation Vibration resistance Dropping resistance Terminal strength Soldered in DIP soldering bath Temperature Note: For details other than listed above, please consult us. Temperature: Left in a C 8 F constant temperature bath Time:, hrs. Temperature: Left in a C F constant temperature bath Time:, hrs. Temperature/humidity: Left at C F, 9% RH Time:, hrs. Temperature: C to C F to 8 F cycle: min. Times of cycle: Temperature/humidity: C F, 9% RH Operation times: 6, rated voltage applied Double amplitude:. mm.9 inch Vibration: to Hz Applied vibration : X, Y, Z s Times: hrs each Dropping height: 7 cm 9.8 inch Times: times Pulling strength: 9.8 N { kgf}, sec. Bending strength:.9 N {. kgf}, left and right 9 time Temperature: C 6 F Time: sec. Temperature: 6 C F Time: sec. /8
11 PS (ADP) DIMENSIONS mm inch General tolerance: ±. ±.. Terminal : DIP terminal Direction opposite the inlet ADP Recommended PC board pattern (BOTTOM VIEW) dia. 6-. dia. inlet hole. dia.. dia dia..7 dia.. dia..98 dia Atmospheric inlet hole 6 JAPAN R. R.8 8. Max.. Max Tolerance: ±. ±. Terminal connection diagram +Input R R +Output R R Output Input 6 is no connection Terminal No. Name Power supply (+) Output (+) Power supply ( ) Power supply ( ) Output ( ) 6 No connection Note: Leave terminal 6 unconnected.. Terminal : DIP terminal inlet ADP Recommended PC board pattern (BOTTOM VIEW) dia. 6-. dia. inlet hole. dia.. dia dia..7 dia dia dia R. R.8 dia..97 dia Tolerance: ±. ±. Terminal connection diagram Atmospheric inlet hole 6 JAPAN 8. Max.. Max. +Input R R +Output R R Output Input 6 is no connection Terminal No. Name Power supply (+) Output (+) Power supply ( ) Power supply ( ) Output ( ) 6 No connection Note: Leave terminal 6 unconnected. /8
12 APPLICATION CIRCUIT DIAGRAM (EXAMPLE) The sensor is designed to convert a voltage by means of constant current drive and then, if necessary, it amplifies the voltage for use. The circuit shown below is a typical example of a circuit in which the sensor is used. Amplifier circuit unit Constant current circuit unit sensor OP AMP NOTES. Mounting Use lands on the printed-circuit boards to which the sensor can be securely fixed.. Soldering Due to its small size, the thermal capacity of the sensor DIP type is low. Therefore, take steps to minimize the effects of external heat. Damage and changes to may occur due to heat deformation. Use a non-corrosive resin type of flux. Since the sensor DIP type is exposed to the atmosphere, do not allow flux to enter inside. ) Manual soldering Set the soldering tip from 6 to C to 7 F (W), and solder for no more than seconds. Please note that output may change if the is applied on the terminals when the soldering. Thoroughly clean the soldering iron. ) DIP soldering (DIP terminal type) Please keep the DIP solder bath temperature no higher than 6 C F. When soldering, heat should be applied no longer than five seconds. When mounting onto a PCB of low thermal capacity, please avoid DIP soldering as this may cause heat deformity. ) Solder reworking Finish reworking in one operation. For reworking of the solder bridge, use a soldering iron with a flat tip. Please do not add more flux when reworking. Please use a soldering iron that is below the temperature given in the specifications in order to maintain the correct temperature at the tip of the soldering iron. ) Too much force on the terminals will cause deformation and loss in effectiveness of the solder. Therefore, please avoid dropping and careless handling of the product. ) Please control warping of the PCB within. mm of the sensor width. 6) When cut folding the PCB after mounting the sensor, take measures to prevent stress to the soldered parts. 7) The sensor terminals are designed to be exposed, so contact of the terminals with metal shards and the like will cause output errors. Therefore, please be careful and prevent things such as metal shards and hands from contacting the terminals. 8) To prevent degradation of the PCB insulation after soldering, please be careful not to get chemicals on the sensor when coating. 9) Please consult us regarding the use of lead-free solder.. Cleaning ) Since the sensor chip is exposed to the atmosphere, do not allow cleaning fluid to enter inside. ) Avoid ultrasonic cleaning since this may cause breaks or disconnections in the wiring.. Environment ) Please avoid using or storing the sensor chip in a place exposed to corrosive gases (such as the gases given off by organic solvents, sulfurous acid gas, hydrogen sulfides, etc.) which will adversely affect the performance of the sensor chip. ) Since this sensor chip does not have a water-proof construction, please do not use the sensor in a location where it may be sprayed with water, etc. ) Avoid using the sensors chip in an environment where condensation may form. Furthermore, its output may fluctuate if any moisture adhering to it freezes. ) The sensor chip is constructed in such a way that its output will fluctuate when it is exposed to light. Especially when is to be applied by means of a transparent tube, take steps to prevent the sensor chip from being exposed to light. ) Avoid using the sensor chip where it will be susceptible to ultrasonic or MOUNTING METHOD The general method for transmitting air s differs depending on whether the is low or high. Checkpoints for use <> Select a inlet pipe which is sturdy enough to prevent leaks. <> Fix the inlet pipe securely so as to prevent leaks. <> Do not block the inlet pipe. PS (ADP) other high-frequency vibration.. Quality check under actual loading conditions To assure reliability, check the sensor under actual loading conditions. Avoid any situation that may adversely affect its performance. 6. Other handling precautions ) That using the wrong range or mounting method may result in accidents. ) The only direct medium you can use is dry air. The use of other media, in particular, corrosive gases (organic solvent based gases, sulfurous acid based gases, and hydrogen sulfide based gases, etc.) and media that contains moisture or foreign substances will cause malfunction and damage. Please do not use them. ) The sensor chip is positioned inside the inlet. Never poke wires or other foreign matter through the inlet since they may damage the chip or block the inlet. Avoid use when the atmospheric inlet is blocked. ) Use an operating which is within the rated range. Using a beyond this range may cause damage. ) Since static charge can damage the sensor chip, bear in mind the following handling precautions. When storing the sensor chips, use a conductive material to short the pins or wrap the entire chip in aluminum foil. Plastic containers should not be used to store or transport the chips since they readily become charged. When using the sensor chips, all the charged articles on the bench surface and the work personnel should be grounded so that any ambient static will be safely discharged. 6) Based on the involved, give due consideration to the securing of the sensor DIP type and to the securing and selection of the inlet tube. Consult us if you have any queries. Methods of transmitting air s When the When the is low is high (.9 to 98. kpa) (96. to 98.7 kpa) Printedcircuit board Tube Printedcircuit board O-ring inlet pipe If a tube is used as the inlet pipe, it may become disengaged. Therefore, use a sturdy tube and secure it using O-rings. OP AMP OP AMP /8
13 PF (ADP) PRECISION SEMICONDUCTOR PRESSURE SENSOR PF PRESSURE SENSOR <Actual size> <Cross-section of Sensor Chip> Silicon Piezo resistance strain gauge Glass base Anode junction Highly reliable wire bonding technology High reliability die bonding technology Very strong, heat resistant body RoHS Directive compatibility information FEATURES. A wide range of rated, including a minute There are types of sensors covering a wide range of rated from a minute between.9 kpa {. kgf/cm }, to a maximum of 98.7 kpa { kgf/cm }.. Realization of highly accurate, linear This sensor employs a semiconductor strain gauge method, ensuring accurate and linear detection. It also has excellent repeatability of.. Impressive line-up of models Taking their place alongside the standard kω bridge resistance models are those with a.kω resistance which is optimally suited to V drive circuits. Economy model (no glass base) gives outstanding value for consumer appliances kpa (. kgf/cm ) and 9 kpa (. kgf/ cm ) units are also available. Example of (ADP) Drive current:. ma rated current; ambient temperature: C 77 F Output voltage, mv (gauge ), (kpa) TYPICAL APPLICATIONS Medical equipment: Electronic hemodynamometer Home appliance: Vacuum cleaner Gas equipment: Microprocessor gas meter, gas leakage detector Industrial equipment: Absorption device, etc. ORDERING INFORMATION Ex. ADP Part No. ADP: PF sensor Terminal profile and : DIP terminal: : DIP terminal: Direction opposite the inlet inlet Rated :.9 kpa :.7 kpa :. kpa : 9. kpa : 98. kpa : 96. kpa 6:. kpa 7: 9. kpa 8: 8.6 kpa 9: 98.7 kpa A:. kpa Type : Standard type (With glass base) : Economy type (Without glass base) Note: Some part numbers may not be available depending on the combination. Please refer to the Table of Product Types, below. Bridge resistance Nill:.kΩ :.kω 6 /8
14 PRODUCT TYPES. DIP terminal Standard type (with glass base) Economy type (without glass base) SPECIFICATIONS PF (ADP) Type Standard type (With glass base) Economy type (Without glass base) Type of Gauge medium Air (For other medium, please consult us.) Rated Unit: kpa Max. applied Bridge resistance Ambient temperature Storage temperature Temperature compensation range Drive current (constant current) Output span voltage Terminal ± mv DIP terminal: Direction opposite the inlet.kω DIP terminal: inlet Twice the rated ± Ω to C to F (no freezing or condensation) to C to 8 F (no freezing or condensation) to C to F. times the rated Twice the rated ±6 Ω to + C + to + F to +7 C to +8 F to C to F. ma DC. ma DC ± mv DIP terminal: Direction opposite the inlet.±. mv ± Ω to + C to + F to + C to +8 F to C to F Offset voltage ± mv ± mv ± mv Linearity ±.7%FS ±.%FS ±.%FS ±.%FS ±.6%FS ±.%FS hysteresis ±.6%FS ±.%FS ±.%FS ±.%FS ±.7%FS Offset voltage-temperature ±%FS ±.%FS ±%FS ±8%FS ( to C to F) Sensitivity-temperature ( to C to F) ±%FS ±.%FS ±.%FS ±.%FS Notes) Unless otherwise specified, measurements were taken with a drive current of. ma ±. ma at a temperature of C 77 F and humidity ranging from % to 8%.. Please consult us if a medium other than air is to be used.. This is the regulation which applies within the compensation temperature range.. Please consult us if the intended use involves a negative..kω DIP terminal: inlet.9kpa ADP ADP.7kPa ADP ADP.kPa ADP ADP 9.kPa ADP ADP 98.kPa ADP ADP 96.kPa ADP ADP.kPa ADP6 ADP6 9.kPa ADP7 ADP7 8.6kPa ADP8 ADP8 98.7kPa ADP9 ADP9.kPa ADPA ADPA 9.kPa ADP ADP 8± mv /8 7
15 PF (ADP) DATA. Characteristics data -() Output ADP Drive current:. ma; temperature: C 77 F Output voltage (mv) Rated kpa -() Offset voltage temperature ADP Drive current:. ma; rating ±%FS Offset voltage temperature (%FS) 7 Temperature ( C F) -() Sensitivity temperature (%FS) ADP Drive current:. ma; rating ±.%FS Sensitivity temperature (%FS) 7 Temperature ( C F). cycle range ( to rated ) Tested sample: ADP, temperature: C 77 F -() Offset voltage range -() Output span voltage range Offset voltage range (%FS) Output span voltage range (%FS) Even after testing for million times, the variations in the offset voltage and output span voltage are minimal. 6 6 cycle (cycle) cycle (cycle). Evaluation test Environmental Endurance Mechanical Soldering Resistance Tested item Tested condition Result Storage at high temperature Storage at low temperature Humidity Temperature cycle High temperature/high humidity operation Vibration resistance Dropping resistance Terminal strength Soldered in DIP soldering bath Temperature Note: For details other than listed above, please consult us. Temperature: Left in a C 8 F constant temperature bath Time:, hrs. Temperature: Left in a C F constant temperature bath Time:, hrs. Temperature/humidity: Left at C F, 9% RH Time:, hrs. Temperature: C to C F to 8 F cycle: min. Times of cycle: Temperature/humidity: C F, 9% RH Operation times: 6, rated voltage applied Double amplitude:. mm.9 inch Vibration: to Hz Applied vibration : X, Y, Z s Times: hrs each Dropping height: 7 cm 9.8 inch Times: times Pulling strength: 9.8 N { kgf}, sec. Bending strength:.9 N {. kgf}, left and right 9 time Temperature: C 6 F Time: sec. Temperature: 6 C F Time: sec. 8 /8
16 PF (ADP) DIMENSIONS mm inch General tolerance: ±. ±.. Terminal : Direction opposite the inlet derection ADP ( ) Recommended PC board pattern (BOTTOM VIEW) Atmospheric inlet hole.9 inlet hole.8 dia.. dia dia. 6-. dia dia..8 dia..6. C. C R. R. Tolerance: ±. ±. Terminal connection diagram +Input to +Output R R Input R R Output JAPAN Terminal No. Name Output ( ) Power supply (+) Output (+) No connection Power supply ( ) 6 Output ( ) Note: Leave terminal 6 unconnected.. Terminal : inlet ADP ( ) Recommended PC board pattern (BOTTOM VIEW) Atmospheric inlet hole.9 inlet hole.8 dia.. dia dia. 6-. dia dia..6 dia R.. dia..8 dia. C.. to...8. Tolerance: ±. ±. Terminal connection diagram +Input Output R R R R Output Input JAPAN Terminal No. Name Output ( ) Power supply (+) Output (+) No connection Power supply ( ) 6 Output ( ) Note: Leave terminal 6 unconnected. /8 9
17 PF (ADP) APPLICATION CIRCUIT DIAGRAM (EXAMPLE) The sensor is designed to convert a voltage by means of constant current drive and then, if necessary, it amplifies the voltage for use. The circuit shown below is a typical example of a circuit in which the sensor is used. Amplifier circuit unit Constant current circuit unit sensor OP AMP NOTES. Mounting Use lands on the printed-circuit boards to which the sensor can be securely fixed.. Soldering Due to its small size, the thermal capacity of the sensor DIP type is low. Therefore, take steps to minimize the effects of external heat. Damage and changes to may occur due to heat deformation. Use a non-corrosive resin type of flux. Since the sensor DIP type is exposed to the atmosphere, do not allow flux to enter inside. ) Manual soldering Set the soldering tip from 6 to C to 7 F (W), and solder for no more than seconds. Please note that output may change if the is applied on the terminals when the soldering. Thoroughly clean the soldering iron. ) DIP soldering (DIP terminal type) Please keep the DIP solder bath temperature no higher than 6 C F. When soldering, heat should be applied no longer than five seconds. When mounting onto a PCB of low thermal capacity, please avoid DIP soldering as this may cause heat deformity. ) Solder reworking Finish reworking in one operation. For reworking of the solder bridge, use a soldering iron with a flat tip. Please do not add more flux when reworking. Please use a soldering iron that is below the temperature given in the specifications in order to maintain the correct temperature at the tip of the soldering iron. ) Too much force on the terminals will cause deformation and loss in effectiveness of the solder. Therefore, please avoid dropping and careless handling of the product. ) Please control warping of the PCB within. mm of the sensor width. 6) When cut folding the PCB after mounting the sensor, take measures to prevent stress to the soldered parts. 7) The sensor terminals are designed to be exposed, so contact of the terminals with metal shards and the like will cause output errors. Therefore, please be careful and prevent things such as metal shards and hands from contacting the terminals. 8) To prevent degradation of the PCB insulation after soldering, please be careful not to get chemicals on the sensor when coating. 9) Please consult us regarding the use of lead-free solder.. Cleaning ) Since the sensor chip is exposed to the atmosphere, do not allow cleaning fluid to enter inside. ) Avoid ultrasonic cleaning since this may cause breaks or disconnections in the wiring.. Environment ) Please avoid using or storing the sensor chip in a place exposed to corrosive gases (such as the gases given off by organic solvents, sulfurous acid gas, hydrogen sulfides, etc.) which will adversely affect the performance of the sensor chip. ) Since this sensor chip does not have a water-proof construction, please do not use the sensor in a location where it may be sprayed with water, etc. ) Avoid using the sensors chip in an environment where condensation may form. Furthermore, its output may fluctuate if any moisture adhering to it freezes. ) The sensor chip is constructed in such a way that its output will fluctuate when it is exposed to light. Especially when is to be applied by means of a transparent tube, take steps to prevent the sensor chip from being exposed to light. ) Avoid using the sensor chip where it will be susceptible to ultrasonic or MOUNTING METHOD The general method for transmitting air s differs depending on whether the is low or high. Checkpoints for use <> Select a inlet pipe which is sturdy enough to prevent leaks. <> Fix the inlet pipe securely so as to prevent leaks. other high-frequency vibration.. Quality check under actual loading conditions To assure reliability, check the sensor under actual loading conditions. Avoid any situation that may adversely affect its performance. 6. Other handling precautions ) That using the wrong range or mounting method may result in accidents. ) The only direct medium you can use is dry air. The use of other media, in particular, corrosive gases (organic solvent based gases, sulfurous acid based gases, and hydrogen sulfide based gases, etc.) and media that contains moisture or foreign substances will cause malfunction and damage. Please do not use them. ) The sensor chip is positioned inside the inlet. Never poke wires or other foreign matter through the inlet since they may damage the chip or block the inlet. Avoid use when the atmospheric inlet is blocked. ) Use an operating which is within the rated range. Using a beyond this range may cause damage. ) Since static charge can damage the sensor chip, bear in mind the following handling precautions. When storing the sensor chips, use a conductive material to short the pins or wrap the entire chip in aluminum foil. Plastic containers should not be used to store or transport the chips since they readily become charged. When using the sensor chips, all the charged articles on the bench surface and the work personnel should be grounded so that any ambient static will be safely discharged. 6) Based on the involved, give due consideration to the securing of the sensor DIP type and to the securing and selection of the inlet tube. Consult us if you have any queries. Methods of transmitting air s When the When the is low is high (.9 to 98. kpa) (96. to 98.7 kpa) Printedcircuit board Tube Printedcircuit board O-ring inlet pipe If a tube is used as the inlet pipe, it may become disengaged. Therefore, use a sturdy tube and secure it using O-rings. OP AMP OP AMP /8
18 Glossary of Common Terms for Sensors Glossary of Common Terms for Sensors SAFETY PRECAUTIONS This product uses semiconductor components manufactured for use in general electronic devices (communication devices, measuring instruments and machine tools, etc.). Products that use these semiconductor components may malfunction or break down due to external noise or surges; therefore, please test sufficiently under actual conditions in order to verify performance and quality. To prevent infringement to life, body or property, please do all that is necessary to ensure safe design of the device (protection circuits such as fuses and breakers, and device redundancy, etc.), in order to be extra certain in the event of a malfunction. Be sure to obey the following in order to prevent injuries and accidents. Use with a drive current or voltage that does not exceed the rated values. Perform wiring only in accordance with the terminal connection diagram. Be particularly careful, since reverse power supply wiring can cause an accident due to circuit damage caused by such things as heat generation, smoke emission, and ignition. For safety, in particular if the application is of an important nature, be sure to take necessary precautions such as the implementation of a redundant safety circuit. Do not apply that exceeds the maximum allowable amount. Also, be careful that foreign objects do not intermix with the medium. Product damage or accidents due to blowout of the medium may occur. Take utmost care when securing the product and connecting the inlet. The product may blow apart or accidents due to blowout of the medium may occur. Be careful when handling in order to avoid cuts caused by the sharp-edged terminals. EXPLANATION OF TERMS. object This is what can be used to activate the sensor. (The Matsushita Electric Works sensor can be used with gas.). Rated The value up to which the specifications of the sensor are guaranteed.. Maximum applied The maximum that can be applied to the sensor, after which, when the is returned to below the rated range, the specifications of the sensor are guaranteed.. Temperature compensation range The temperature range across which the specification values of the sensor are guaranteed.. Drive current The supply current required to drive a sensor. 6. Output span voltage The difference between the rated output voltage and the offset voltage. The output span voltage is also called the full-scale voltage (FS). 7. Offset voltage The output voltage of a sensor when no is applied. 8. Rated output voltage Output voltage when rated is applied. 9. Linearity When the is varied from no load to the rated, the linearity is the amount of shift between the straight line that joins the no-load voltage value and the rated voltage value (expressed as the ratio of the amount of shift (D) at half of the rated value with respect to the full scale voltage (FS)).. Output hysteresis The ratio of the difference (D) in the noload output voltages when the is varied from no load to the rated then reduced back to no load, with respect to the full scale voltage (FS). D Offset voltage Output voltage No load / rated. Offset voltage temperature characteristic The variation of the offset voltage with changes in ambient temperature. The difference between the offset voltage at the standard temperature and the offset values at the compensation lower limit temperature (low temperature) (D) and compensation upper limit temperature (high temperature) (D) are obtained, and the offset voltage temperature characteristic is expressed as the ratio of the larger of these two differences (absolute) with respect to the full scale voltage (FS). D FS Rated Rated output voltage. Temperature sensitivity characteristic The variation of the sensitivity with changes in ambient temperature (variation in full scale (FS)). The difference between the full scale voltage at the standard temperature (FS) and the full scale values at the compensation lower limit temperature (low temperature) (FS) and compensation upper limit temperature (high temperature) (FS) are obtained, and the offset voltage temperature characteristic is expressed as the ratio of the larger of these two differences (FS - FS and FS - FS (absolute)) with respect to the full scale voltage (FS). Output voltage Compensation upper limit temperature No load Compensation lower limit temperature Standard temperature FS Rated FS FS /8
19 Glossary of Common Terms for Sensors. Bridge resistance Refers to the resistance value of a piezoresistance formed on a monolithic silicon substrate. For example, the values of the resistances R to R in the bridge are typically kω each. When the resistances of the resistive elements R to R that comprise the bridge are kω each, the equivalent composite resistance of the bridge is kω (kω bridges are also available).. Overall accuracy Accuracy of offset voltage and rated output voltage within the temperature compensation range. R R R R The bridge resistance is the resistance of the four resistive elements that make up the bridge expressed as one combined resistance. /8
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